专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US11388840B2 Condensers and electronic assemblies 有权
公开(公告)号：US11388840B2
公开(公告)日：2022-07-12
申请号：US16870320
申请日：2020-05-08
申请人： Deere & Company , Alliance for Sustainable Energy, LLC
发明人： Emily Cousineau , Gilberto Moreno , Kevin Scott Bennion , Thomas Roan , Brij N. Singh
IPC分类号： H05K7/20 , F25B39/04 , H01L23/427 , F28D15/02 , F28F1/02
摘要： Provided is a condenser for use in an electronic assembly. The condenser includes a first vertical wall extending in a vertical direction, the first vertical wall defining a first plurality of vertical condensation channels within the first vertical wall, a second vertical wall extending in the vertical direction, the second vertical wall defining a second plurality of vertical condensation channels within the second vertical wall, and a first plurality of fins extending in the vertical direction, each of the first plurality of fins connected to the first vertical wall, the second vertical wall or both the first vertical wall and the second vertical wall.

2. 发明授权

US11778782B2 Condensers and electronic assemblies 有权
公开(公告)号：US11778782B2
公开(公告)日：2023-10-03
申请号：US17739348
申请日：2022-05-09
申请人： Deere & Company , Alliance for Sustainable Energy, LLC
发明人： Emily Cousineau , Gilberto Moreno , Kevin Scott Bennion , Thomas Roan , Brij N. Singh
IPC分类号： H05K7/20 , F25B39/04 , H01L23/427 , F28D15/02 , F28F1/02
CPC分类号： H05K7/20318 , F25B39/04 , F28D15/0266 , H01L23/427 , H05K7/20172 , H05K7/20309 , F28F1/022 , F28F2215/02 , H05K7/20145 , H05K7/20327
摘要： Provided is a condenser for use in an electronic assembly. The condenser includes a first vertical wall extending in a vertical direction, the first vertical wall defining a first plurality of vertical condensation channels within the first vertical wall, a second vertical wall extending in the vertical direction, the second vertical wall defining a second plurality of vertical condensation channels within the second vertical wall, and a first plurality of fins extending in the vertical direction, each of the first plurality of fins connected to the first vertical wall, the second vertical wall or both the first vertical wall and the second vertical wall.

3. 发明授权

US09693488B2 Electronic assembly with one or more heat sinks 有权
公开(公告)号：US09693488B2
公开(公告)日：2017-06-27
申请号：US14689445
申请日：2015-04-17
申请人： Deere & Company
发明人： Brij N. Singh , Thomas Roan , Andrew D. Wieland , Neal D. Clements
IPC分类号： H05K7/20 , H01L23/473 , H05K1/18 , H05K3/00 , H05K1/02 , H01L23/495 , H01L23/40
CPC分类号： H05K7/20927 , H01L23/473 , H01L23/49562 , H01L2023/4056 , H05K1/0209 , H05K1/184 , H05K3/0061 , H05K2201/09063
摘要： An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads. A first heat sink comprises a first component having a mating side. A portion of the mating side is directly bonded with the metallic region of the semiconductor device. A circuit board has an opening for receiving the semiconductor device. The lead frame extends outward toward the circuit board or a board first side of the circuit board.

4. 发明申请

US20160242313A1 ELECTRONIC ASSEMBLY WITH ONE OR MORE HEAT SINKS 有权
公开(公告)号：US20160242313A1
公开(公告)日：2016-08-18
申请号：US14689445
申请日：2015-04-17
申请人： Deere & Company
发明人： Brij N. Singh , Thomas Roan , Andrew D. Wieland , Neal D. Clements
IPC分类号： H05K7/20 , H05K1/18 , H05K1/11
CPC分类号： H05K7/20927 , H01L23/473 , H01L23/49562 , H01L2023/4056 , H05K1/0209 , H05K1/184 , H05K3/0061 , H05K2201/09063
摘要： An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads. A first heat sink comprises a first component having a mating side. A portion of the mating side is directly bonded with the metallic region of the semiconductor device. A circuit board has an opening for receiving the semiconductor device. The lead frame extends outward toward the circuit board or a board first side of the circuit board.

5. 发明申请

US20160242312A1 ELECTRONIC ASSEMBLY WITH ONE OR MORE HEAT SINKS 有权
标题翻译：具有一个或多个热量的电子组件
公开(公告)号：US20160242312A1
公开(公告)日：2016-08-18
申请号：US14689528
申请日：2015-04-17
申请人： Deere & Company
发明人： Brij N. Singh , Thomas Roan , Andrew D. Wieland , Neal D. Clements
IPC分类号： H05K7/20 , H05K1/18 , H05K1/11
CPC分类号： H05K1/181 , H01L23/473 , H01L2023/4043 , H01L2023/4056 , H05K1/0203 , H05K1/0265 , H05K1/111 , H05K1/184 , H05K2201/0391
摘要： An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads. A first heat sink comprises a first component having a mating side. A portion of the mating side is directly bonded with the metallic region of the semiconductor device. A circuit board has an opening for receiving the semiconductor device. The lead frame extends outward toward the circuit board or a board first side of the circuit board.
摘要翻译：电子组件包括在半导体第一侧上具有导电焊盘的半导体器件和与第一侧相对的半导体第二侧上的金属区域。引线框架提供电气和机械连接到相应的导电焊盘的相应的单独的端子。第一散热器包括具有配合侧的第一部件。配合侧的一部分直接与半导体器件的金属区域结合。电路板具有用于接收半导体器件的开口。引线框向外朝向电路板或电路板的板第一侧向外延伸。

6. 发明申请

US20160174356A1 FILM CAPACITOR HAVING A PACKAGE FOR HEAT TRANSFER 有权
标题翻译：具有热交换的封装的薄膜电容器
公开(公告)号：US20160174356A1
公开(公告)日：2016-06-16
申请号：US14568682
申请日：2014-12-12
申请人： Deere & Company
发明人： Brij N. Singh , Thomas Roan
IPC分类号： H05K1/02 , H05K1/11 , H05K1/18 , H01G4/32 , H01G4/236
CPC分类号： H01G4/236 , H01G2/065 , H01G2/106 , H01G4/232 , H01G4/32 , H01G4/38
摘要： A capacitor comprises a first winding member, where the first winding member comprises a first dielectric layer and a first conductive layer. A second winding member comprises a second dielectric layer and second conductive layer. The first winding member is interleaved, partially or entirely, with the second winding layer. A dielectric shell or shell is adapted to at least radially contain or border the first winding member and the second winding member. The first winding member is electrically connected to a first conductive end. A second winding member is electrically connected to a second conductive end. The second conductive end is opposite the first conductive end. The first conductive end forms a first lead; the second conductive end forms a second lead.
摘要翻译：电容器包括第一绕组构件，其中第一绕组构件包括第一介电层和第一导电层。第二绕组构件包括第二电介质层和第二导电层。第一绕组构件与第二绕组层部分或全部交错。电介质外壳或壳体适于至少径向地包含或接合第一绕组构件和第二绕组构件。第一绕组构件电连接到第一导电端。第二绕组构件电连接到第二导电端。第二导电端与第一导电端相对。第一导电端形成第一导线; 第二导电端形成第二导线。

7. 发明授权

US09860987B2 Electronic assembly with one or more heat sinks 有权
公开(公告)号：US09860987B2
公开(公告)日：2018-01-02
申请号：US14689528
申请日：2015-04-17
申请人： Deere & Company
发明人： Brij N. Singh , Thomas Roan , Andrew D. Wieland , Neal D. Clements
IPC分类号： H05K1/18 , H05K1/11 , H01L23/473 , H01L23/40
CPC分类号： H05K1/181 , H01L23/473 , H01L2023/4043 , H01L2023/4056 , H05K1/0203 , H05K1/0265 , H05K1/111 , H05K1/184 , H05K2201/0391
摘要： An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads. A first heat sink comprises a first component having a mating side. A portion of the mating side is directly bonded with the metallic region of the semiconductor device. A circuit board has an opening for receiving the semiconductor device. The lead frame extends outward toward the circuit board or a board first side of the circuit board.

8. 发明授权

US09859624B2 Electrical connector assembly 有权
公开(公告)号：US09859624B2
公开(公告)日：2018-01-02
申请号：US15142433
申请日：2016-04-29
申请人： Deere & Company
发明人： Thomas Roan , Brij N. Singh , Andrew D. Wieland
IPC分类号： H01R13/02 , H01R4/02 , H01R4/18 , H01R4/04 , H01R4/30
CPC分类号： H01R4/023 , H01R4/021 , H01R4/04 , H01R4/183 , H01R4/304 , H01R4/34 , H01R12/53
摘要： An electrical connector assembly includes a first electrically conductive contact member and a second electrically conductive contact member. Both contact members have non-planar interface surfaces. The second interface surface is complimentary to the first interface surface. The first interface surface may include a plurality of elongated first ridges and a plurality of elongated first valleys, and the second interface surface may include a plurality of elongated second ridges and a plurality of elongated second valleys. A first ridge is received by a second valley and a second ridge is received by a first valley.

9. 发明申请

US20170317429A1 ELECTRICAL CONNECTOR ASSEMBLY 有权
公开(公告)号：US20170317429A1
公开(公告)日：2017-11-02
申请号：US15142433
申请日：2016-04-29
申请人： Deere & Company
发明人： Thomas Roan , Brij N. Singh , Andrew D. Wieland
IPC分类号： H01R4/02 , H01R4/04 , H01R4/18 , H01R4/30
CPC分类号： H01R4/023 , H01R4/021 , H01R4/04 , H01R4/183 , H01R4/304 , H01R4/34 , H01R12/53
摘要： An electrical connector assembly includes a first electrically conductive contact member and a second electrically conductive contact member. Both contact members have non-planar interface surfaces. The second interface surface is complimentary to the first interface surface. The first interface surface may include a plurality of elongated first ridges and a plurality of elongated first valleys, and the second interface surface may include a plurality of elongated second ridges and a plurality of elongated second valleys. A first ridge is received by a second valley and a second ridge is received by a first valley.

10. 发明授权

US09439278B2 Film capacitor having a package for heat transfer 有权
标题翻译：具有用于传热的封装的薄膜电容器
公开(公告)号：US09439278B2
公开(公告)日：2016-09-06
申请号：US14568682
申请日：2014-12-12
申请人： Deere & Company
发明人： Brij N. Singh , Thomas Roan
IPC分类号： H01L27/108 , H01L29/94 , H05K1/02 , H01G4/32 , H01G4/236 , H05K1/18 , H05K1/11
CPC分类号： H01G4/236 , H01G2/065 , H01G2/106 , H01G4/232 , H01G4/32 , H01G4/38
摘要： A capacitor comprises a first winding member, where the first winding member comprises a first dielectric layer and a first conductive layer. A second winding member comprises a second dielectric layer and second conductive layer. The first winding member is interleaved, partially or entirely, with the second winding layer. A dielectric shell or shell is adapted to at least radially contain or border the first winding member and the second winding member. The first winding member is electrically connected to a first conductive end. A second winding member is electrically connected to a second conductive end. The second conductive end is opposite the first conductive end. The first conductive end forms a first lead; the second conductive end forms a second lead.
摘要翻译：电容器包括第一绕组构件，其中第一绕组构件包括第一介电层和第一导电层。第二绕组构件包括第二电介质层和第二导电层。第一绕组构件与第二绕组层部分或全部交错。电介质外壳或壳体适于至少径向地包含或接合第一绕组构件和第二绕组构件。第一绕组构件电连接到第一导电端。第二绕组构件电连接到第二导电端。第二导电端与第一导电端相对。第一导电端形成第一导线; 第二导电端形成第二导线。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式