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    • 1. 发明授权
    • High brightness light emitting diode structure
    • 高亮度发光二极管结构
    • US09112117B2
    • 2015-08-18
    • US13836681
    • 2013-03-15
    • EPISTAR CORPORATION
    • Chia-Liang HsuChen OuChun-Hsiang TuDe-Shan KuoTing-Chia KoPo-Shun Chiu
    • H01L33/00H01L33/46H01L33/20H01L33/40H01L33/42H01L33/38
    • H01L33/46H01L33/002H01L33/20H01L33/38H01L33/405H01L33/42H01L2924/0002H01L2924/00
    • A light-emitting diode structure comprising: a substrate; a light-emitting semiconductor stack on the substrate, wherein the light-emitting semiconductor stack comprises a first semiconductor layer, a second semiconductor layer with different polarity from the first semiconductor layer, and a light-emitting layer between the first semiconductor layer and the second semiconductor layer; a first electrical pad on the substrate, wherein the first electrical pad is apart from the light-emitting semiconductor stack and electrically connects to the first semiconductor layer; and a second electrical pad on the substrate, wherein the second electrical pad is apart from the light-emitting semiconductor stack and electrically connects to the second semiconductor layer, wherein the first electrical pad and the second electrical pad are not higher than the light-emitting semiconductor stack.
    • 一种发光二极管结构,包括:基板; 在所述基板上的发光半导体堆叠,其中,所述发光半导体堆叠包括第一半导体层,与所述第一半导体层具有不同极性的第二半导体层,以及所述第一半导体层与所述第二半导体层之间的发光层 半导体层; 在所述基板上的第一电焊盘,其中所述第一电焊盘与所述发光半导体堆叠分离并且电连接到所述第一半导体层; 以及在所述基板上的第二电焊盘,其中所述第二电焊盘离开所述发光半导体堆叠并且电连接到所述第二半导体层,其中所述第一电焊盘和所述第二电焊盘不高于所述发光 半导体堆叠