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    • 9. 发明授权
    • EMI shield, and assembly using same
    • EMI屏蔽和使用它们的组装
    • US5357404A
    • 1994-10-18
    • US156520
    • 1993-11-22
    • Edward J. BrightJay F. MaltaisAttalee S. Taylor
    • Edward J. BrightJay F. MaltaisAttalee S. Taylor
    • H01L23/40H05K7/10H05K7/20
    • H05K7/1084H01L23/4093H01L2924/0002Y10T24/44026
    • The assembly of an electronic package, a socket which holds the package, an electrically-conductive heat sink placed over and around the package, and an EMI shield for minimizing EMI leakage. The shield is a metal frame extending around the socket and package, and secured to it by locking tabs extending inwardly from the frame to detents on the edges of the socket. The socket contains double-wall structures spaced along its periphery which support the frame when it is on the socket, and the heat sink is provided with depending skirts which extend downwardly on all sides of the socket and package, to contribute additional EMI shielding. The sink is held to the socket by resilient retainers, each secured at one end to an upper surface of the heat sink and extending downwardly through the heat sink to be releasably secured to latching detents on the edges of the socket, by means of latches located inside the frame. The double-wall structures hold the frame outward from the latching detents sufficiently that the latches of the retainer fit between the edges of the socket and the inside of the frame.
    • 电子封装的组件,保持封装的插座,放置在封装周围和周围的导电散热器,以及用于最小化EMI泄漏的EMI屏蔽。 屏蔽是围绕插座和封装延伸的金属框架,并且通过从框架向内延伸的锁定片固定到其上以在插座的边缘上定位。 插座包含沿其周边隔开的双壁结构,当框架位于插座上时支撑框架,并且散热器设置有在插座和封装的所有侧面向下延伸的依靠裙部,以提供额外的EMI屏蔽。 水槽通过弹性保持器固定到插座上,每个固定器的一端固定在散热器的上表面上,并向下延伸穿过散热器,以通过位于插座的锁定器可释放地固定到插座边缘上的闭锁定位 在框架内。 双壁结构将框架从闩锁定位器向外保持,使得保持器的闩锁配合在插座的边缘和框架的内部之间。