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1. 发明申请

US20170179070A1 THERMOCOMPRESSION BONDING USING PLASMA GAS 审中-公开
公开(公告)号：US20170179070A1
公开(公告)日：2017-06-22
申请号：US14974823
申请日：2015-12-18
申请人： Donglai David Lu , Jimin Yao , Amrita Mallik , George S. Kostiew , Shawna M. Liff
发明人： Donglai David Lu , Jimin Yao , Amrita Mallik , George S. Kostiew , Shawna M. Liff
IPC分类号： H01L23/00
CPC分类号： H01L24/81 , H01L24/13 , H01L24/75 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/7501 , H01L2224/75101 , H01L2224/7525 , H01L2224/753 , H01L2224/75901 , H01L2224/7592 , H01L2224/75981 , H01L2224/81013 , H01L2224/81193 , H01L2224/81203 , H01L2224/81801 , H01L2924/00015 , H01L2924/01001 , H01L2924/01002 , H01L2924/01007 , H01L2924/0101 , H01L2924/01018 , H01L2924/01036 , H01L2924/01054 , H01L2924/00012 , H01L2924/00014 , H01L2224/81011 , H01L2224/81024 , H01L2924/014
摘要： Described herein are devices and techniques for thermocompression bonding. A device can include a housing, a platform, and a plasma jet. The housing can define a chamber. The platform can be located within the chamber and can be proximate a thermocompression chip bonder. The plasma jet can be located proximate the platform. The plasma jet can be movable about the platform. The plasma jet can include a nozzle arranged to direct a plasma gas onto the platform. Also described are other embodiments for thermocompression bonding.

2. 发明申请

US20140314111A1 THERMAL MANAGEMENT IN PACKAGED VCSELS 有权
标题翻译：包装VCSELS中的热管理
公开(公告)号：US20140314111A1
公开(公告)日：2014-10-23
申请号：US13698453
申请日：2011-11-18
申请人： Feras Eid , Shawna M. Liff , Henning Braunisch
发明人： Feras Eid , Shawna M. Liff , Henning Braunisch
IPC分类号： H01S5/024
CPC分类号： H01S5/02476 , H01S5/02236 , H01S5/183 , H01S5/423
摘要： Heat management systems for vertical cavity surface emitting laser (VCSEL) chips are provided. Embodiments of the invention provide substrates having, a vertical cavity surface emitting laser chip disposed on the substrate surface and electrically interconnected with the substrate, a thermal frame disposed on the substrate surface and proximate to at least three sides of the vertical cavity surface emitting laser chip, and a thermal interface material disposed between the at least three sides of the vertical cavity surface emitting laser chip and the thermal frame. The substrate can also include a transceiver chip that is operably coupled to a further integrated circuit chip and that is capable of driving the VCSEL chip.
摘要翻译：提供了垂直腔表面发射激光（VCSEL）芯片的热管理系统。本发明的实施例提供了具有设置在衬底表面上并与衬底电互连的垂直腔表面发射激光器芯片的衬底，设置在衬底表面上并且靠近垂直腔表面发射激光器芯片的至少三个侧面的热框架以及设置在垂直腔表面发射激光芯片和热框架的至少三个侧面之间的热界面材料。衬底还可以包括可操作地耦合到另一集成电路芯片并且能够驱动VCSEL芯片的收发器芯片。

3. 发明申请

US20140293529A1 Method Apparatus and Material for Radio Frequency Passives and Antennas 有权
标题翻译：射频无源和天线的方法装置和材料
公开(公告)号：US20140293529A1
公开(公告)日：2014-10-02
申请号：US13853977
申请日：2013-03-29
申请人： Vijay K. Nair , Chuan Hu , Shawna M. Liff , Larry E. Mosley
发明人： Vijay K. Nair , Chuan Hu , Shawna M. Liff , Larry E. Mosley
IPC分类号： H01Q1/22 , H01L23/04 , G06F1/16
CPC分类号： H01Q7/06 , G06F1/16 , H01F1/0054 , H01L21/565 , H01L21/568 , H01L23/295 , H01L23/3121 , H01L23/3128 , H01L23/66 , H01L24/17 , H01L24/19 , H01L24/96 , H01L2223/6672 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/16227 , H01L2224/24137 , H01L2224/24195 , H01L2924/01029 , H01L2924/05442 , H01L2924/12042 , H01L2924/1421 , H01L2924/15311 , H01L2924/15321 , H01L2924/181 , H01L2924/186 , H01L2924/19011 , H01L2924/19042 , H01L2924/19102 , H01L2924/19105 , H01Q1/2283 , H01Q1/2291 , H01Q23/00 , H01L2924/00
摘要： A method apparatus and material are described for radio frequency passives and antennas. In one example, an electronic component has a synthesized magnetic nanocomposite material with aligned magnetic domains, a conductor embedded within the nanocomposite material, and contact pads extending through the nanocomposite material to connect to the conductor.
摘要翻译：无线电频率无源和天线描述了一种方法装置和材料。在一个示例中，电子部件具有具有对准磁畴的合成磁性纳米复合材料，嵌入在纳米复合材料内的导体以及延伸穿过纳米复合材料以连接到导体的接触垫。

4. 发明申请

US20140177158A1 THERMAL MATCHED COMPOSITE DIE 有权
标题翻译：热配合复合材料
公开(公告)号：US20140177158A1
公开(公告)日：2014-06-26
申请号：US13725356
申请日：2012-12-21
申请人： Aleksandar Aleksov , Shawna M. Liff
发明人： Aleksandar Aleksov , Shawna M. Liff
IPC分类号： H01L23/00 , G06F1/20 , G06F1/18
CPC分类号： H01L24/80 , C08G8/30 , C08G2261/3424 , C09J5/00 , C09J161/14 , C09J163/00 , C09J165/00 , C09J2203/326 , C09J2400/163 , G06F1/20 , G06F2200/201 , H01L23/02 , H01L23/3672 , H01L23/3737 , H01L23/433 , H01L24/01 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/0384 , H01L2224/04026 , H01L2224/05638 , H01L2224/05688 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/2731 , H01L2224/2732 , H01L2224/27416 , H01L2224/27418 , H01L2224/27422 , H01L2224/27848 , H01L2224/2919 , H01L2224/29294 , H01L2224/29387 , H01L2224/2939 , H01L2224/32245 , H01L2224/32501 , H01L2224/32505 , H01L2224/73253 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83201 , H01L2224/83203 , H01L2224/83447 , H01L2224/83455 , H01L2224/83484 , H01L2224/83487 , H01L2224/83862 , H01L2224/83986 , H01L2924/10253 , H01L2924/15311 , H01L2924/16195 , H01L2924/171 , H01L2924/351 , H01L2924/00 , H01L2924/00014 , H01L2924/01014 , H01L2924/05442 , H01L2924/05342 , H01L2924/095 , H01L2924/0665 , H01L2924/0715 , H01L2924/00012 , H01L2924/066 , H01L2924/06 , H01L2924/07001 , H01L2924/014 , H01L2924/04953
摘要： A thermal matched composite material, suitable for use as a die is described. In one example, the material includes a metal plate and a substrate having a coefficient of thermal expansion (CTE) lower than the metal plate to carry microelectronic circuits. An adhesive layer between the substrate and the metal plate physically attaches the metal plate to the substrate so that the combined metal plate and substrate have a higher CTE than the substrate alone.
摘要翻译：描述适合用作模具的热匹配复合材料。在一个示例中，材料包括金属板和具有低于金属板的热膨胀系数（CTE）的基板，以承载微电子电路。基板和金属板之间的粘合剂层将金属板物理地附接到基板，使得组合的金属板和基板具有比单独的基板更高的CTE。

5. 发明申请

US20190214328A1 STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT 审中-公开
公开(公告)号：US20190214328A1
公开(公告)日：2019-07-11
申请号：US15866793
申请日：2018-01-10
申请人： Feras Eid , Shrenik Kothari , Chandra M. Jha , Johanna M. Swan , Michael J. Baker , Shawna M. Liff , Thomas L. Sounart , Betsegaw K. Gebrehiwot , Shankar Devasenathipathy , Taylor Gaines , Digvijay Ashokkumar Raorane
发明人： Feras Eid , Shrenik Kothari , Chandra M. Jha , Johanna M. Swan , Michael J. Baker , Shawna M. Liff , Thomas L. Sounart , Betsegaw K. Gebrehiwot , Shankar Devasenathipathy , Taylor Gaines , Digvijay Ashokkumar Raorane
IPC分类号： H01L23/433 , H01L25/00 , H01L21/56 , H01L23/29 , H01L25/18
CPC分类号： H01L23/4334 , H01L21/56 , H01L23/04 , H01L23/16 , H01L23/295 , H01L23/367 , H01L23/42 , H01L25/0652 , H01L25/0657 , H01L25/16 , H01L25/18 , H01L25/50 , H01L2225/06513 , H01L2225/06517 , H01L2225/06568 , H01L2225/06582 , H01L2225/06589
摘要： A semiconductor device that has a semiconductor die coupled to a substrate. A mold compound encapsulates the semiconductor die, and at least one thermal conductive material section extends from adjacent the semiconductor die through the mold compound. The at least one conductive material section thus conveys heat from the semiconductor die through the mold compound.

6. 发明申请

US20180097268A1 FABRICATION PROCESS FOR RIBBON BUNDLED MILLIMETER-WAVEGUIDE 审中-公开
公开(公告)号：US20180097268A1
公开(公告)日：2018-04-05
申请号：US15282050
申请日：2016-09-30
申请人： Sasha Oster , Aleksandar Aleksov , Georgios C. Dogiamis , Telesphor Teles Kamgaing , Adel A. Elsherbini , Shawna M. Liff , Johanna M. Swan , Brandon M. Rawlings , Richard J. Dischler
发明人： Sasha Oster , Aleksandar Aleksov , Georgios C. Dogiamis , Telesphor Teles Kamgaing , Adel A. Elsherbini , Shawna M. Liff , Johanna M. Swan , Brandon M. Rawlings , Richard J. Dischler
IPC分类号： H01P3/16 , H01P11/00 , H05K7/14
CPC分类号： H01P3/122 , H01P3/14 , H01P3/16 , H01P11/006
摘要： A method of making a waveguide ribbon that includes a plurality of waveguides comprises joining a first sheet of dielectric material to a first conductive sheet of conductive material, patterning the first sheet of dielectric material to form a plurality of dielectric waveguide cores on the first conductive sheet, and coating the dielectric waveguide cores with substantially the same conductive material as the conductive sheet to form the plurality of waveguides.

7. 发明授权

US09711284B2 Structure to make supercapacitor 有权
公开(公告)号：US09711284B2
公开(公告)日：2017-07-18
申请号：US13711531
申请日：2012-12-11
申请人： Brian S. Doyle , Sasikanth Manipatruni , Shawna M. Liff , Vivek K. Singh
发明人： Brian S. Doyle , Sasikanth Manipatruni , Shawna M. Liff , Vivek K. Singh
IPC分类号： H01G4/16 , H01G4/30 , H01G4/28 , H01L29/06 , H01G4/008 , B82Y10/00 , H01L49/02 , D03D1/00 , H01L29/775
CPC分类号： H01G4/008 , B82Y10/00 , D03D1/0088 , D10B2401/18 , H01G4/28 , H01L28/60 , H01L29/0673 , H01L29/068 , H01L29/775 , Y02E60/13
摘要： A charge storage fiber is described. In an embodiment, the charge storage fiber includes a flexible electrically conducting fiber, a dielectric coating on the flexible electrically conducting fiber, and a metal coating on the dielectric coating. In an embodiment, the charge storage fiber is attached to a textile-based product.

8. 发明申请

US20140170919A1 FLEXIBLE EMBEDDED INTERCONNECTS 有权
标题翻译：灵活嵌入式互联
公开(公告)号：US20140170919A1
公开(公告)日：2014-06-19
申请号：US13714990
申请日：2012-12-14
申请人： Sasikanth Manipatruni , Brian S. Doyle , Shawna M. Liff , Vivek K. Singh
发明人： Sasikanth Manipatruni , Brian S. Doyle , Shawna M. Liff , Vivek K. Singh
IPC分类号： D03D1/00 , H01B7/04 , D01D5/04 , B21C3/00 , D04H3/00 , D02G3/44
CPC分类号： D03D1/0088 , B21C23/08 , B21C37/042 , B21C37/047 , D01D5/00 , D01D5/34 , D02G3/441 , D04H1/4266 , D04H1/4382 , D04H3/00 , D10B2401/16 , D10B2401/18 , Y10T442/3057 , Y10T442/603
摘要： Flexible electronically functional fibers are described that allow for the placement of electronic functionality in traditional fabrics. The fibers can be interwoven with natural fibers to produce electrically functional fabrics and devices that can retain their original appearance.
摘要翻译：描述了允许在传统织物中放置电子功能的柔性电子功能纤维。纤维可与天然纤维交织以产生可保持其原始外观的电功能织物和装置。

9. 发明申请

US20150171015A1 INTEGRATED CIRCUIT PACKAGE WITH EMBEDDED BRIDGE 有权
标题翻译：集成电路包括嵌入式桥
公开(公告)号：US20150171015A1
公开(公告)日：2015-06-18
申请号：US14132774
申请日：2013-12-18
申请人： Ravindranath V. Mahajan , Christopher J. Nelson , Omkar G. Karhade , Feras Eid , Nitin A. Deshpande , Shawna M. Liff
发明人： Ravindranath V. Mahajan , Christopher J. Nelson , Omkar G. Karhade , Feras Eid , Nitin A. Deshpande , Shawna M. Liff
IPC分类号： H01L23/538 , H01L23/00 , H01L23/367 , H01L25/00 , H01L25/16
CPC分类号： H01L23/5381 , H01L21/563 , H01L21/568 , H01L23/145 , H01L23/3114 , H01L23/3128 , H01L23/367 , H01L23/3675 , H01L23/4334 , H01L23/49816 , H01L23/49827 , H01L23/5389 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/24 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/0657 , H01L25/165 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16265 , H01L2224/17181 , H01L2224/24145 , H01L2224/24245 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29116 , H01L2224/2912 , H01L2224/29139 , H01L2224/29144 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/73209 , H01L2224/73253 , H01L2224/73259 , H01L2224/73267 , H01L2224/81005 , H01L2224/92124 , H01L2224/92224 , H01L2224/92242 , H01L2224/92244 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/12042 , H01L2924/1432 , H01L2924/1433 , H01L2924/1434 , H01L2924/15192 , H01L2924/181 , H01L2924/18161 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/014 , H01L2924/00 , H01L2924/0665
摘要： Embodiments of the present disclosure are directed towards an integrated circuit (IC) package having first and second dies with first and second input/output (I/O) interconnect structures, respectively. The IC package may include a bridge having first and second electrical routing features coupled to a portion of the first and second I/O interconnect structures, respectively. In embodiments, the first and second electrical routing features may be disposed on one side of the bridge; and third electrical routing features may be disposed on an opposite side. The first and second electrical routing features may be configured to route electrical signals between the first die and the second die and the third electrical routing features may be configured to route electrical signals between the one side and the opposite side. The first die, the second die, and the bridge may be embedded in electrically insulating material. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例涉及具有分别具有第一和第二输入/输出（I / O）互连结构的第一和第二裸片的集成电路（IC）封装。 IC封装可以包括具有分别耦合到第一和第二I / O互连结构的一部分的第一和第二电路由特征的桥。在实施例中，第一和第二电路由特征可以设置在桥的一侧; 并且第三电路布线特征可以设置在相对侧上。第一和第二电路由特征可以被配置为在第一管芯和第二管芯之间路由电信号，并且第三电路由特征可以被配置为在一侧和相对侧之间路由电信号。第一管芯，第二管芯和桥可以嵌入电绝缘材料中。可以描述和/或要求保护其他实施例。

10. 发明申请

US20140160628A1 STRUCTURE TO MAKE SUPERCAPACITOR 有权
标题翻译：结构化超临界
公开(公告)号：US20140160628A1
公开(公告)日：2014-06-12
申请号：US13711531
申请日：2012-12-11
申请人： Brian S. Doyle , Sasikanth Manipatruni , Shawna M. Liff , Vivek K. Singh
发明人： Brian S. Doyle , Sasikanth Manipatruni , Shawna M. Liff , Vivek K. Singh
IPC分类号： H01G4/008 , H01L29/76
CPC分类号： H01G4/008 , B82Y10/00 , D03D1/0088 , D10B2401/18 , H01G4/28 , H01L28/60 , H01L29/0673 , H01L29/068 , H01L29/775 , Y02E60/13
摘要： A charge storage fiber is described. In an embodiment, the charge storage fiber includes a flexible electrically conducting fiber, a dielectric coating on the flexible electrically conducting fiber, and a metal coating on the dielectric coating. In an embodiment, the charge storage fiber is attached to a textile-based product.
摘要翻译：描述电荷存储纤维。在一个实施例中，电荷存储光纤包括柔性导电纤维，柔性导电纤维上的介电涂层以及介电涂层上的金属涂层。在一个实施例中，电荷存储光纤连接到基于纺织品的产品上。

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