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    • 5. 发明授权
    • Printed circuit board soldering
    • 印刷电路板焊接
    • US4360144A
    • 1982-11-23
    • US226970
    • 1981-01-21
    • William A. CuddyBasil ThirStephen E. Eisenstein
    • William A. CuddyBasil ThirStephen E. Eisenstein
    • B23K35/36H05K3/34B05D5/12B23K31/02
    • B23K35/3613H05K3/3489Y10T29/49144
    • The present invention relates to a method of wave soldering an assembly composed of a plurality of electrical conductors disposed on a surface of a sheet of insulating material. In accordance with this method, the surface of the sheet and the conductors are contacted with a stationary wave of molten solder having a polyether admixed therewith and floating on the surface thereof. The polyether is a heteric or block copolymer of a dihydroxyphenol and at least one lower alkylene oxide. It is preferred that the alkylene oxide contain 2 to 4 carbon atoms. The alkylene oxide may be all ethylene oxide or may be a mixture with other lower alkylene oxides such as propylene oxides and butylene oxides. In any event, the copolymer should contain at least about 20 percent by weight of oxyethylene groups, balance oxypropylene groups and/or oxybutylene groups. A conventional polymeric oxidation inhibitor may also be included.
    • 本发明涉及一种波峰焊接由多个设置在绝缘材料片的表面上的电导体组成的组件的方法。 根据该方法,片材的表面和导体与具有聚醚的熔融焊料的固定波接触并漂浮在其表面上。 聚醚是二羟基苯酚和至少一种低级环氧烷烃的杂环或嵌段共聚物。 环氧烷优选含有2至4个碳原子。 烯化氧可以全部是环氧乙烷,也可以是与其它低级环氧烷如环氧丙烷和环氧丁烷的混合物。 在任何情况下,共聚物应包含至少约20重量%的氧化乙烯基团,余量的氧化丙烯基团和/或氧基丁烯基团。 还可以包括常规的聚合物氧化抑制剂。