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1. 发明授权

US06200829B1 Microelectronic assembly with connection to a buried electrical element, and method for forming same 有权
标题翻译：与埋地电气元件连接的微电子组件及其形成方法
公开(公告)号：US06200829B1
公开(公告)日：2001-03-13
申请号：US09299158
申请日：1999-04-22
申请人： Dennis Brian Miller , Grace M. O'Malley , Brian R. Kemper
发明人： Dennis Brian Miller , Grace M. O'Malley , Brian R. Kemper
IPC分类号： H01L2144
CPC分类号： H01L24/80 , G06K19/07745 , G06K19/0775 , H01L23/49855 , H01L2224/48091 , H01L2924/01029 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K1/183 , H05K3/28 , H05K3/321 , H05K3/3426 , H05K2201/0367 , H05K2201/09472 , H05K2201/10477 , H05K2201/10689 , H05K2201/10931 , H01L2924/00014
摘要： A microelectronic assembly (10), such as a smart card, is formed by attaching a component subassembly (34) to a substrate (12). The substrate (12) includes a face (26) and defines a via (28) having a via opening (30) at the face (26). The substrate (12) further defines a component cavity (32) at the face (26) that is spaced apart from the via (28). An electrical element (14), such as a wound antenna, is disposed within the substrate (12) and includes a terminal (24) at the via (28). The component subassembly (34) is formed by mounting an integrated circuit component (16) onto a metallic lead (18). The integrated circuit component (16) is electrically connected to the metallic lead (18) by a wire lead (36). A protuberance (20) is connected to the metallic lead (18), preferably by forming a loop from a wire bond. A polymeric body (56) is formed about the component (16) and wire leads (36). The component subassembly (34) is superposed onto the substrate (12), and the component (16) is received in the component cavity (32). The metallic lead (18) is affixed to the face (26) and overlies the via opening (30). The protuberance (20) extends into the via (28) and contacts a conductive body (22) within the via (28). The conductive body (22) electrically connects the protuberance (20) and the terminal (24).
摘要翻译：诸如智能卡的微电子组件（10）通过将部件子组件（34）附接到基板（12）而形成。衬底（12）包括面（26）并且限定了在面（26）处具有通孔开口（30）的通孔（28）。基板（12）还在与通孔（28）间隔开的面（26）处限定一个部件空腔（32）。诸如伤口天线的电气元件（14）设置在衬底（12）内，并且在通孔（28）处包括端子（24）。组件子组件（34）通过将集成电路部件（16）安装到金属引线（18）上而形成。集成电路部件（16）通过引线（36）与金属引线（18）电连接。突起（20）连接到金属引线（18），优选地通过从引线接合形成环。围绕组件（16）和导线（36）形成聚合体（56）。组件子组件（34）重叠在基板（12）上，并且部件（16）被容纳在部件空腔（32）中。金属引线（18）固定在面（26）上并覆盖通孔（30）。突起（20）延伸到通孔（28）中并与通孔（28）内的导电体（22）接触。导电体（22）电连接突起（20）和端子（24）。

2. 发明授权

US5898215A Microelectronic assembly with connection to a buried electrical element, and method for forming same 失效
标题翻译：与埋地电气元件连接的微电子组件及其形成方法
公开(公告)号：US5898215A
公开(公告)日：1999-04-27
申请号：US766653
申请日：1996-12-16
申请人： Dennis Brian Miller , Grace M. O'Malley , Brian R. Kemper
发明人： Dennis Brian Miller , Grace M. O'Malley , Brian R. Kemper
IPC分类号： G06K19/077 , H01L21/60 , H01L23/498 , H05K1/18 , H05K3/28 , H05K3/32 , H05K3/34 , H01L23/02 , H01L23/48
CPC分类号： H01L24/80 , G06K19/07745 , G06K19/0775 , H01L23/49855 , H05K3/321 , H01L2224/45147 , H01L2224/48091 , H01L2924/01029 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K1/183 , H05K2201/0367 , H05K2201/09472 , H05K2201/10477 , H05K2201/10689 , H05K2201/10931 , H05K3/28 , H05K3/3426
摘要： A microelectronic assembly (10), such as a smart card, is formed by attaching a component subassembly (34) to a substrate (12). The substrate (12) includes a face (26) and defines a via (28) having a via opening (30) at the face (26). The substrate (12) further defines a component cavity (32) at the face (26) that is spaced apart from the via (28). An electrical element (14), such as a wound antenna, is disposed within the substrate (12) and includes a terminal (24) at the via (28). The component subassembly (34) is formed by mounting an integrated circuit component (16) onto a metallic lead (18). The integrated circuit component (16) is electrically connected to the metallic lead (18) by a wire lead (36). A protuberance (20) is connected to the metallic lead (18), preferably by forming a loop from a wire bond. A polymeric body (56) is formed about the component (16) and wire leads (36). The component subassembly (34) is superposed onto the substrate (12), and the component (16) is received in the component cavity (32). The metallic lead (18) is affixed to the face (26) and overlies the via opening (30). The protuberance (20) extends into the via (28) and contacts a conductive body (22) within the via (28). The conductive body (22) electrically connects the protuberance (20) and the terminal (24).
摘要翻译：诸如智能卡的微电子组件（10）通过将部件子组件（34）附接到基板（12）而形成。衬底（12）包括面（26）并且限定了在面（26）处具有通孔开口（30）的通孔（28）。基板（12）还在与通孔（28）间隔开的面（26）处限定一个部件空腔（32）。诸如伤口天线的电气元件（14）设置在衬底（12）内，并且在通孔（28）处包括端子（24）。组件子组件（34）通过将集成电路部件（16）安装到金属引线（18）上而形成。集成电路部件（16）通过引线（36）与金属引线（18）电连接。突起（20）连接到金属引线（18），优选地通过从引线接合形成环。围绕组件（16）和导线（36）形成聚合体（56）。组件子组件（34）重叠在基板（12）上，并且部件（16）被容纳在部件空腔（32）中。金属引线（18）固定在面（26）上并覆盖通孔（30）。突起（20）延伸到通孔（28）中并与通孔（28）内的导电体（22）接触。导电体（22）电连接突起（20）和端子（24）。

3. 发明授权

US5856912A Microelectronic assembly for connection to an embedded electrical element, and method for forming same 失效
标题翻译：用于连接到嵌入式电气元件的微电子组件及其形成方法
公开(公告)号：US5856912A
公开(公告)日：1999-01-05
申请号：US811561
申请日：1997-03-04
申请人： Dennis Brian Miller , Grace M. O'Malley , Brian R. Kemper
发明人： Dennis Brian Miller , Grace M. O'Malley , Brian R. Kemper
IPC分类号： G06K19/077 , H05K3/34 , H05K7/02 , G06K19/07
CPC分类号： G06K19/07743 , H05K3/3426 , H01L2224/45147 , H01L2224/48091 , H01L2924/181 , Y02P70/613
摘要： A microelectronic assembly (10) is formed by attaching a component subassembly (34) to a substrate (12). The substrate (12) includes a face (26) and defines a via (28) having a via opening (30) at the face (26). The substrate (12) further defines a component cavity (32) at the face (26). An electrical element (14) is disposed within the substrate (12) and includes a terminal (24) at the via (28). The component subassembly (34) is formed by mounting an integrated circuit component (16) onto a metallic lead (18). The integrated circuit component (16) is electrically connected to the metallic lead (18) by a wire lead (36). A leg (20) is formed by deforming a portion of the metallic lead (18). A polymeric body (56) is formed about the component (16) and wire leads (36). The component subassembly (34) is superposed onto the substrate (12), and the component (16) is received in the component cavity (32). The metallic lead (18) is affixed to the face (26). The leg (20) extends into the via (28) and contacts a conductive body (22) within the via (28). The conductive body (22) electrically connects the leg (20) and the terminal (24).
摘要翻译：微电子组件（10）通过将部件子组件（34）附接到衬底（12）而形成。衬底（12）包括面（26）并且限定了在面（26）处具有通孔开口（30）的通孔（28）。衬底（12）还在面（26）处限定一个部件空腔（32）。电气元件（14）设置在衬底（12）内，并且在通孔（28）处包括端子（24）。组件子组件（34）通过将集成电路部件（16）安装到金属引线（18）上而形成。集成电路部件（16）通过引线（36）与金属引线（18）电连接。腿部（20）通过使金属引线（18）的一部分变形来形成。围绕组件（16）和导线（36）形成聚合体（56）。组件子组件（34）重叠在基板（12）上，并且部件（16）被容纳在部件空腔（32）中。金属引线（18）固定在面（26）上。腿部（20）延伸到通孔（28）中并与通孔（28）内的导电体（22）接触。导电体（22）电连接腿部（20）和端子（24）。

4. 发明授权

US5848466A Method for forming a microelectronic assembly 失效
标题翻译：微电子组件的形成方法
公开(公告)号：US5848466A
公开(公告)日：1998-12-15
申请号：US752019
申请日：1996-11-19
申请人： Daniel Joseph Viza , Dennis Brian Miller , William M. Beckenbaugh , Conrad S. Monroe , Kent W. Hansen
发明人： Daniel Joseph Viza , Dennis Brian Miller , William M. Beckenbaugh , Conrad S. Monroe , Kent W. Hansen
IPC分类号： H01L21/60 , H01L23/485 , H01L23/498 , H05K1/11 , H05K3/32 , H05K3/40 , H05K3/34
CPC分类号： H05K1/112 , H01L23/49827 , H01L23/4985 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/16237 , H01L2224/81801 , H01L2224/83101 , H01L2224/83856 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H05K2201/0305 , H05K2201/0394 , H05K2201/09472 , H05K2201/10575 , H05K2201/10674 , H05K2203/1189 , H05K2203/1446 , H05K3/321 , H05K3/4038 , Y10T29/49144 , Y10T29/49165
摘要： A microelectronic assembly (10) is formed by bonding an integrated circuit component (20) to a substrate (12). The substrate (12) includes a via (22) and a metal contact (24) closing the via (22). A bonding agent (14), such as a solder paste or a conductive epoxy, is dispensed into the via (22) adjacent the metal contact (24). A carrier tape (16) that includes partially-cured films (18) is placed onto the substrate (12) such that the film (18) covers the via (22) and forms a gap (28) between the substrate (12) and the film (18). The integrated circuit component (20) is superposed onto the substrate (12) such that conductive bumps (26) on the integrated circuit component (20) perforate and extend through the film (18) and contact the bonding agent (14) in the via (22). Portions (44) displaced during perforation are received in the gap (28). The film (18) is thus interposed between the substrate (12) and the integrated circuit component (20). The preassembly (38) is then heated to bond the bonding agent (14) to the metal contact (24) and to cure the film (18) to form an integral assembly (10).
摘要翻译：通过将集成电路部件（20）接合到基板（12）上而形成微电子组件（10）。基板（12）包括通孔（22）和闭合通孔（22）的金属触头（24）。诸如焊膏或导电环氧树脂的粘合剂（14）被分配到与金属接触件（24）相邻的通孔（22）中。将包括部分固化膜（18）的载带（16）放置在基板（12）上，使得膜（18）覆盖通孔（22），并在基板（12）和电影（18）。集成电路部件（20）被叠加到基板（12）上，使得集成电路部件（20）上的导电凸块（26）穿透并延伸穿过薄膜（18）并与通孔中的粘结剂（14）接触（22）。穿孔期间移位的部分（44）被接收在间隙（28）中。因此，膜（18）被插入在基板（12）和集成电路部件（20）之间。然后将预组件（38）加热以将粘合剂（14）粘合到金属接触件（24）上并固化膜（18）以形成整体组件（10）。

5. 发明授权

US5829668A Method for forming solder bumps on bond pads 失效
标题翻译：在焊盘上形成焊料凸块的方法
公开(公告)号：US5829668A
公开(公告)日：1998-11-03
申请号：US706863
申请日：1996-09-03
申请人： Reed A. George , Dennis Brian Miller
发明人： Reed A. George , Dennis Brian Miller
IPC分类号： H01L21/48 , H01L21/60 , H01L21/68 , H05K3/34
CPC分类号： H01L24/11 , H01L21/4853 , H01L21/6835 , H05K3/3484 , H01L2224/11003 , H01L2224/13099 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/15747 , H05K2203/0338 , H05K2203/043
摘要： Solder paste (16) is dispensed onto a platen (12) that includes depressions (14) that are preferably conical or in an inverted pyramid shape. The solder paste (16) is formed of a plurality of particles composed of a solder alloy. Excess solder paste (16) is removed, and a predetermined solder paste volume fills the depressions (14). A substrate (18) is superposed onto platen (12) such that solder-wettable bond pads (20) on the substrate (18) register with the depressions (14). The platen (12) is heated to melt the solder alloy, and the solder alloy coalesces to form molten solder droplets (22). The solder droplets (22) are transferred onto the solder-wettable bond pads (20) to form solder bumps (24) bonded to the bond pads (20).
摘要翻译：将焊膏（16）分配到包括凹陷（14）的压板（12）上，所述凹陷（14）优选为圆锥形或倒锥形。焊膏（16）由焊料合金构成的多个粒子形成。去除过量的焊膏（16），并且预定的焊膏体积填充凹陷（14）。衬底（18）重叠在压板（12）上，使得衬底（18）上的焊料可润湿接合焊盘（20）与凹陷（14）对准。将压板（12）加热熔化焊料合金，并且焊料合金聚结形成熔融焊料液滴（22）。焊料液滴（22）被转移到可焊接的可焊接接合焊盘（20）上以形成结合到接合焊盘（20）的焊料凸块（24）。

6. 发明授权

US5749614A Vacuum pickup tool for placing balls in a customized pattern 失效
标题翻译：用于将球放置在定制图案中的真空拾取工具
公开(公告)号：US5749614A
公开(公告)日：1998-05-12
申请号：US567012
申请日：1995-12-04
申请人： Ellen Margaret Reid , Douglas Bruce Feicht , Dennis Brian Miller , Daniel Joseph Viza , Mark William McGarry
发明人： Ellen Margaret Reid , Douglas Bruce Feicht , Dennis Brian Miller , Daniel Joseph Viza , Mark William McGarry
IPC分类号： B65G47/91 , H05K3/34 , B25J15/06
CPC分类号： H05K3/3478 , B65G47/91 , H05K2203/0113 , H05K2203/0338 , H05K2203/041 , H05K2203/082
摘要： A vacuum pickup tool (10) is effective to carry balls (18) arranged in a desired pattern. The vacuum pickup tool (10) includes a manifold (12) that includes a carrier plate (22) that has a plurality of manifold bores (28) arranged in a pattern. The manifold (12) defines a vacuum chamber (20) that reduces gas pressure in the manifold (12) to allow the manifold bores (28) to retain a ball (18). The manifold (12) further includes a retaining plate (14) that overlies the carrier plate (22) and includes a plurality of retaining plate bores (30) arranged in a pattern such that each retaining plate bore (30) registers with a corresponding manifold bore (28). The retaining plate (14) is effective to secure a stencil (16) formed of a gas-impermeable sheet against the carrier plate (22) to prevent gas flow between a manifold bore (28) and a corresponding retaining plate bore (30).
摘要翻译：真空拾取工具（10）有效地承载以期望的图案布置的球（18）。真空拾取工具（10）包括歧管（12），其包括具有以图案排列的多个歧管孔（28）的承载板（22）。歧管（12）限定了减小歧管（12）中的气体压力以允许歧管孔（28）保持球（18）的真空室（20）。歧管（12）还包括保持板（14），该保持板（14）覆盖承载板（22）并且包括多个保持板孔（30），其以图案布置，使得每个保持板孔（30）与相应的歧管孔（28）。保持板（14）有效地将由气体不可渗透片形成的模板（16）固定在承载板（22）上，以防止歧管孔（28）和对应的保持板孔（30）之间的气体流动。

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