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1. 发明授权

US10890899B2 Method of semiconductor manufacturing apparatus and non-transitory computer-readable storage medium storing a program of causing computer to execute design method of semiconductor manufacturing apparatus 有权
公开(公告)号：US10890899B2
公开(公告)日：2021-01-12
申请号：US16207678
申请日：2018-12-03
申请人： Ebara Corporation
发明人： Ryuichiro Mitani , Mitsunori Sugiyama , Akihiko Ogawa
IPC分类号： G05B19/418 , G06F30/30 , G06F119/18
摘要： A design method of a semiconductor manufacturing apparatus which can satisfy a specification required by a user is disclosed. The design method of the semiconductor manufacturing apparatus includes creating a program setting file; creating a program installer from the program setting file; operating a processing unit of the semiconductor manufacturing apparatus; specifying a sensor corresponding to the processing unit based on the operation of the processing unit; creating a sensor setting file storing information obtained by specifying the sensor; comparing a content of a requirement specification and a content of the sensor setting file to confirm a consistency between the content of the requirement specification and the content of the sensor setting file; and introducing a program into a memory of a controller by the program installer when the content of the requirement specification and the content of the sensor setting file are consistent with each other.

2. 发明授权

US11667007B2 Polishing apparatus and polishing method 有权
公开(公告)号：US11667007B2
公开(公告)日：2023-06-06
申请号：US16162914
申请日：2018-10-17
申请人： EBARA CORPORATION
发明人： Mitsunori Sugiyama , Taro Takahashi , Yoichi Kobayashi
IPC分类号： B24B37/013 , B24B37/12 , B24B49/12 , B24B57/02 , B24B49/08 , B24B37/10 , B24B37/20 , B24B27/00 , H01L21/306
CPC分类号： B24B37/013 , B24B27/0023 , B24B37/105 , B24B37/12 , B24B37/205 , B24B49/08 , B24B49/12 , B24B57/02 , H01L21/30625
摘要： A polishing table holds a polishing pad. A top ring holds a semiconductor wafer. A swing arm holds the top ring. The swing arm swings around a swing center on the swing arm during polishing. An optical sensor is disposed on the polishing table and measures an optical characteristic changeable in accordance with a variation in film thickness of the semiconductor wafer. A fluid supply control apparatus determines a distance from an axis of rotation to the optical sensor when the semiconductor wafer is rotated by the top ring. An end point detection section detects a polishing end point indicating an end of polishing based on the optical characteristic measured by the optical sensor and the determined distance.

3. 发明授权

US10317890B2 Failure detection apparatus for substrate processing apparatus, and substrate processing apparatus 有权
公开(公告)号：US10317890B2
公开(公告)日：2019-06-11
申请号：US14597214
申请日：2015-01-14
申请人： EBARA CORPORATION
发明人： Mitsunori Sugiyama , Masafumi Inoue
IPC分类号： G05B23/02 , G05B19/418
摘要： The present invention improves the accuracy of detecting abnormality in a substrate processing apparatus. A failure detection apparatus 520 is provided with a data acquisition part 522 used to collect data detected by sensors 270-1 to 270-a, 370-1 to 370-b and 470-1 to 470-c disposed in a CMP apparatus. In addition, the failure detection apparatus 520 is provided with a determination part 524 used to read recipe data from a recipe storage part 512, to compare the recipe data thus read with the data collected by a data acquisition part 522, thereby determining that abnormality is present in the CMP apparatus if the two data items differ.

4. 发明申请

US20150204711A1 CALIBRATION DEVICE AND SUBSTRATE TREATMENT DEVICE 审中-公开
标题翻译：校准装置和基板处理装置
公开(公告)号：US20150204711A1
公开(公告)日：2015-07-23
申请号：US14594629
申请日：2015-01-12
申请人： Ebara Corporation
发明人： Mitsunori Sugiyama
IPC分类号： G01F25/00 , B24B49/08 , B24B37/34
CPC分类号： G01F25/0007 , B24B37/345 , B24B49/08
摘要： The adjustment section 524 adjusts the correction value by which raw data detected by a measuring instrument provided in a CMP device is corrected to obtain a measured value. The interface section 522 transmits, to the CMP device, a set value used when the correction value is adjusted and an operating instruction based on the set value, and receives a measured value obtained by correcting raw data detected by the measuring instrument based on the correction value while the CMP device operates according to the operating instruction. The adjustment section 524 adjusts the correction value based on the measured value received by the interface section 522 and the set value used when the correction value is adjusted.
摘要翻译：调整部524调整由修正了由CMP装置中设置的测量仪器检测出的原始数据以获得测量值的校正值。接口部522向CMP装置发送调整校正值时使用的设定值和基于设定值的操作指示，并且接收通过校正基于校正而由测量仪器检测的原始数据而获得的测量值当CMP器件根据操作指令进行工作时的值。调整部524基于由接口部522接收到的测量值和调整校正值时使用的设定值来调整校正值。

5. 发明授权

US09904280B2 Substrate treatment apparatus and control device 有权
公开(公告)号：US09904280B2
公开(公告)日：2018-02-27
申请号：US14590931
申请日：2015-01-06
申请人： EBARA CORPORATION
发明人： Mitsunori Sugiyama
IPC分类号： G06F19/00 , G05B19/418
CPC分类号： G05B19/418 , G05B2219/45031 , Y02P90/02
摘要： The present invention efficiently executes a plurality of functions of a substrate treatment apparatus. A control device 5 includes: a plurality of software applications (interface-related APSW 510 and control-related APSW 520) configured to execute each function of treatments concerning a CMP apparatus; and a shared memory 540 which stores information that is used in the plurality of software applications therein. The plurality of software applications include a task monitoring software application 530 which monitors whether abnormality has occurred in the plurality of software applications or not. The task monitoring software application 530 restarts the software application in which the abnormality has occurred, when the abnormality has occurred in any of the plurality of software applications, and makes the other software applications continue the respective processes.

6. 发明授权

US09737973B2 Substrate processing apparatus 有权
公开(公告)号：US09737973B2
公开(公告)日：2017-08-22
申请号：US14682774
申请日：2015-04-09
申请人： Ebara Corporation
发明人： Mitsunori Sugiyama , Kunimasa Matsushita
IPC分类号： B24B27/00 , B24B53/007 , B24B51/00 , B24B49/00 , H01L21/67
CPC分类号： B24B53/007 , B24B27/0023 , B24B27/0069 , B24B27/0076 , B24B49/00 , B24B51/00 , H01L21/67219
摘要： A CMP apparatus includes a polishing unit 3, a cleaning unit 4, a load/unload unit 2, a transfer unit, and a control section 5 configured to control transfer of a substrate in the transfer unit. When the polishing unit includes a plurality of polishing sections, or the cleaning unit includes a plurality of cleaning sections, the control section 5 can set a test mode that operates the polishing section or the cleaning section for a test to some of the plurality of polishing sections, or some of the plurality of cleaning sections, causes a substrate to be transferred to the polishing section or the cleaning section to which the test mode is not set, and causes a test substrate different from the substrate to be transferred to the polishing section or the cleaning section to which the test mode is set.

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