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1. 发明申请

US20190214328A1 STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT 审中-公开
公开(公告)号：US20190214328A1
公开(公告)日：2019-07-11
申请号：US15866793
申请日：2018-01-10
申请人： Feras Eid , Shrenik Kothari , Chandra M. Jha , Johanna M. Swan , Michael J. Baker , Shawna M. Liff , Thomas L. Sounart , Betsegaw K. Gebrehiwot , Shankar Devasenathipathy , Taylor Gaines , Digvijay Ashokkumar Raorane
发明人： Feras Eid , Shrenik Kothari , Chandra M. Jha , Johanna M. Swan , Michael J. Baker , Shawna M. Liff , Thomas L. Sounart , Betsegaw K. Gebrehiwot , Shankar Devasenathipathy , Taylor Gaines , Digvijay Ashokkumar Raorane
IPC分类号： H01L23/433 , H01L25/00 , H01L21/56 , H01L23/29 , H01L25/18
CPC分类号： H01L23/4334 , H01L21/56 , H01L23/04 , H01L23/16 , H01L23/295 , H01L23/367 , H01L23/42 , H01L25/0652 , H01L25/0657 , H01L25/16 , H01L25/18 , H01L25/50 , H01L2225/06513 , H01L2225/06517 , H01L2225/06568 , H01L2225/06582 , H01L2225/06589
摘要： A semiconductor device that has a semiconductor die coupled to a substrate. A mold compound encapsulates the semiconductor die, and at least one thermal conductive material section extends from adjacent the semiconductor die through the mold compound. The at least one conductive material section thus conveys heat from the semiconductor die through the mold compound.

2. 发明授权

US09601406B2 Copper nanorod-based thermal interface material (TIM) 有权
公开(公告)号：US09601406B2
公开(公告)日：2017-03-21
申请号：US13782893
申请日：2013-03-01
申请人： Chandra M. Jha , Feras Eid , Johanna M. Swan , Ashish Gupta
发明人： Chandra M. Jha , Feras Eid , Johanna M. Swan , Ashish Gupta
IPC分类号： H01L23/34 , H01L21/8238 , H01L23/373 , H01L23/00 , H01L23/433
CPC分类号： H01L23/3733 , H01L23/3736 , H01L23/3737 , H01L23/433 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/04026 , H01L2224/05568 , H01L2224/05647 , H01L2224/1133 , H01L2224/1147 , H01L2224/1182 , H01L2224/11826 , H01L2224/13017 , H01L2224/13019 , H01L2224/13078 , H01L2224/13147 , H01L2224/13193 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/271 , H01L2224/27436 , H01L2224/2745 , H01L2224/29193 , H01L2224/2929 , H01L2224/29347 , H01L2224/29393 , H01L2224/29499 , H01L2224/32058 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/81011 , H01L2224/81191 , H01L2224/83104 , H01L2224/83191 , H01L2224/92125 , H01L2224/94 , H01L2225/06524 , H01L2225/06589 , H01L2924/15311 , H01L2924/16251 , H01L2924/16724 , H01L2924/16747 , H01L2924/3511 , Y10T428/249921 , Y10T428/26 , H01L2224/27 , H01L2924/00012 , H01L2924/00 , H01L2924/0665 , H01L2924/00014
摘要： A copper nanorod thermal interface material (TIM) is described. The copper nanorod TIM includes a plurality of copper nanorods having a first end thermally coupled with a first surface, and a second end extending toward a second surface. A plurality of copper nanorod branches are formed on the second end. The copper nanorod branches are metallurgically bonded to a second surface. The first surface may be the back side of a die. The second surface may be a heat spread or a second die. The TIM may include a matrix material surrounding the copper nanorods. In an embodiment, the copper nanorods are formed in clusters.

3. 发明申请

US20140246770A1 COPPER NANOROD-BASED THERMAL INTERFACE MATERIAL (TIM) 有权
标题翻译：铜基热绝缘材料（TIM）
公开(公告)号：US20140246770A1
公开(公告)日：2014-09-04
申请号：US13782893
申请日：2013-03-01
申请人： Chandra M. Jha , Feras Eid , Johanna M. Swan , Ashish Gupta
发明人： Chandra M. Jha , Feras Eid , Johanna M. Swan , Ashish Gupta
IPC分类号： H01L23/373
CPC分类号： H01L23/3733 , H01L23/3736 , H01L23/3737 , H01L23/433 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/04026 , H01L2224/05568 , H01L2224/05647 , H01L2224/1133 , H01L2224/1147 , H01L2224/1182 , H01L2224/11826 , H01L2224/13017 , H01L2224/13019 , H01L2224/13078 , H01L2224/13147 , H01L2224/13193 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/271 , H01L2224/27436 , H01L2224/2745 , H01L2224/29193 , H01L2224/2929 , H01L2224/29347 , H01L2224/29393 , H01L2224/29499 , H01L2224/32058 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/81011 , H01L2224/81191 , H01L2224/83104 , H01L2224/83191 , H01L2224/92125 , H01L2224/94 , H01L2225/06524 , H01L2225/06589 , H01L2924/15311 , H01L2924/16251 , H01L2924/16724 , H01L2924/16747 , H01L2924/3511 , Y10T428/249921 , Y10T428/26 , H01L2224/27 , H01L2924/00012 , H01L2924/00 , H01L2924/0665 , H01L2924/00014
摘要： A copper nanorod thermal interface material (TIM) is described. The copper nanorod TIM includes a plurality of copper nanorods having a first end thermally coupled with a first surface, and a second end extending toward a second surface. A plurality of copper nanorod branches are formed on the second end. The copper nanorod branches are metallurgically bonded to a second surface. The first surface may be the back side of a die. The second surface may be a heat spread or a second die. The TIM may include a matrix material surrounding the copper nanorods. In an embodiment, the copper nanorods are formed in clusters.
摘要翻译：描述了铜纳米棒热界面材料（TIM）。铜纳米棒TIM包括多个铜纳米棒，其具有与第一表面热耦合的第一端和朝向第二表面延伸的第二端。在第二端形成多个铜纳米棒分支。铜纳米棒分支冶金结合到第二表面。第一表面可以是模具的背面。第二表面可以是热扩散或第二模具。 TIM可以包括围绕铜纳米棒的基质材料。在一个实施方案中，铜纳米棒以簇形成。

4. 发明申请

US20140314111A1 THERMAL MANAGEMENT IN PACKAGED VCSELS 有权
标题翻译：包装VCSELS中的热管理
公开(公告)号：US20140314111A1
公开(公告)日：2014-10-23
申请号：US13698453
申请日：2011-11-18
申请人： Feras Eid , Shawna M. Liff , Henning Braunisch
发明人： Feras Eid , Shawna M. Liff , Henning Braunisch
IPC分类号： H01S5/024
CPC分类号： H01S5/02476 , H01S5/02236 , H01S5/183 , H01S5/423
摘要： Heat management systems for vertical cavity surface emitting laser (VCSEL) chips are provided. Embodiments of the invention provide substrates having, a vertical cavity surface emitting laser chip disposed on the substrate surface and electrically interconnected with the substrate, a thermal frame disposed on the substrate surface and proximate to at least three sides of the vertical cavity surface emitting laser chip, and a thermal interface material disposed between the at least three sides of the vertical cavity surface emitting laser chip and the thermal frame. The substrate can also include a transceiver chip that is operably coupled to a further integrated circuit chip and that is capable of driving the VCSEL chip.
摘要翻译：提供了垂直腔表面发射激光（VCSEL）芯片的热管理系统。本发明的实施例提供了具有设置在衬底表面上并与衬底电互连的垂直腔表面发射激光器芯片的衬底，设置在衬底表面上并且靠近垂直腔表面发射激光器芯片的至少三个侧面的热框架以及设置在垂直腔表面发射激光芯片和热框架的至少三个侧面之间的热界面材料。衬底还可以包括可操作地耦合到另一集成电路芯片并且能够驱动VCSEL芯片的收发器芯片。

5. 发明申请

US20150171015A1 INTEGRATED CIRCUIT PACKAGE WITH EMBEDDED BRIDGE 有权
标题翻译：集成电路包括嵌入式桥
公开(公告)号：US20150171015A1
公开(公告)日：2015-06-18
申请号：US14132774
申请日：2013-12-18
申请人： Ravindranath V. Mahajan , Christopher J. Nelson , Omkar G. Karhade , Feras Eid , Nitin A. Deshpande , Shawna M. Liff
发明人： Ravindranath V. Mahajan , Christopher J. Nelson , Omkar G. Karhade , Feras Eid , Nitin A. Deshpande , Shawna M. Liff
IPC分类号： H01L23/538 , H01L23/00 , H01L23/367 , H01L25/00 , H01L25/16
CPC分类号： H01L23/5381 , H01L21/563 , H01L21/568 , H01L23/145 , H01L23/3114 , H01L23/3128 , H01L23/367 , H01L23/3675 , H01L23/4334 , H01L23/49816 , H01L23/49827 , H01L23/5389 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/24 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/0657 , H01L25/165 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16265 , H01L2224/17181 , H01L2224/24145 , H01L2224/24245 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29116 , H01L2224/2912 , H01L2224/29139 , H01L2224/29144 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/73209 , H01L2224/73253 , H01L2224/73259 , H01L2224/73267 , H01L2224/81005 , H01L2224/92124 , H01L2224/92224 , H01L2224/92242 , H01L2224/92244 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/12042 , H01L2924/1432 , H01L2924/1433 , H01L2924/1434 , H01L2924/15192 , H01L2924/181 , H01L2924/18161 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/014 , H01L2924/00 , H01L2924/0665
摘要： Embodiments of the present disclosure are directed towards an integrated circuit (IC) package having first and second dies with first and second input/output (I/O) interconnect structures, respectively. The IC package may include a bridge having first and second electrical routing features coupled to a portion of the first and second I/O interconnect structures, respectively. In embodiments, the first and second electrical routing features may be disposed on one side of the bridge; and third electrical routing features may be disposed on an opposite side. The first and second electrical routing features may be configured to route electrical signals between the first die and the second die and the third electrical routing features may be configured to route electrical signals between the one side and the opposite side. The first die, the second die, and the bridge may be embedded in electrically insulating material. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例涉及具有分别具有第一和第二输入/输出（I / O）互连结构的第一和第二裸片的集成电路（IC）封装。 IC封装可以包括具有分别耦合到第一和第二I / O互连结构的一部分的第一和第二电路由特征的桥。在实施例中，第一和第二电路由特征可以设置在桥的一侧; 并且第三电路布线特征可以设置在相对侧上。第一和第二电路由特征可以被配置为在第一管芯和第二管芯之间路由电信号，并且第三电路由特征可以被配置为在一侧和相对侧之间路由电信号。第一管芯，第二管芯和桥可以嵌入电绝缘材料中。可以描述和/或要求保护其他实施例。

6. 发明授权

US09391427B2 Thermal management in packaged VCSELs 有权
标题翻译：封装VCSEL中的热管理
公开(公告)号：US09391427B2
公开(公告)日：2016-07-12
申请号：US13698453
申请日：2011-11-18
申请人： Feras Eid , Shawna M. Liff , Henning Braunisch
发明人： Feras Eid , Shawna M. Liff , Henning Braunisch
IPC分类号： H01S5/024 , H01S5/022 , H01S5/183 , H01S5/42
CPC分类号： H01S5/02476 , H01S5/02236 , H01S5/183 , H01S5/423
摘要： Heat management systems for vertical cavity surface emitting laser (VCSEL) chips are provided. Embodiments of the invention provide substrates having a vertical cavity surface emitting laser chip disposed on the substrate surface and electrically interconnected with the substrate, a thermal frame disposed on the substrate surface and proximate to at least three sides of the vertical cavity surface emitting laser chip, and a thermal interface material disposed between the at least three sides of the vertical cavity surface emitting laser chip and the thermal frame. The substrate can also include a transceiver chip that is operably coupled to a further integrated circuit chip and that is capable of driving the VCSEL chip.
摘要翻译：提供了垂直腔表面发射激光（VCSEL）芯片的热管理系统。本发明的实施例提供了具有设置在衬底表面上并与衬底电互连的垂直腔表面发射激光器芯片的衬底，设置在衬底表面上并且靠近垂直腔表面发射激光器芯片的至少三个侧面的热框架，以及设置在垂直腔表面发射激光芯片和热框架的至少三个侧面之间的热界面材料。衬底还可以包括可操作地耦合到另一集成电路芯片并且能够驱动VCSEL芯片的收发器芯片。

7. 发明申请

US20190003854A1 INTEGRATED SENSOR AND HOMOLOGOUS CALIBRATION STRUCTURE FOR RESONANT DEVICES 审中-公开
公开(公告)号：US20190003854A1
公开(公告)日：2019-01-03
申请号：US15636599
申请日：2017-06-28
申请人： Sasha Oster , Feras Eid , Thomas L. Sounart , Georgios C. Dogiamis
发明人： Sasha Oster , Feras Eid , Thomas L. Sounart , Georgios C. Dogiamis
IPC分类号： G01C25/00 , G01C19/5656
CPC分类号： G01C25/005 , G01C19/5656 , G01P1/00 , G01P1/023 , G01P15/0802 , G01P15/097 , G01P15/18 , G01P21/00 , G01P2015/084
摘要： An apparatus is provided which comprises: a substrate; a sensor including a sensing element, wherein the sensor is integrated within the substrate; and a calibration structure integrated within the substrate, wherein the calibration structure is to exhibit one or more physical or chemical properties same as the sensor but without the sensing element.

8. 发明申请

US20180026393A1 MAGNETIC DETACHABLE ELECTRICAL CONNECTIONS BETWEEN CIRCUITS 有权
公开(公告)号：US20180026393A1
公开(公告)日：2018-01-25
申请号：US15215531
申请日：2016-07-20
申请人： Feras Eid , Sasha N. Oster , Adel A. Elsherbini , Aleksandar Aleksov , Johanna M. Swan , Amit Sudhir Baxi , Vincent S. Mageshkumar
发明人： Feras Eid , Sasha N. Oster , Adel A. Elsherbini , Aleksandar Aleksov , Johanna M. Swan , Amit Sudhir Baxi , Vincent S. Mageshkumar
IPC分类号： H01R13/62 , H01R13/631 , H01R13/627
CPC分类号： H01R13/6205 , H01R11/30 , H01R13/627 , H01R13/631
摘要： Discussed generally herein are methods and devices including or providing a magnetic, detachable, conductive connector to provide an electrical and mechanical connection between parts. A device can include a first substrate, at least one electric component on or at least partially in a first surface of the first substrate, an adhesive on the first surface of the first substrate to temporarily attached the device to skin of a user, a contact pad electrically coupled to an electric component of the at least one electric component, the contact pad on or at least partially in a second surface of the substrate, the first surface opposite the second surface, and a conductive magnetic connector electrically and mechanically connected to the contact pad through a first conductive adhesive.

9. 发明申请

US20180084643A1 STRETCHABLE AND FLEXIBLE ELECTRICAL SUBSTRATE INTERCONNECTIONS 审中-公开
公开(公告)号：US20180084643A1
公开(公告)日：2018-03-22
申请号：US15267872
申请日：2016-09-16
申请人： Amit Sudhir Baxi , Vincent S. Mageshkumar , Adel A. Elsherbini , Sasha Oster , Feras Eid , Aleksandar Aleksov , Johanna M. Swan
发明人： Amit Sudhir Baxi , Vincent S. Mageshkumar , Adel A. Elsherbini , Sasha Oster , Feras Eid , Aleksandar Aleksov , Johanna M. Swan
IPC分类号： H05K1/14 , H05K1/18 , H05K1/02 , H05K1/11
CPC分类号： H05K1/147 , A61B5/00 , A61B5/6833 , A61B2562/164 , A61B2562/166 , H05K1/0283 , H05K1/112 , H05K1/181 , H05K3/365 , H05K2201/10151 , H05K2201/10265 , H05K2201/10303 , H05K2201/10318
摘要： A circuit interconnect may be used in biometric data sensing and feedback applications. A circuit interconnect may be used in device device-to-device connections (e.g., Internet of Things (IoT) devices), including applications that require connection between stretchable and rigid substrates. A circuit interconnect may include a multi-pin, snap-fit attachment mechanism, where the attachment mechanism provides an electrical interconnection between a rigid substrate and a flexible or stretchable substrate. The combination of a circuit interconnect and flexible or stretchable substrate provides improved electrical connection reliability, allows for greater stretchability and flexibility of the circuit traces, and allows for more options in connecting a stretchable circuit trace to a rigid PCB.

10. 发明授权

US09429427B2 Inductive inertial sensor architecture and fabrication in packaging build-up layers 有权
标题翻译：感应惯性传感器结构和制造在包装堆积层
公开(公告)号：US09429427B2
公开(公告)日：2016-08-30
申请号：US13720876
申请日：2012-12-19
申请人： Qing Ma , Feras Eid , Kevin Lin , Johanna M. Swan , Weng Hong Teh , Valluri R. Rao
发明人： Qing Ma , Feras Eid , Kevin Lin , Johanna M. Swan , Weng Hong Teh , Valluri R. Rao
IPC分类号： G01C19/00 , G01C19/56 , G01C19/5776
CPC分类号： G01C19/56 , G01C19/5776
摘要： This invention relates to inductive inertial sensors employing a magnetic drive and/or sense architecture. In embodiments, translational gyroscopes utilize a conductive coil made to vibrate in a first dimension as a function of a time varying current driven through the coil in the presence of a magnetic field. Sense coils register an inductance that varies as a function of an angular velocity in a second dimension. In embodiments, the vibrating coil causes first and second mutual inductances in the sense coils to deviate from each other as a function of the angular velocity. In embodiments, self-inductances associated with a pair of meandering coils vary as a function of an angular velocity in a second dimension. In embodiments, package build-up layers are utilized to fabricate the inductive inertial sensors, enabling package-level integrated inertial sensing advantageous in small form factor computing platforms, such as mobile devices.
摘要翻译：本发明涉及采用磁驱动和/或感测架构的感应惯性传感器。在实施例中，平移陀螺仪利用在第一维度中制成的导电线圈作为在存在磁场的情况下驱动通过线圈的时变电流的函数。感应线圈记录在第二维度上作为角速度的函数变化的电感。在实施例中，振动线圈使得感测线圈中的第一和第二互感器作为角速度的函数彼此偏离。在实施例中，与一对曲折线圈相关联的自感量作为第二维度中的角速度的函数而变化。在实施例中，使用封装积层来制造感应惯性传感器，使得能够在诸如移动设备的小尺寸计算平台中有利的封装级集成惯性感测。

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