专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US11906299B2 Plating apparatus and film thickness measuring method for substrate 有权
公开(公告)号：US11906299B2
公开(公告)日：2024-02-20
申请号：US17616906
申请日：2021-01-20
申请人： EBARA CORPORATION
发明人： Masaya Seki , Masaki Tomita , Shao Hua Chang
IPC分类号： G01B7/06 , C25D17/00 , C25D17/02 , C25D17/10 , C25D21/14 , G01R15/12 , G01R15/18 , C25D5/00
CPC分类号： G01B7/06 , C25D5/007 , C25D17/005 , C25D17/02 , C25D17/10 , C25D21/14 , G01R15/12 , G01R15/181
摘要： Provided is a technique that allows measuring a film thickness of a substrate in a plating process.
A plating apparatus 1000 includes a plating tank 10, a substrate holder 20, a rotation mechanism 30, a plurality of contact members 50, a coil 60, a current sensor 65, and a film thickness measuring device 70. The plurality of contact members 50 are disposed in a substrate holder and arranged in a circumferential direction of the substrate holder. The plurality of contact members 50 contact an outer peripheral edge of a lower surface of a substrate to supply electricity to the substrate in the plating process. The coil 60 generates a current by an electromagnetic induction due to a magnetic field generated by a current flowing into the contact member, the contact member being rotate together with the substrate holder in the plating process. The current sensor 65 detects the current generated in the coil. The film thickness measuring device 70 measures a film thickness of the substrate based on the current detected by the current sensor in the plating process.

2. 发明授权

US11833551B2 Pre-wet module, deaerated liquid circulation system, and pre-wet method 有权
公开(公告)号：US11833551B2
公开(公告)日：2023-12-05
申请号：US17839070
申请日：2022-06-13
申请人： EBARA CORPORATION
发明人： Masaya Seki , Mitsutoshi Yahagi , Nobuya Yamada
IPC分类号： B08B3/02 , C23C18/16 , C23C18/18 , H01L21/687
CPC分类号： B08B3/022 , C23C18/163 , C23C18/18 , H01L21/68764
摘要： A preprocess is efficiently performed on a substrate. A pre-wet module 200 includes a deaeration tank 210, a processing device 258, a substrate holder 220, and a drive mechanism 230. The deaeration tank 210 is configured to house a deaerated liquid. The processing device 258 includes a nozzle 268 configured to supply a cleaning liquid to a surface to be processed of a substrate having the surface to be processed facing upward. The substrate holder 220 is disposed between the deaeration tank 210 and the processing device 258. The substrate holder 220 includes a first holding member 222 configured to hold a first substrate and a second holding member 224 configured to hold a second substrate. The drive mechanism 230 is configured to rotate and move up and down the substrate holder 220. The drive mechanism 230 includes a rotation mechanism 240 and an elevating mechanism 248. The rotation mechanism 240 is configured to rotate the substrate holder 220 between a first state where a surface to be processed of the first substrate is opposed to a deaerated liquid in the deaeration tank 210 and a second state where a surface to be processed of the second substrate is opposed to the deaerated liquid in the deaeration tank. The elevating mechanism 248 is configured to move up and down the substrate holder 220.

3. 发明授权

US10403505B2 Substrate processing method and substrate processing apparatus 有权
公开(公告)号：US10403505B2
公开(公告)日：2019-09-03
申请号：US15701206
申请日：2017-09-11
申请人： EBARA CORPORATION
发明人： Kenya Ito , Masaya Seki , Kenichi Kobayashi , Michiyoshi Yamashita
IPC分类号： H01L21/304 , B23K26/08 , B24B37/00 , H01L21/02 , H01L21/67 , B24B21/00 , B24B21/08 , B24B9/06 , B23K101/40
摘要： A method and an apparatus for processing a peripheral portion of a substrate, such as a wafer, are disclosed. The substrate processing method includes: holding a substrate on a substrate stage; rotating the substrate stage and the substrate about an axis of the substrate stage; directing a laser beam to an edge portion of the rotating substrate to form an annular crack in the substrate; and pressing a polishing tool against the edge portion of the rotating substrate to form a stepped recess in a peripheral portion of the substrate.

4. 发明授权

US09782869B2 Apparatus for detecting abnormality in polishing of a substrate 有权
公开(公告)号：US09782869B2
公开(公告)日：2017-10-10
申请号：US14987434
申请日：2016-01-04
申请人： EBARA CORPORATION
发明人： Tetsuji Togawa , Masaya Seki , Hiroyuki Takenaka
IPC分类号： B24B37/00 , B24B37/005 , B24B9/06 , B24B21/00
CPC分类号： B24B37/005 , B24B9/065 , B24B21/002
摘要： Detection of an abnormality in polishing of a substrate is provided. A measuring device measures a position of the polishing tool relative to a surface of the substrate. A controller determines an amount of polishing of the substrate from the position of the polishing tool; calculates a polishing rate from the amount of polishing of the substrate; and judges that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range exceeds a predetermined threshold value.

5. 发明授权

US09561573B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US09561573B2
公开(公告)日：2017-02-07
申请号：US14167129
申请日：2014-01-29
申请人： EBARA CORPORATION
发明人： Masaya Seki , Tetsuji Togawa
IPC分类号： B24B1/00 , B24B21/00 , B24B9/06 , B24B21/18
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/18
摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer. The polishing apparatus includes a substrate holder to hold a substrate and to rotate the substrate, a pressing member configured to press a polishing tool against the substrate and to polish the substrate, a pressing force control mechanism configured to control a pressing force of the pressing member, and a polishing position limiting mechanism configured to limit a polishing position of the pressing member. A polishing tape or a fixed abrasive is used as the polishing tool.
摘要翻译：抛光装置用于抛光诸如半导体晶片的基板。抛光装置包括用于保持基板并旋转基板的基板保持件，构造成将抛光工具压靠在基板上并对基板进行抛光的按压部件，被配置为控制按压部件的按压力的按压力控制机构以及配置为限制按压部件的研磨位置的抛光位置限制机构。抛光带或固定磨料用作抛光工具。

6. 发明申请

US20150258653A1 POLISHING APPARATUS AND POLISHING METHOD 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：US20150258653A1
公开(公告)日：2015-09-17
申请号：US14643529
申请日：2015-03-10
申请人： Ebara Corporation
发明人： Masaya Seki , Tetsuji Togawa , Kenya Ito
IPC分类号： B24B21/00 , H01L21/304 , B24B49/00
CPC分类号： B24B21/002 , B24B9/065 , B24B21/00 , B24B21/004 , B24B21/02 , B24B27/0076 , B24B49/00 , B24B49/12
摘要： A polishing unit of a polishing apparatus according to an embodiment includes: a polishing head having a pressing member configured to hold a polishing tape and press the polishing tape against a peripheral portion of a substrate from above; a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and recover the polishing tape from the polishing head; a first moving mechanism configured to move the polishing head in a radial direction of the substrate; and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The positioning unit includes a positioning block having a contacting surface, and alignment of the polishing tape is conducted by the second moving mechanism moving the tape supply and recovery mechanism so that a substrate-side edge of the polishing tape makes contact with the contacting surface.
摘要翻译：根据实施例的抛光装置的抛光单元包括：抛光头，其具有构造成保持研磨带的按压构件，并且从上方将研磨带压靠在基板的周边部分; 磁带供给和恢复机构，被配置为将抛光带提供到抛光头并从抛光头回收抛光带; 第一移动机构，其构造成在所述基板的径向方向上移动所述抛光头; 以及第二移动机构，其构造成沿着所述基板的径向方向移动所述带供给和恢复机构。定位单元包括具有接触表面的定位块，并且通过移动带供应和恢复机构的第二移动机构来导引研磨带的对准，使得研磨带的基板侧边缘与接触表面接触。

7. 发明授权

US08748289B2 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08748289B2
公开(公告)日：2014-06-10
申请号：US13868500
申请日：2013-04-23
申请人： Ebara Corporation
发明人： Masayuki Nakanishi , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
IPC分类号： H01L21/66 , H01L21/30 , H01L21/46 , H01L21/00
CPC分类号： H01L21/02038 , B24B9/065 , B24B21/002 , B24B37/042 , H01L21/02087 , H01L21/304 , H01L21/76256
摘要： A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon. A second polishing tape is pressed against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.
摘要翻译：一种制造半导体器件的方法使得可以在抛光条件下，在特别适用于沉积膜的抛光条件和沉积膜下面的硅的抛光条件下，用研磨带有效地抛光硅衬底的周边部分。该方法包括在第一旋转速度旋转器件基板的同时将第一研磨带压靠在具有沉积膜的器件基板的周边部分上，同时以第一转速旋转器件基板，从而去除位于器件基板的周边部分中的沉积膜，暴露下面的硅。在第二旋转速度旋转器件基板的同时，将第二研磨带压在位于器件基板的周边部分中的暴露的硅上，从而将硅抛光到预定的深度。

8. 发明授权

US12076760B2 Pre-wet module, deaerated liquid circulation system, and pre-wet method 有权
公开(公告)号：US12076760B2
公开(公告)日：2024-09-03
申请号：US18494501
申请日：2023-10-25
申请人： EBARA CORPORATION
发明人： Masaya Seki , Mitsutoshi Yahagi , Nobuya Yamada
IPC分类号： B08B3/02 , C23C18/16 , C23C18/18 , H01L21/687
CPC分类号： B08B3/022 , C23C18/163 , C23C18/18 , H01L21/68764
摘要： A preprocess is efficiently performed on a substrate. A pre-wet module 200 includes a deaeration tank 210, a processing device 258, a substrate holder 220, and a drive mechanism 230. The deaeration tank 210 is configured to house a deaerated liquid. The processing device 258 includes a nozzle 268 configured to supply a cleaning liquid to a surface to be processed of a substrate having the surface to be processed facing upward. The substrate holder 220 is disposed between the deaeration tank 210 and the processing device 258. The substrate holder 220 includes a first holding member 222 configured to hold a first substrate and a second holding member 224 configured to hold a second substrate. The drive mechanism 230 is configured to rotate and move up and down the substrate holder 220. The drive mechanism 230 includes a rotation mechanism 240 and an elevating mechanism 248. The rotation mechanism 240 is configured to rotate the substrate holder 220 between a first state where a surface to be processed of the first substrate is opposed to a deaerated liquid in the deaeration tank 210 and a second state where a surface to be processed of the second substrate is opposed to the deaerated liquid in the deaeration tank. The elevating mechanism 248 is configured to move up and down the substrate holder 220.

9. 发明授权

US12054840B2 Plating apparatus, pre-wet process method, and cleaning process method 有权
公开(公告)号：US12054840B2
公开(公告)日：2024-08-06
申请号：US17612024
申请日：2020-12-22
申请人： EBARA CORPORATION
发明人： Shao Hua Chang , Masaya Seki
IPC分类号： C25D21/08 , C25D5/08 , C25D5/48 , C25D17/06
CPC分类号： C25D21/08 , C25D5/08 , C25D5/48 , C25D17/06
摘要： Provided is a technique that allows ensuring a downsized plating apparatus.
A plating apparatus includes a discharge module 50. The discharge module includes a module main body 51 including a plurality of nozzles 52 configured to discharge a process liquid upward, and a moving mechanism 60 including a rotation shaft 61 disposed at a side of a plating tank and connected to the module main body. The moving mechanism 60 moves the module main body by rotation of the rotation shaft. The moving mechanism moves the module main body between the first position and the second position. The plurality of nozzles are arranged such that the process liquid discharged from the plurality of nozzles is brought in contact with a lower surface of a substrate from a center portion to an outer peripheral edge portion when the module main body moves to the second position. The module main body further includes a recovery member configured to recover the process liquid dropped after being discharged from the plurality of nozzles and brought in contact with the lower surface of the substrate.

10. 发明申请

US20220364255A1 PLATING APPARATUS AND SUBSTRATE HOLDER OPERATION METHOD 有权
公开(公告)号：US20220364255A1
公开(公告)日：2022-11-17
申请号：US17442323
申请日：2020-12-09
申请人： EBARA CORPORATION
发明人： Masaki Tomita , Masaya Seki
IPC分类号： C25D17/06 , C25D7/12 , C25D21/12
摘要： A plating module includes: a plating tank, a substrate holder, and an elevating mechanism. The plating tank is for housing a plating solution. The substrate holder is for holding a substrate with a surface to be plated facing downward. The elevating mechanism is for moving up and down the substrate holder. The substrate holder includes: a supporting mechanism, a floating plate, a floating mechanism, and a pushing mechanism. The supporting mechanism is for supporting an outer peripheral portion of the surface of the substrate. The floating plate is arranged on a back surface side of the substrate. The floating mechanism is for biasing the floating plate to a direction away from a back surface of the substrate. The pushing mechanism is for pressing the floating plate to the back surface of the substrate against a biasing force to the substrate by the floating mechanism.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式