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    • 4. 发明授权
    • Double-gated sensor cell
    • 双门传感器单元
    • US08072006B1
    • 2011-12-06
    • US11306292
    • 2005-12-21
    • Douglas R. Hackler, Sr.Richard A. HayhurstStephen A. Parke
    • Douglas R. Hackler, Sr.Richard A. HayhurstStephen A. Parke
    • H01L29/76
    • H01L27/14689
    • A high quality imager is constructed using a silicon-on-insulator (SOI) process with sensors fabricated in the SOI substrate and isolated by the buried oxide (BOX) from associated readout circuitry in the SOI layer. Handle windows are opened in the SOI device layer for fabrication of the sensors in the handle layer substrate and then closed prior to processing in the device layer. By keeping the buried oxide layer intact, the described technique allows for independent processing of sensors and readout circuitry so that each is optimized with regard to thermal and dopant properties without concern for degradation of the other. The process is compatible with the fabrication of readout circuitry using transistors having independent double-gates, which offer simultaneous advantages in scalability, low power and low noise. Photodiode sensors are shown with allowance for many other types of sensors. The process easily accommodates hardening against radiation.
    • 使用在SOI衬底中制造的传感器并通过SOI层中的相关读出电路的掩埋氧化物(BOX)隔离的传感器来构建使用绝缘体上硅(SOI)工艺的高质量成像器。 处理窗在SOI器件层中打开,用于制造处理层衬底中的传感器,然后在器件层中处理之前封闭。 通过保持掩埋氧化物层的完整性,所描述的技术允许传感器和读出电路的独立处理,使得每个都相对于热和掺杂剂性质而优化,而不考虑另一个的劣化。 该过程与使用具有独立双栅极的晶体管的读出电路的制造兼容,其提供可扩展性,低功率和低噪声的同时优势。 显示光电二极管传感器,允许许多其他类型的传感器。 该过程容易适应辐射硬化。
    • 7. 发明授权
    • Independently-double-gated transistor memory (IDGM)
    • 独立双门控晶体管存储器(IDGM)
    • US07898009B2
    • 2011-03-01
    • US11678026
    • 2007-02-22
    • Dale G. WilsonKelly James DeGregorioStephen A. ParkeDouglas R. Hackler, Sr.
    • Dale G. WilsonKelly James DeGregorioStephen A. ParkeDouglas R. Hackler, Sr.
    • H01L29/80
    • H01L27/1203G11C11/22G11C11/223H01L27/11585
    • Memory cells are constructed from double-gated four terminal transistors having independent gate control. DRAM cells may use one, two or three transistors. Single transistor cells are constructed either with or without a bit storage capacitor, and both NAND- and NOR-type Non-Volatile NVRAM cells, as well as Ferroelectric FeRAM cells, are described. For all cells, top gates provide conventional access while independent bottom gates provide control to optimize memory retention for given speed and power parameters as well as to accommodate hardening against radiation. In a single transistor cell without a capacitor, use of the bottom gate allows packing to a density approaching 2 F2. Using a ferroelectric material as the gate insulator produces a single-transistor FeRAM cell that overcomes the industry-wide Write Disturb problem. The memory cells are compatible with SOI logic circuitry for use as embedded RAM in SOC applications.
    • 存储单元由具有独立门控制的双门控四端子晶体管构成。 DRAM单元可以使用一个,两个或三个晶体管。 单晶体管单元被构造为具有或不具有位存储电容器,并且描述NAND和NOR型非易失性NVRAM单元以及铁电FeRAM单元。 对于所有电池,顶门提供常规接入,而独立的底栅提供控制以优化给定速度和功率参数的存储器保持以及适应对辐射的硬化。 在没有电容器的单个晶体管电池中,使用底部栅极可以将密封包装到接近2 F2的密度。 使用铁电材料作为栅极绝缘体产生单晶体管FeRAM单元,其克服了行业范围的写入干扰问题。 存储单元与SOI逻辑电路兼容,用作SOC应用中的嵌入式RAM。
    • 9. 发明申请
    • Independently-Double-Gated Transistor Memory (IDGM)
    • 独立双门限晶体管内存(IDGM)
    • US20080203443A1
    • 2008-08-28
    • US11678026
    • 2007-02-22
    • Dale G. WilsonKelly J. DeGregorioStephen A. ParkeDouglas R. Hackler
    • Dale G. WilsonKelly J. DeGregorioStephen A. ParkeDouglas R. Hackler
    • H01L27/108
    • H01L27/1203G11C11/22G11C11/223H01L27/11585
    • Memory cells are constructed from double-gated four terminal transistors having independent gate control. DRAM cells may use one, two or three transistors. Single transistor cells are constructed either with or without a bit storage capacitor, and both NAND- and NOR-type Non-Volatile NVRAM cells, as well as Ferroelectric FeRAM cells, are described. For all cells, top gates provide conventional access while independent bottom gates provide control to optimize memory retention for given speed and power parameters as well as to accommodate hardening against radiation. In a single transistor cell without a capacitor, use of the bottom gate allows packing to a density approaching 2 F2. Using a ferroelectric material as the gate insulator produces a single-transistor FeRAM cell that overcomes the industry-wide Write Disturb problem. The memory cells are compatible with SOI logic circuitry for use as embedded RAM in SOC applications.
    • 存储单元由具有独立门控制的双门控四端子晶体管构成。 DRAM单元可以使用一个,两个或三个晶体管。 单晶体管单元被构造为具有或不具有位存储电容器,并且描述NAND和NOR型非易失性NVRAM单元以及铁电FeRAM单元。 对于所有电池,顶门提供常规接入,而独立的底栅提供控制以优化给定速度和功率参数的存储器保持以及适应对辐射的硬化。 在没有电容器的单个晶体管电池中,使用底部栅极可使封装密度接近2F 2。 使用铁电材料作为栅极绝缘体产生单晶体管FeRAM单元,其克服了行业范围的写入干扰问题。 存储单元与SOI逻辑电路兼容,用作SOC应用中的嵌入式RAM。