专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08286009B2 Computer including a carrier board and methods of assembly 失效
标题翻译：计算机包括载板和组装方法
公开(公告)号：US08286009B2
公开(公告)日：2012-10-09
申请号：US12551116
申请日：2009-08-31
申请人： David S. Slaton
发明人： David S. Slaton
IPC分类号： G06F1/00
CPC分类号： G06F1/26
摘要： A method is provided for assembling a computer that includes a carrier board having a board management controller (BMC), a power supply, and a carrier bus. The method includes coupling a module to the carrier board, determining, by the carrier board, a type of the module, and providing power to the module based on the module type such that a voltage component of the power is one of a first voltage and a second voltage that is different than the first voltage.
摘要翻译：提供一种用于组装包括具有板管理控制器（BMC），电源和载波总线的载板的计算机的方法。该方法包括将模块耦合到载板，由载板确定模块的类型，并且基于模块类型向模块提供功率，使得功率的电压分量是第一电压和与第一电压不同的第二电压。

2. 发明授权

US08091224B2 Method for coupling a battery within an embedded system 失效
标题翻译：在嵌入式系统中连接电池的方法
公开(公告)号：US08091224B2
公开(公告)日：2012-01-10
申请号：US12246200
申请日：2008-10-06
申请人： David S. Slaton , David L. McDonald , Shreenath S. Perlaguri
发明人： David S. Slaton , David L. McDonald , Shreenath S. Perlaguri
IPC分类号： H01R43/00 , H01R4/42
CPC分类号： H01R13/2442 , H01M2/1044 , H05K1/182 , H05K3/301 , H05K2201/10037 , H05K2201/10325 , H05K2201/10454 , H05K2201/10643 , Y10T29/49108 , Y10T29/4913 , Y10T29/49153 , Y10T29/49174 , Y10T29/49176 , Y10T29/49204
摘要： A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one contact.
摘要翻译：描述了一种用于在嵌入式系统内耦合电池的方法。该方法包括创建延伸穿过印刷电路板（PCB）的孔，将电池的一部分插入到孔中，以及将电池电耦合到至少一个触点。

3. 发明授权

US07679916B2 Method and system for extracting heat from electrical components 有权
标题翻译：从电气部件提取热量的方法和系统
公开(公告)号：US07679916B2
公开(公告)日：2010-03-16
申请号：US11608384
申请日：2006-12-08
申请人： Chris Erwin Orr , David S. Slaton
发明人： Chris Erwin Orr , David S. Slaton
IPC分类号： H05K7/20
CPC分类号： H05K1/0203 , B82Y10/00 , F28D15/00 , F28D15/0266 , F28D2015/0225 , F28F3/12 , H01L23/467 , H01L2224/16 , H05K1/0272 , H05K1/112 , H05K2201/026 , H05K2201/064
摘要： A system for extracting heat from an electronic device is provided. The system includes heat dissipation means positioned within a printed circuit board to form an in-board heat sink structure and a fluid heat transfer medium disposed in the heat dissipation means. The medium circulates through the heat dissipation means carrying heat away from the electronic device.
摘要翻译：提供了一种从电子设备提取热量的系统。该系统包括位于印刷电路板内的散热装置，以形成板内散热器结构和设置在散热装置中的流体传热介质。介质通过散热装置循环，从电子设备携带热量。

4. 发明授权

US08482929B2 Systems for circuit board heat transfer and method of assembling same 有权
标题翻译：电路板传热系统及其组装方法
公开(公告)号：US08482929B2
公开(公告)日：2013-07-09
申请号：US13109253
申请日：2011-05-17
申请人： David S. Slaton , David McDonald , Jerry L. Wright
发明人： David S. Slaton , David McDonald , Jerry L. Wright
IPC分类号： H05K7/20
CPC分类号： H05K1/0206 , H01L2224/16225 , H01L2224/73253 , H05K1/0207 , H05K1/116 , H05K3/0061 , H05K7/1404 , H05K7/20509 , H05K2201/10409 , Y10T29/4913
摘要： A printed circuit board assembly is provided. The assembly includes a chassis, a heatframe coupled to the chassis, a printed circuit board (PCB), a thermal interface material (TIM) coupled between the PCB and the heatframe, and at least one thermal via extending through the PCB and coupled to the TIM, wherein the assembly is configured to transfer heat from the PCB to the chassis through the TIM and the at least one thermal via.
摘要翻译：提供印刷电路板组件。该组件包括底盘，耦合到底盘的加热框架，印刷电路板（PCB），耦合在PCB和加热框架之间的热界面材料（TIM），以及至少一个延伸穿过PCB并耦合到该加热框架的热通孔 TIM，其中组件被配置成通过TIM和至少一个热通孔将热量从PCB传递到底盘。

5. 发明授权

US08347502B2 Heat sink and method of forming a heatsink using a wedge-lock system 失效
标题翻译：散热器和使用楔形锁定系统形成散热器的方法
公开(公告)号：US08347502B2
公开(公告)日：2013-01-08
申请号：US11966201
申请日：2007-12-28
申请人： David S. Slaton , David L. McDonald
发明人： David S. Slaton , David L. McDonald
IPC分类号： B21D53/02
CPC分类号： F28F21/02 , F28F3/02 , F28F21/084 , F28F21/085 , H01L21/4882 , H01L23/367 , H01L23/373 , H01L23/4006 , H01L2023/4068 , H01L2023/4075 , H01L2924/0002 , H01L2924/3011 , Y10T29/4935 , H01L2924/00
摘要： The present disclosure is related to a heatsink and a method for forming a heatsink. In one embodiment, a method for forming the heatsink includes forming at least one thermo pyrolytic graphite element. The at least one TPG element includes a first side having a wedge-shaped surface and a second side having a flat surface. The method further includes layering a metal material over the at least one TPG element, the metal configured to be complementary to the first side of the at least one TPG element, and applying pressure to fasten the metal material to the at least one TPG element.
摘要翻译：本公开涉及散热器和形成散热器的方法。在一个实施例中，形成散热器的方法包括形成至少一个热解石墨元件。所述至少一个TPG元件包括具有楔形表面的第一侧和具有平坦表面的第二侧。所述方法还包括在所述至少一个TPG元件上层叠金属材料，所述金属被配置为与所述至少一个TPG元件的第一侧互补，并且施加压力以将所述金属材料紧固到所述至少一个TPG元件。

6. 发明授权

US07312992B2 Apparatus and method for transferring heat from processors 失效
标题翻译：用于从处理器传送热量的装置和方法
公开(公告)号：US07312992B2
公开(公告)日：2007-12-25
申请号：US10999725
申请日：2004-11-30
申请人： Edward M. Jory , David S. Slaton
发明人： Edward M. Jory , David S. Slaton
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H05K7/20727
摘要： A heat exchange apparatus having a housing that includes a first region and a second region, and a wall separating the first region from the second region, is disclosed. The second region includes a fluid flow entry port and a fluid flow exit port to define a fluid flow path, and a heat exchanger exposed to the fluid flow path. The heat exchanger includes first and second portions in thermal communication with each other, where the first portion is disposed at the first region and the second portion is disposed at the second region. The fluid flow path is isolated from the first region and provides for the removal of heat from the first region.
摘要翻译：公开了一种具有包括第一区域和第二区域的壳体以及将第一区域与第二区域分开的壁的热交换装置。第二区域包括流体流入口和流体流出口以限定流体流动路径，以及暴露于流体流动路径的热交换器。热交换器包括彼此热连通的第一和第二部分，其中第一部分设置在第一区域，第二部分设置在第二区域。流体流动路径与第一区域隔离并且提供从第一区域去除热量。

7. 发明申请

US20120039053A1 SYSTEM AND METHOD FOR COUPLING A BATTERY WITHIN AN EMBEDDED SYSTEM 审中-公开
标题翻译：在嵌入式系统中连接电池的系统和方法
公开(公告)号：US20120039053A1
公开(公告)日：2012-02-16
申请号：US13283655
申请日：2011-10-28
申请人： David S. Slaton , David L. McDonald , Shreenath S. Perlaguri
发明人： David S. Slaton , David L. McDonald , Shreenath S. Perlaguri
IPC分类号： H05K5/00 , H05K1/11 , H05K7/00 , H05K3/30
CPC分类号： H01R13/2442 , H01M2/1044 , H05K1/182 , H05K3/301 , H05K2201/10037 , H05K2201/10325 , H05K2201/10454 , H05K2201/10643 , Y10T29/49108 , Y10T29/4913 , Y10T29/49153 , Y10T29/49174 , Y10T29/49176 , Y10T29/49204
摘要： A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one contact.
摘要翻译：描述了一种用于在嵌入式系统内耦合电池的方法。该方法包括创建延伸穿过印刷电路板（PCB）的孔，将电池的一部分插入到孔中，以及将电池电耦合到至少一个触点。

8. 发明授权

US08047853B2 Printed circuit board with an adaptable connector module 失效
标题翻译：具有适应性连接器模块的印刷电路板
公开(公告)号：US08047853B2
公开(公告)日：2011-11-01
申请号：US12399608
申请日：2009-03-06
申请人： David S. Slaton
发明人： David S. Slaton
IPC分类号： H01R12/00
CPC分类号： H05K1/0295 , H01R12/724 , H05K1/182 , H05K7/1461 , H05K2201/09954 , H05K2201/10189 , H05K2201/10446 , H05K2201/10522
摘要： A printed circuit board including a P1 connector, a P2 connector, and a first common connector configured to connect an application-specific connector to the printed circuit board.
摘要翻译：一种印刷电路板，包括P1连接器，P2连接器和被配置为将专用连接器连接到印刷电路板的第一公共连接器。

9. 发明申请

US20080137307A1 METHOD AND SYSTEM FOR EXTRACTING HEAT FROM ELECTRICAL COMPONENTS 有权
标题翻译：从电气元件中提取热量的方法和系统
公开(公告)号：US20080137307A1
公开(公告)日：2008-06-12
申请号：US11608384
申请日：2006-12-08
申请人： Chris Erwin Orr , David S. Slaton
发明人： Chris Erwin Orr , David S. Slaton
IPC分类号： H05K7/20
CPC分类号： H05K1/0203 , B82Y10/00 , F28D15/00 , F28D15/0266 , F28D2015/0225 , F28F3/12 , H01L23/467 , H01L2224/16 , H05K1/0272 , H05K1/112 , H05K2201/026 , H05K2201/064
摘要： A system for extracting heat from an electronic device is provided. The system includes heat dissipation means positioned within a printed circuit board to form an in-board heat sink structure and a fluid heat transfer medium disposed in the heat dissipation means. The medium circulates through the heat dissipation means carrying heat away from the electronic device.
摘要翻译：提供了一种从电子设备提取热量的系统。该系统包括位于印刷电路板内的散热装置，以形成板内散热器结构和设置在散热装置中的流体传热介质。介质通过散热装置循环，从电子设备携带热量。

10. 发明申请

US20100225306A1 PRINTED CIRCUIT BOARD WITH AN ADAPTABLE CONNECTOR MODULE 失效
标题翻译：具有适配器连接器模块的印刷电路板
公开(公告)号：US20100225306A1
公开(公告)日：2010-09-09
申请号：US12399608
申请日：2009-03-06
申请人： David S. Slaton
发明人： David S. Slaton
IPC分类号： G01R1/06 , H01R12/00 , H01R12/16
CPC分类号： H05K1/0295 , H01R12/724 , H05K1/182 , H05K7/1461 , H05K2201/09954 , H05K2201/10189 , H05K2201/10446 , H05K2201/10522
摘要： A printed circuit board including a P1 connector, a P2 connector, and a first common connector configured to connect an application-specific connector to the printed circuit board.
摘要翻译：一种印刷电路板，包括P1连接器，P2连接器和被配置为将专用连接器连接到印刷电路板的第一公共连接器。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式