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1. 发明授权

US5764482A Integrated circuit heat seat 失效
标题翻译：集成电路座椅
公开(公告)号：US5764482A
公开(公告)日：1998-06-09
申请号：US685252
申请日：1996-07-24
申请人： George A. Meyer, IV , Jerome E. Toth , Mai-Loan Tran , Attalee S. Taylor
发明人： George A. Meyer, IV , Jerome E. Toth , Mai-Loan Tran , Attalee S. Taylor
IPC分类号： H01L23/427 , H05K7/10 , H05K7/20
CPC分类号： H01L23/427 , H05K7/1023 , H01L2924/0002
摘要： The apparatus is a heat sink for an integrated circuit chip which uses heat pipe cooling to remove the heat. The heat sink is a heat conductive structure such as a bowl which is associated with the integrated circuit socket, with the heat conductive structure held against the integrated circuit. A heat pipe is attached to the structure by using an extension from the heat conductive structure and wrapping the extension around a simple cylindrical heat pipe. One embodiment uses spring clips to attach the heat sink to the socket, and another version uses attachment screws through tabs which are formed from the material around a bowl shaped heat conductive structure.
摘要翻译：该装置是使用热管冷却来消除热量的集成电路芯片的散热器。散热器是与集成电路插座相关联的导热结构，例如碗，导热结构保持在集成电路上。热管通过使用来自导热结构的延伸部并且围绕简单的圆柱形热管缠绕延伸部而附接到结构。一个实施例使用弹簧夹将散热器附接到插座，并且另一版本使用通过由围绕碗形导热结构的材料形成的突片的附接螺钉。

2. 发明授权

US5826645A Integrated circuit heat sink with rotatable heat pipe 失效
标题翻译：集成电路散热器，带旋转式热管
公开(公告)号：US5826645A
公开(公告)日：1998-10-27
申请号：US844811
申请日：1997-04-23
申请人： George A. Meyer, IV , Jerome E. Toth
发明人： George A. Meyer, IV , Jerome E. Toth
IPC分类号： F28D15/02 , H01L23/427 , F28D15/00
CPC分类号： H01L23/427 , F28D15/02 , H01L2924/0002
摘要： An apparatus is a heat conducting connection between a heat pipe and a structure such as an integrated circuit heat sink. The heat sink contains a groove with extension tabs protruding above edges of the groove so that the tabs can be bent over to hold the heat pipe in the groove which is dimensioned to give a clearance space around the heat pipe. When the tabs are bent down far enough to deform the heat pipe or a heat conductive hardening material is used to fill the clearance space, the heat pipe is fixed in place. If the tabs are bent down to barely contact the heat pipe and a heat conductive non-hardening material is used to fill the clearance space, the heat pipe can still be rotated within the groove.
摘要翻译：一种装置是热管和诸如集成电路散热器的结构之间的导热连接。散热器包含一个具有突出于槽的边缘之上的延伸片的槽，使得突出部可以被弯曲以将热管保持在槽中，其尺寸被设计成在热管周围提供间隙空间。当突片向下弯曲得足够远以使热管变形时，或者使用导热硬化材料填充间隙空间时，将热管固定就位。如果突片弯曲到几乎不接触热管，并且使用导热非硬化材料来填充间隙空间，则热管仍然可以在凹槽内旋转。

3. 发明授权

US5642776A Electrically insulated envelope heat pipe 失效
标题翻译：电绝缘信封热管
公开(公告)号：US5642776A
公开(公告)日：1997-07-01
申请号：US607897
申请日：1996-02-27
申请人： George A. Meyer, IV , Scott D. Garner
发明人： George A. Meyer, IV , Scott D. Garner
IPC分类号： F28D15/02 , F28D15/04 , H01L23/427 , F28D15/00
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/046 , H01L2924/0002
摘要： The disclosure is for a heat pipe in the form of a simple foil envelope and a method of constructing such a heat pipe. Two plastic coated metal foil sheets are sealed together on all four edges to enclose a semi-rigid channeled sheet of plastic foam, and the envelope is evacuated and loaded with a suitable quantity of liquid to act as a heat pipe. Despite the use of the essentially poor thermally conductive materials such as the plastic coating on the surface of the casing and the foam plastic for the wick, the apparatus operates well as a heat spreader for an integrated circuit chip placed in contact with the envelope surface. The heat is transferred across the thin plastic coating with only a small temperature differential, and the foam plastic wick with channels efficiently transports condensed liquid back to the heat input location for evaporation.
摘要翻译：本发明公开的是一种简单的箔壳形式的热管和一种构造这种热管的方法。两个塑料涂覆的金属箔片在所有四个边缘上密封在一起，以封闭一个半刚性的塑料泡沫塑料片，并且将该信封抽真空并加载适量的液体作为热管。尽管使用基本上差的导热材料，例如外壳表面上的塑料涂层和用于芯的泡沫塑料，该装置作为用于与封套表面接触的集成电路芯片的散热器运行良好。热量仅通过较小的温差传递到薄的塑料涂层上，并且具有通道的泡沫塑料芯将有效地将冷凝的液体输送回热输入位置进行蒸发。

4. 发明授权

US5549155A Integrated circuit cooling apparatus 失效
标题翻译：集成电路冷却装置
公开(公告)号：US5549155A
公开(公告)日：1996-08-27
申请号：US424791
申请日：1995-04-18
申请人： George A. Meyer, IV , Jerome E. Toth , Richard W. Longsderff
发明人： George A. Meyer, IV , Jerome E. Toth , Richard W. Longsderff
IPC分类号： F28D15/02 , H01L23/427 , F28D15/00
CPC分类号： H01L23/427 , F28D15/0275 , H01L2924/0002
摘要： The apparatus is a cooling device for an integrated circuit chip which includes a heat conductive pad for contact with the top surface of the chip and for attachment to a heat pipe to dispose of the heat. One surface of the pad is flat and contacts the circuit chip while the opposite surface of the pad is attached to a simple cylindrical heat pipe. The pad includes extensions from its sides to which a holding fixture applies force so that the pad is held tightly against the chip. The holding fixture is held on the mounting board by screws while the top of the pad which is attached to the heat pipe protrudes through a hole in the holding fixture. A finned heat exchanger is attached to an end of the heat pipe remote from the conductive pad.
摘要翻译：该装置是用于集成电路芯片的冷却装置，其包括用于与芯片的顶表面接触并用于附接到热管以处理热量的导热垫。焊盘的一个表面是平的并与电路芯片接触，而焊盘的相对表面附接到简单的圆柱形热管。该垫包括从其侧面延伸的保持夹具施加的力，使得垫紧紧地保持在芯片上。保持夹具通过螺钉固定在安装板上，而安装在热管上的垫的顶部通过保持夹具中的孔突出。翅片式热交换器附接到远离导电垫的热管的一端。

5. 发明授权

US5822187A Heat pipes inserted into first and second parallel holes in a block for transferring heat between hinged devices 失效
标题翻译：插入块中的第一和第二平行孔中的热管在铰链装置之间传递热量
公开(公告)号：US5822187A
公开(公告)日：1998-10-13
申请号：US735191
申请日：1996-10-25
申请人： Scott D. Garner , George A. Meyer, IV , Jerome E. Toth , Richard W. Longsderff
发明人： Scott D. Garner , George A. Meyer, IV , Jerome E. Toth , Richard W. Longsderff
IPC分类号： F28D15/02 , G06F1/16 , G06F1/20 , H05K7/20
CPC分类号： G06F1/203 , F28D15/02
摘要： The apparatus is a device for transferring heat across the hinged joint between the two sections of the case of a laptop computer. Two simple heat pipe cylinders are inserted into parallel cylindrical holes in a heat conductive block. One cylinder is bonded within its hole, and the other cylinder is permitted to rotate within its hole. The axis of the rotatable cylinder is located in line with the axis of the mechanical hinges which permit the panels to pivot relative to each other. A heat producing device in one panel can be then attached to one heat pipe, and a heat sink on the other panel can be attached to the other heat pipe. The heat transfer between the heat source and the heat sink is essentially that of a heat pipe except for the very short heat conductive path through the solid block and the one rotating joint.
摘要翻译：该装置是用于将热量传递到膝上型计算机的壳体的两个部分之间的铰链接头的装置。两个简单的热管筒被插入到导热块的平行圆柱形孔中。一个气缸在其孔内结合，另一个气缸允许在其孔内旋转。可旋转圆柱体的轴线与允许面板相对于彼此枢转的机械铰链的轴线成一直线。然后将一个面板中的发热装置连接到一个热管，另一个面板上的散热器可以附接到另一个热管。热源和散热器之间的热传递基本上是热管的传热，除了通过固体块和一个旋转接头的非常短的导热路径。

6. 发明授权

US5725050A Integrated circuit with taped heat pipe 失效
标题翻译：带胶带热管的集成电路
公开(公告)号：US5725050A
公开(公告)日：1998-03-10
申请号：US706882
申请日：1996-09-03
申请人： George A. Meyer, IV , Jerome E. Toth
发明人： George A. Meyer, IV , Jerome E. Toth
IPC分类号： F28F13/00 , H01L23/427 , F28D15/00
CPC分类号： F28D15/0266 , F28D15/0275 , F28F13/00 , H01L23/427 , H01L2924/0002
摘要： The invention is an apparatus for attaching a heat pipe to an integrated circuit or other surface. The heat pipe is held against the flat surface by a heat conducting clamp constructed as a "U" cross section with flanges on the ends of the "U" section, and both the heat pipe and the clamp are held onto the integrated circuit or other surface with heat conductive tape which has adhesive on both its faces. The heat pipe itself can be deformed so that its contact surface also is flat and yields better heat transfer with the integrated circuit.
摘要翻译：本发明是一种用于将热管附接到集成电路或其他表面的装置。热管通过一个构造为“U”横截面的导热夹具保持在平坦表面上，在“U”部分的端部具有凸缘，并且热管和夹具都保持在集成电路或其他表面具有导热胶带，其两面具有粘合剂。热管本身可以变形，使得其接触表面也是平坦的，并且与集成电路产生更好的热传递。

7. 发明授权

US4880052A Heat pipe cooling plate 失效
标题翻译：热管冷却板
公开(公告)号：US4880052A
公开(公告)日：1989-11-14
申请号：US316407
申请日：1989-02-27
申请人： George A. Meyer, IV , Robert F. Coleman
发明人： George A. Meyer, IV , Robert F. Coleman
IPC分类号： F28D15/02 , F28D15/04
CPC分类号： F28D15/04 , F28D15/0233 , F28F2275/06 , Y10T29/49353
摘要： A flat cooling plate which is assembled with individual heat pipes which are annealed, flattened tubes with sintered wicks formed within them. The completely constructed and pre-tested heat pipes are set into slots in a spacer plate which is sandwiched between two unslotted flat sheets. For assembly, bonding material is placed between the slotted plate and unslotted sheets, and the assembly is heated to the bonding material working temperature while compressed in a press in order to prevent damage from excessive internal heat pipe pressure.
摘要翻译：一个扁平冷却板，它与单独的热管组装在一起，这些热管是退火的扁平管，其中形成有烧结芯。将完全构造和预测试的热管设置在间隔板中的狭槽中，间隔板夹在两个未被打印的平板之间。为了组装，将接合材料放置在开槽板和未被切割的片材之间，并且在压机中压缩时将组件加热到接合材料的工作温度，以防止内部热管压力过大造成的损坏。

8. 发明授权

US5168921A Cooling plate with internal expandable heat pipe 失效
标题翻译：冷却板带有可扩展的热管
公开(公告)号：US5168921A
公开(公告)日：1992-12-08
申请号：US813901
申请日：1991-12-23
申请人： George A. Meyer, IV
发明人： George A. Meyer, IV
IPC分类号： F28D15/02
CPC分类号： F28D15/0233 , F28D15/0241 , Y10T29/49353
摘要： A heat pipe cooling plate in which one or more heat pipes sandwiched between cover plates is an expandable heat pipe made with thin flexible walls forming the heat pipe casing. One advantage of such an expandable heat pipe within the cooling plate structure is that the heat pipe need not be bonded to the outer casing. Instead, the heat pipe balloons out when the vapor pressure increases upon heating, and the flexible heat pipe casing moves into intimate contact with the boundary surfaces of the cooling plate.
摘要翻译：一种热管冷却板，其中夹在盖板之间的一个或多个热管是由形成热管壳体的薄柔性壁制成的可膨胀热管。这种可膨胀热管在冷却板结构内的一个优点是热管不需要结合到外壳。相反，当加热时蒸汽压增加时，热管气球流出，柔性热管壳体与冷却板的边界面紧密接触。

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