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1. 发明申请

US20100083497A1 SYSTEM AND METHOD FOR COUPLING A BATTERY WITHIN AN EMBEDDED SYSTEM 失效
标题翻译：在嵌入式系统中连接电池的系统和方法
公开(公告)号：US20100083497A1
公开(公告)日：2010-04-08
申请号：US12246200
申请日：2008-10-06
申请人： David S. SLATON , David L. McDonald , Shreenath S. Perlaguri
发明人： David S. SLATON , David L. McDonald , Shreenath S. Perlaguri
IPC分类号： H01R43/00 , H01R4/42
CPC分类号： H01R13/2442 , H01M2/1044 , H05K1/182 , H05K3/301 , H05K2201/10037 , H05K2201/10325 , H05K2201/10454 , H05K2201/10643 , Y10T29/49108 , Y10T29/4913 , Y10T29/49153 , Y10T29/49174 , Y10T29/49176 , Y10T29/49204
摘要： A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one contact.
摘要翻译：描述了一种用于在嵌入式系统内耦合电池的方法。该方法包括创建延伸穿过印刷电路板（PCB）的孔，将电池的一部分插入到孔中，以及将电池电耦合到至少一个触点。

2. 发明授权

US08347502B2 Heat sink and method of forming a heatsink using a wedge-lock system 失效
标题翻译：散热器和使用楔形锁定系统形成散热器的方法
公开(公告)号：US08347502B2
公开(公告)日：2013-01-08
申请号：US11966201
申请日：2007-12-28
申请人： David S. Slaton , David L. McDonald
发明人： David S. Slaton , David L. McDonald
IPC分类号： B21D53/02
CPC分类号： F28F21/02 , F28F3/02 , F28F21/084 , F28F21/085 , H01L21/4882 , H01L23/367 , H01L23/373 , H01L23/4006 , H01L2023/4068 , H01L2023/4075 , H01L2924/0002 , H01L2924/3011 , Y10T29/4935 , H01L2924/00
摘要： The present disclosure is related to a heatsink and a method for forming a heatsink. In one embodiment, a method for forming the heatsink includes forming at least one thermo pyrolytic graphite element. The at least one TPG element includes a first side having a wedge-shaped surface and a second side having a flat surface. The method further includes layering a metal material over the at least one TPG element, the metal configured to be complementary to the first side of the at least one TPG element, and applying pressure to fasten the metal material to the at least one TPG element.
摘要翻译：本公开涉及散热器和形成散热器的方法。在一个实施例中，形成散热器的方法包括形成至少一个热解石墨元件。所述至少一个TPG元件包括具有楔形表面的第一侧和具有平坦表面的第二侧。所述方法还包括在所述至少一个TPG元件上层叠金属材料，所述金属被配置为与所述至少一个TPG元件的第一侧互补，并且施加压力以将所述金属材料紧固到所述至少一个TPG元件。

3. 发明申请

US20090169410A1 METHOD OF FORMING A THERMO PYROLYTIC GRAPHITE-EMBEDDED HEATSINK 审中-公开
标题翻译：形成热稳定石墨嵌入式热电偶的方法
公开(公告)号：US20090169410A1
公开(公告)日：2009-07-02
申请号：US11967307
申请日：2007-12-31
申请人： David S. Slaton , David L. McDonald
发明人： David S. Slaton , David L. McDonald
IPC分类号： B22F7/06 , B22D23/00
CPC分类号： H01L23/373 , B22D19/00 , H01L21/4871 , H01L23/367 , H01L2924/0002 , H01L2924/00
摘要： The present disclosure is related to creating blocks of aluminum and/or copper material having embedded TPG elements for forming heatsinks. The metal blocks have an improved thermal conductivity in the X-Y plane. Furthermore, the TPG-embedded heatsinks can be created using methods capable of being performed using various machines and equipment in many various facilities.
摘要翻译：本公开涉及产生具有用于形成散热器的嵌入式TPG元件的铝和/或铜材料块。金属块在X-Y平面上具有改善的导热性。此外，可以使用能够在许多不同设施中使用各种机器和设备执行的方法来创建TPG嵌入式散热器。

4. 发明申请

US20090166021A1 HEAT SINK AND METHOD OF FORMING A HEATSINK USING A WEDGE-LOCK SYSTEM 失效
标题翻译：散热器和使用楔形系统形成散热片的方法
公开(公告)号：US20090166021A1
公开(公告)日：2009-07-02
申请号：US11966201
申请日：2007-12-28
申请人： David S. Slaton , David L. McDonald
发明人： David S. Slaton , David L. McDonald
IPC分类号： F28F7/00
CPC分类号： F28F21/02 , F28F3/02 , F28F21/084 , F28F21/085 , H01L21/4882 , H01L23/367 , H01L23/373 , H01L23/4006 , H01L2023/4068 , H01L2023/4075 , H01L2924/0002 , H01L2924/3011 , Y10T29/4935 , H01L2924/00
摘要： The present disclosure is related to a heatsink and a method for forming a heatsink. In one embodiment, a method for forming the heatsink includes forming at least one thermo pyrolytic graphite element. The at least one TPG element includes a first side having a wedge-shaped surface and a second side having a flat surface. The method further includes layering a metal material over the at least one TPG element, the metal configured to be complementary to the first side of the at least one TPG element, and applying pressure to fasten the metal material to the at least one TPG element.
摘要翻译：本公开涉及散热器和形成散热器的方法。在一个实施例中，形成散热器的方法包括形成至少一个热解石墨元件。所述至少一个TPG元件包括具有楔形表面的第一侧和具有平坦表面的第二侧。所述方法还包括在所述至少一个TPG元件上层叠金属材料，所述金属被配置为与所述至少一个TPG元件的第一侧互补，并且施加压力以将所述金属材料紧固到所述至少一个TPG元件。

5. 发明授权

US08091224B2 Method for coupling a battery within an embedded system 失效
标题翻译：在嵌入式系统中连接电池的方法
公开(公告)号：US08091224B2
公开(公告)日：2012-01-10
申请号：US12246200
申请日：2008-10-06
申请人： David S. Slaton , David L. McDonald , Shreenath S. Perlaguri
发明人： David S. Slaton , David L. McDonald , Shreenath S. Perlaguri
IPC分类号： H01R43/00 , H01R4/42
CPC分类号： H01R13/2442 , H01M2/1044 , H05K1/182 , H05K3/301 , H05K2201/10037 , H05K2201/10325 , H05K2201/10454 , H05K2201/10643 , Y10T29/49108 , Y10T29/4913 , Y10T29/49153 , Y10T29/49174 , Y10T29/49176 , Y10T29/49204
摘要： A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one contact.
摘要翻译：描述了一种用于在嵌入式系统内耦合电池的方法。该方法包括创建延伸穿过印刷电路板（PCB）的孔，将电池的一部分插入到孔中，以及将电池电耦合到至少一个触点。

6. 发明申请

US20120039053A1 SYSTEM AND METHOD FOR COUPLING A BATTERY WITHIN AN EMBEDDED SYSTEM 审中-公开
标题翻译：在嵌入式系统中连接电池的系统和方法
公开(公告)号：US20120039053A1
公开(公告)日：2012-02-16
申请号：US13283655
申请日：2011-10-28
申请人： David S. Slaton , David L. McDonald , Shreenath S. Perlaguri
发明人： David S. Slaton , David L. McDonald , Shreenath S. Perlaguri
IPC分类号： H05K5/00 , H05K1/11 , H05K7/00 , H05K3/30
CPC分类号： H01R13/2442 , H01M2/1044 , H05K1/182 , H05K3/301 , H05K2201/10037 , H05K2201/10325 , H05K2201/10454 , H05K2201/10643 , Y10T29/49108 , Y10T29/4913 , Y10T29/49153 , Y10T29/49174 , Y10T29/49176 , Y10T29/49204
摘要： A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one contact.
摘要翻译：描述了一种用于在嵌入式系统内耦合电池的方法。该方法包括创建延伸穿过印刷电路板（PCB）的孔，将电池的一部分插入到孔中，以及将电池电耦合到至少一个触点。

7. 发明申请

US20090165302A1 METHOD OF FORMING A HEATSINK 审中-公开
标题翻译：形成HEATSINK的方法
公开(公告)号：US20090165302A1
公开(公告)日：2009-07-02
申请号：US11967298
申请日：2007-12-31
申请人： David S. SLATON , David L. McDonald
发明人： David S. SLATON , David L. McDonald
IPC分类号： B23P15/26 , B23K1/20
CPC分类号： H05K7/20509 , F28F13/00 , G06F1/20 , H01L21/4882 , H01L23/367 , H01L23/373 , H01L2924/0002 , H01L2924/3011 , Y10T29/49393 , H01L2924/00
摘要： The present disclosure is related to methods for bonding TPG elements to at least a first metal material for forming a heatsink. The heatsinks have an improved thermal conductivity in the X-Y plane.
摘要翻译：本公开涉及用于将TPG元件结合到用于形成散热器的至少第一金属材料的方法。散热片在X-Y平面上具有改善的热导率。

8. 发明授权

US08300424B2 Mounting bracket for use with a computer and method of assembling a computer 有权
标题翻译：用于计算机的安装支架和组装电脑的方法
公开(公告)号：US08300424B2
公开(公告)日：2012-10-30
申请号：US12277430
申请日：2008-11-25
申请人： Jerry Wright , David L. McDonald
发明人： Jerry Wright , David L. McDonald
IPC分类号： H05K7/14
CPC分类号： G06F1/185 , Y10T29/4913
摘要： A mounting bracket for securing a mezzanine card in a stacked single board computer includes a main body that includes a first end, an opposite second end, a first side surface, and an opposite second side surface. The main body is sized to be positioned along a side surface of the mezzanine card, wherein the first side surface or the second side surface contacts the side surface of the mezzanine card to facilitate securing the side surface of the mezzanine card with respect to a top PCB. The mounting bracket also includes a first arm formed at the first end of the main body, a second arm formed at the second end of the main body, and at least one top rail coupled to the main body, wherein the top rail is configured to secure a top surface of the mezzanine card with respect to a top PCB.
摘要翻译：用于将夹层卡固定在堆叠的单板计算机中的安装支架包括：主体，其包括第一端，相对的第二端，第一侧表面和相对的第二侧表面。主体的尺寸设置成沿着夹层卡的侧面定位，其中第一侧表面或第二侧表面接触夹层卡的侧表面，以便于夹紧夹层卡相对于顶板的侧表面 PCB。安装支架还包括形成在主体的第一端的第一臂，形成在主体的第二端的第二臂和耦合到主体的至少一个顶部导轨，其中顶部导轨被配置成相对于顶部PCB固定夹层卡的顶面。

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