专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US10926376B2 Method and apparatus for polishing a substrate, and method for processing a substrate 有权
公开(公告)号：US10926376B2
公开(公告)日：2021-02-23
申请号：US16003779
申请日：2018-06-08
申请人： Ebara Corporation
发明人： Masayuki Nakanishi , Yu Ishii , Kenya Ito , Keisuke Uchiyama , Makoto Kashiwagi
IPC分类号： B24B55/12 , B24B21/00 , B24B41/06 , B24B47/12 , B24D11/02 , B24B21/08 , B24B7/22
摘要： A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.

2. 发明申请

US20200023490A1 POLISHING APPARATUS AND POLISHING METHOD FOR POLISHING A PERIPHERY OF A SUBSTRATE 审中-公开
公开(公告)号：US20200023490A1
公开(公告)日：2020-01-23
申请号：US16455326
申请日：2019-06-27
申请人： EBARA CORPORATION
发明人： Masayuki Nakanishi , Kenji Kodera
IPC分类号： B24B51/00 , B24B9/06
摘要： A polishing apparatus capable of accurately detecting a polishing end point of a periphery of a substrate, such as a wafer, is disclosed. The polishing apparatus includes a polishing head configured to press a polishing tool against the periphery of the substrate on a substrate holding surface. The polishing head includes a pressing member configured to press the polishing tool against the periphery of the substrate, and a shear-force detection sensor configured to detect a shear force acting on the pressing member and output an index value indicating a magnitude of the shear force. An operation controller has a memory storing a program configured to determine a polishing end point at which the index value reaches a threshold value, and a processer configured to execute the program.

3. 外观设计

USD851141S1 Pressing member for substrate polishing apparatus 有权
公开(公告)号：USD851141S1
公开(公告)日：2019-06-11
申请号：US29659970
申请日：2018-08-14
申请人： EBARA CORPORATION
设计人： Kenji Kamimura , Masayuki Nakanishi , Satoru Yamamoto , Yasuyuki Miyasawa , Kenji Kodera
摘要： FIG. 1 is a first perspective view, observed from a front of a pressing member for a substrate polishing apparatus showing our new design;
FIG. 2 is a second perspective view, observed from a rear thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a top view thereof;
FIG. 6 is a bottom view thereof; and,
FIG. 7 is a right-side view thereof, a left-side view being a mirror image thereof.

4. 发明授权

US08748289B2 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08748289B2
公开(公告)日：2014-06-10
申请号：US13868500
申请日：2013-04-23
申请人： Ebara Corporation
发明人： Masayuki Nakanishi , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
IPC分类号： H01L21/66 , H01L21/30 , H01L21/46 , H01L21/00
CPC分类号： H01L21/02038 , B24B9/065 , B24B21/002 , B24B37/042 , H01L21/02087 , H01L21/304 , H01L21/76256
摘要： A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon. A second polishing tape is pressed against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.
摘要翻译：一种制造半导体器件的方法使得可以在抛光条件下，在特别适用于沉积膜的抛光条件和沉积膜下面的硅的抛光条件下，用研磨带有效地抛光硅衬底的周边部分。该方法包括在第一旋转速度旋转器件基板的同时将第一研磨带压靠在具有沉积膜的器件基板的周边部分上，同时以第一转速旋转器件基板，从而去除位于器件基板的周边部分中的沉积膜，暴露下面的硅。在第二旋转速度旋转器件基板的同时，将第二研磨带压在位于器件基板的周边部分中的暴露的硅上，从而将硅抛光到预定的深度。

5. 发明授权

US11865665B2 Polishing apparatus 有权
公开(公告)号：US11865665B2
公开(公告)日：2024-01-09
申请号：US16163070
申请日：2018-10-17
申请人： EBARA CORPORATION
发明人： Kenichi Kobayashi , Masayuki Nakanishi , Makoto Kashiwagi , Manao Hoshina
IPC分类号： H01L21/02 , H01L21/67 , B24B37/005 , H01L21/687 , B24B21/00 , B24B37/04 , B24B21/10 , B24B37/30 , B24B41/06 , B24B7/22 , B24B37/10
CPC分类号： B24B37/042 , B24B7/228 , B24B21/004 , B24B21/008 , B24B21/10 , B24B37/005 , B24B37/105 , B24B37/30 , B24B41/067 , H01L21/0209 , H01L21/67034 , H01L21/67051 , H01L21/68728 , H01L21/68742 , H01L21/68764
摘要： A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.

6. 发明授权

US10854473B2 Polishing method, polishing apparatus, and substrate processing system 有权
公开(公告)号：US10854473B2
公开(公告)日：2020-12-01
申请号：US15909758
申请日：2018-03-01
申请人： EBARA CORPORATION
发明人： Yu Ishii , Kenya Ito , Keisuke Uchiyama , Masayuki Nakanishi
IPC分类号： H01L21/461 , H01L21/68 , B24B37/10 , B24B37/005 , G06F9/06 , H01L21/02
摘要： A polishing method capable of polishing a substrate, such as a wafer, with low running costs is disclosed. A polishing method includes: rotating a substrate while holding a back-side surface of the substrate with a vacuum suction stage; rotating a polishing head holding a plurality of polishing tools; and polishing a front-side surface of the substrate by pressing the plurality of polishing tools, which are rotating, against the front-side surface of the substrate. The front-side surface is a surface on which interconnect patterns are to be formed.

7. 发明申请

US20190385834A1 SUBSTRATE PROCESSING METHOD 审中-公开
公开(公告)号：US20190385834A1
公开(公告)日：2019-12-19
申请号：US16432315
申请日：2019-06-05
申请人： EBARA CORPORATION
发明人： Masayuki Nakanishi , Satoru Yamamoto , Kenji Kodera
IPC分类号： H01L21/02 , B24B9/06 , H01L21/304
摘要： A substrate processing method capable of preventing an adherence of a foreign matter to a substrate is disclosed. The substrate processing method comprises: a substrate rotating step of rotating a substrate W while holding the substrate W; a first-liquid upper supply step of supplying a first liquid onto an upper surface of the substrate W while rotating the substrate W; a polishing step of pressing a polishing tape 23 to the substrate W while supplying the first liquid in a state of rotating the substrate W; a second-liquid upper supply step of supplying a second liquid onto the upper surface of the substrate W while rotating the substrate W; and a cleaning step of pressing a cleaning tape 29 to the substrate W while supplying the second liquid in a state of rotating the substrate W and terminating after the polishing step is terminated. The second liquid is either of a conducting water, a surfactant solution, or ozone water.

8. 外观设计

USD851142S1 Pressing member for substrate polishing apparatus 有权
公开(公告)号：USD851142S1
公开(公告)日：2019-06-11
申请号：US29659981
申请日：2018-08-14
申请人： EBARA CORPORATION
设计人： Kenji Kamimura , Masayuki Nakanishi , Satoru Yamamoto , Yasuyuki Miyasawa , Kenji Kodera
摘要： FIG. 1 is a first perspective view, observed from a front of a pressing member for a substrate polishing apparatus showing our new design;
FIG. 2 is a second perspective view, observed from a rear thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a top view thereof;
FIG. 6 is a bottom view thereof; and,
FIG. 7 is a right-side view thereof, a left-side view being a mirror image thereof.

9. 外观设计

USD851140S1 Pressing member for substrate polishing apparatus 有权
公开(公告)号：USD851140S1
公开(公告)日：2019-06-11
申请号：US29659963
申请日：2018-08-14
申请人： EBARA CORPORATION
设计人： Kenji Kamimura , Masayuki Nakanishi , Satoru Yamamoto , Yasuyuki Miyasawa , Kenji Kodera
摘要： FIG. 1 is a first perspective view, observed from a front of a pressing member for a substrate polishing apparatus showing our new design;
FIG. 2 is a second perspective view, observed from a rear thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a top view thereof;
FIG. 6 is a bottom view thereof; and,
FIG. 7 is a right-side view thereof, a left-side view being a mirror image thereof.

10. 发明授权

US09517544B2 Polishing apparatus and polishing method 有权
公开(公告)号：US09517544B2
公开(公告)日：2016-12-13
申请号：US14577101
申请日：2014-12-19
申请人： EBARA CORPORATION
发明人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenji Yamaguchi , Masayuki Nakanishi
IPC分类号： B24B21/00 , B24B9/06 , B24B37/04 , B24B37/30 , B24B21/20 , B24B27/00 , B24B41/06 , B24B49/00
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/008 , B24B21/20 , B24B27/0076 , B24B37/042 , B24B37/30 , B24B41/068 , B24B49/00 , Y10T428/24777
摘要： A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式