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1. 发明授权

US09126400B2 Negotiable instruments with intelligent microprint 有权
标题翻译：具有智能微型打印的面议仪器
公开(公告)号：US09126400B2
公开(公告)日：2015-09-08
申请号：US13289840
申请日：2011-11-04
申请人： David S. Davies , Robert A. Owen
发明人： David S. Davies , Robert A. Owen
IPC分类号： G06K19/06 , B41J3/01
CPC分类号： B41J3/01 , B41J2/01 , B41J2/442 , B41M3/14 , B42D25/21 , B42D25/30 , B42D25/405 , G06F3/1258 , G06K15/1809 , G06K15/1852 , G06Q20/042 , G06Q30/0621 , G06Q30/0635 , G06Q40/02 , H04N1/32149 , H04N2201/3236
摘要： A negotiable instrument such as a check includes a unique microprint identifier that allows for authentication while preventing unauthorized reproduction and alternation. A printing system generates the identifier after receiving a customer order for printing a plurality of negotiable instruments, to allow inclusion of information that is specific to the customer order and/or the printing process. In various embodiments, the identifier is unique to each or each subset of the plurality of negotiable instruments and facilitates authentication of each of the negotiable instruments when needed.
摘要翻译：诸如支票的可转让票据包括独特的微型打印标识符，其允许认证，同时防止未授权的再现和交替。打印系统在接收到用于打印多个可转让票据的客户订单之后生成标识符，以允许包含特定于客户订单和/或打印处理的信息。在各种实施例中，标识符对于多个可转让票据的每一个或每个子集是唯一的，并且有助于在需要时对每个可转让票据的认证。

2. 发明申请

US20130112759A1 NEGOTIABLE INSTRUMENTS WITH INTELLIGENT MICROPRINT 有权
公开(公告)号：US20130112759A1
公开(公告)日：2013-05-09
申请号：US13289840
申请日：2011-11-04
申请人： David S. Davies , Robert A. Owen
发明人： David S. Davies , Robert A. Owen
IPC分类号： G06K19/06 , B41J2/01
CPC分类号： B41J3/01 , B41J2/01 , B41J2/442 , B41M3/14 , B42D25/21 , B42D25/30 , B42D25/405 , G06F3/1258 , G06K15/1809 , G06K15/1852 , G06Q20/042 , G06Q30/0621 , G06Q30/0635 , G06Q40/02 , H04N1/32149 , H04N2201/3236
摘要： A negotiable instrument such as a check includes a unique microprint identifier that allows for authentication while preventing unauthorized reproduction and alternation. A printing system generates the identifier after receiving a customer order for printing a plurality of negotiable instruments, to allow inclusion of information that is specific to the customer order and/or the printing process. In various embodiments, the identifier is unique to each or each subset of the plurality of negotiable instruments and facilitates authentication of each of the negotiable instruments when needed.

3. 发明授权

US08978990B2 Negotiable instruments with intelligent microprint 有权
公开(公告)号：US08978990B2
公开(公告)日：2015-03-17
申请号：US13289840
申请日：2011-11-04
申请人： David S. Davies , Robert A. Owen
发明人： David S. Davies , Robert A. Owen
IPC分类号： G06K19/06 , B41J3/01
摘要： A negotiable instrument such as a check includes a unique microprint identifier that allows for authentication while preventing unauthorized reproduction and alternation. A printing system generates the identifier after receiving a customer order for printing a plurality of negotiable instruments, to allow inclusion of information that is specific to the customer order and/or the printing process. In various embodiments, the identifier is unique to each or each subset of the plurality of negotiable instruments and facilitates authentication of each of the negotiable instruments when needed.

4. 发明授权

US07122788B1 Adaptively reducing offset in a thermal imaging camera 有权
标题翻译：适应性地降低热像仪中的偏移
公开(公告)号：US07122788B1
公开(公告)日：2006-10-17
申请号：US10961975
申请日：2004-10-08
申请人： Robert A. Owen , Vicki D. Paul , Humphrey W. Ha , Roger C. Knott , Mark A. Gohlke , Charles M. Hanson
发明人： Robert A. Owen , Vicki D. Paul , Humphrey W. Ha , Roger C. Knott , Mark A. Gohlke , Charles M. Hanson
IPC分类号： G01D18/00
CPC分类号： H04N5/33 , H04N5/361 , H04N5/3651
摘要： Collecting samples to adjust a signal includes providing a shutter in an opened position to allow a detector of an infrared camera to detect infrared radiation and generate a signal corresponding to the infrared radiation. A first touchup iteration is initiated by moving the shutter to a closed position, and samples of a reference frame are collected according to a collection instruction. The shutter is then moved to the opened position. If there is a change in a state of the infrared camera, the collection instruction is adjusted in response to the change. A second touchup iteration is initiated by moving the shutter to the closed position, and samples are collected according to the adjusted collection instruction. A modification of the signal is determined in accordance with at least some of the samples.
摘要翻译：收集样品以调整信号包括在打开位置提供快门以允许红外摄像机的检测器检测红外辐射并产生对应于红外辐射的信号。通过将快门移动到关闭位置来启动第一触摸迭代，并且根据收集指令来收集参考帧的采样。然后将快门移动到打开位置。如果红外线摄像机的状态发生变化，则响应于该变化来调整收集指令。通过将快门移动到关闭位置来启动第二次触摸迭代，并且根据调整的收集指令收集样本。根据至少一些采样来确定信号的修改。

5. 发明授权

US5959298A Infrared detector array with an elevated thin film 失效
标题翻译：具有升高的薄膜的红外探测器阵列
公开(公告)号：US5959298A
公开(公告)日：1999-09-28
申请号：US665135
申请日：1996-06-14
申请人： James F. Belcher , Robert A. Owen
发明人： James F. Belcher , Robert A. Owen
IPC分类号： H01L27/146 , H01L37/02 , G01J5/54
CPC分类号： H01L37/02 , H01L27/1465
摘要： A novel reticulated array comprises islands of ceramic (e.g. BST 40) which are fabricated from novel materials using unique methods of patterning. A shallow etch stop trench (46) is first ion milled around each ceramic island on front side and then filled with an etch stop material (e.g. parylene 48). An optical coat (e.g transparent metal layer 54, transparent organic layer 56 and conductive metallic layer 58) is elevated above the etch stop material by an elevation layer (e.g. polyimide 49). For some applications, it has been experimentally verified that there is no loss, and sometimes a measured increase, in optical efficiency when the optical coating is not planar in topology. Novel fabrication methods also provide for the convenient electrical and mechanical bonding of each of the massive number of ceramic islands to a signal processor substrate (e.g. Si 86) containing a massive array of sensing circuits.
摘要翻译：新颖的网状阵列包括使用独特的图案化方法由新型材料制成的陶瓷岛（例如BST 40）。首先在前侧的每个陶瓷岛周围离子研磨浅蚀刻停止沟槽（46），然后用蚀刻停止材料（例如聚对二甲苯48）填充。光学涂层（例如透明金属层54，透明有机层56和导电金属层58）通过仰角层（例如聚酰亚胺49）在蚀刻停止材料上方升高。对于一些应用，已经通过实验证实，当光学涂层在拓扑结构中不是平面的时，光学效率没有损失，有时是测量的增加。新颖的制造方法还提供了将大量陶瓷岛中的每一个的便利的电和机械结合到包含大量感测电路阵列的信号处理器基板（例如Si 86）。

6. 发明授权

US5552326A Method for forming electrical contact to the optical coating of an infrared detector using conductive epoxy 失效
标题翻译：使用导电环氧树脂与红外检测器的光学涂层形成电接触的方法
公开(公告)号：US5552326A
公开(公告)日：1996-09-03
申请号：US397706
申请日：1995-03-01
申请人： Steven N. Frank , James F. Belcher , Charles E. Stanford , Robert A. Owen , Robert J. S. Kyle
发明人： Steven N. Frank , James F. Belcher , Charles E. Stanford , Robert A. Owen , Robert J. S. Kyle
IPC分类号： H01L21/60 , H01L31/0224 , H01L31/18 , H01L21/58
CPC分类号： H01L31/022408 , H01L24/11 , H01L2224/13099 , H01L2924/01013 , H01L2924/01022 , H01L2924/01033 , H01L2924/01038 , H01L2924/01056 , H01L2924/01077 , H01L2924/01079 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/19041
摘要： This is a system and method of forming an electrical contact to the optical coating of an infrared detector using conductive epoxy. The method may comprise: forming thermal isolation trenches 22 and bias contact vias 23 in a substrate 20; depositing a trench filler 24 in the thermal isolation trenches 22; depositing conductive epoxy 50 into the bias contact vias 23; replanarizing; depositing a common electrode layer 31 over the thermal isolation trenches 22 and vias 23; depositing an optical coating 26 above the common electrode layer 31; mechanically polishing a backside of the substrate 20 to expose the trench filler 24 and conductive epoxy 50; depositing a contact metal 34 on the backside of the substrate 20; etching the contact metal 34 and the trench filler 24 to form pixel mesas of the contact metal 34 and the substrate 20.
摘要翻译：这是使用导电环氧树脂形成与红外检测器的光学涂层的电接触的系统和方法。该方法可以包括：在衬底20中形成热隔离沟槽22和偏置接触通孔23; 在热隔离槽22中沉积沟槽填料24; 将导电环氧树脂50沉积到偏压接触通孔23中; 补充; 在热隔离槽22和通孔23上沉积公共电极层31; 在公共电极层31上沉积光学涂层26; 机械抛光衬底20的背面以暴露沟槽填料24和导电环氧树脂50; 在衬底20的背面沉积接触金属34; 蚀刻接触金属34和沟槽填料24以形成接触金属34和基板20的像素台面。

7. 发明授权

US5426304A Infrared detector thermal isolation structure and method 失效
标题翻译：红外探测器热隔离结构及方法
公开(公告)号：US5426304A
公开(公告)日：1995-06-20
申请号：US182865
申请日：1994-01-13
申请人： James F. Belcher , Robert A. Owen , Charles M. Hanson , Howard R. Beratan
发明人： James F. Belcher , Robert A. Owen , Charles M. Hanson , Howard R. Beratan
IPC分类号： G01J1/02 , G01J5/02 , G01J5/12 , G01J5/34 , H01L37/02 , G01J5/06
CPC分类号： H01L37/02
摘要： In an exemplary thermal imaging system (20, 120, 220 and 320), a thermal isolation structure (50 and 150) is disposed on an integrated circuit substrate (70 and 170) for electrically connecting and mechanically bonding a corresponding focal plane array (30, 130, and 230) of thermal sensors (40, 140, and 240). Each mesa-type structure (52, 54 and 152) includes at least one mesa conductor (56, 58, 156 and 158) that extends from the top of the mesa-type structure (52, 54 and 152) to an adjacent contact pad (72 and 74). The mesa conductors (56, 58, 156 and 158) provide both biasing voltage (V.sub.B) for the respective thermal sensor (40 and 240) and a signal flowpath (V.sub.s) for the respective thermal sensor (40 and 240). The mesa conductors (56, 58, 156 and 158) may be used to provide biasing voltage (V.sub.B) to either a single ferroelectric element (242 and 243) having a void space (277 and 279) or a pair of ferroelectric elements (42 and 44). When the focal plane array (30, 130 and 230) is bonded to the corresponding array of mesa-type structures (52, 54 and 152), a thermally isolated, but electrically conductive path is provided between electrodes (43 and 45) of the thermal sensor (40 and 240) and the corresponding contact pad (72 and 172) of the integrated circuit substrate (70 and 74).
摘要翻译：在示例性热成像系统（20,120,220和320）中，热隔离结构（50和150）设置在集成电路衬底（70和170）上，用于电连接和机械地结合相应的焦平面阵列（30 ，130和230）热传感器（40,140和240）。每个台面型结构（52,54和152）包括从台面型结构（52,54和152）的顶部延伸到相邻接触垫的至少一个台面导体（56,58,156和158）（72和74）。台面导体（56,58,156和158）为相应的热传感器（40和240）提供偏压（VB）和相应的热传感器（40和240）的信号流路（Vs）。台面导体（56,58,156和158）可用于向具有空隙空间（277和279）或一对铁电元件（42）的单个铁电元件（242和243）提供偏置电压（VB）和44）。当焦平面阵列（30,130和230）被结合到相应的台面型结构（52,54和152）阵列时，热隔离但是导电的路径被提供在电极（43和45）之间热传感器（40和240）以及集成电路基板（70和74）的相应接触焊盘（72和172）。

8. 发明授权

US5679267A Dual etching of ceramic materials with an elevated thin film 失效
标题翻译：陶瓷材料的双重蚀刻具有升高的薄膜
公开(公告)号：US5679267A
公开(公告)日：1997-10-21
申请号：US586358
申请日：1996-01-16
申请人： James F. Belcher , Robert A. Owen
发明人： James F. Belcher , Robert A. Owen
IPC分类号： H01L27/146 , H01L37/02 , B44C1/22
CPC分类号： H01L37/02 , H01L27/1465
摘要： A novel reticulated array comprises islands of ceramic (e.g. BST 40) which are fabricated from novel materials using unique methods of patterning. A shallow etch stop trench (46) is first ion milled around each ceramic island on the front side and then filled with an etch step material (e.g. parylene 48). An optical coat (e.g transparent metal layer 54, transparent organic layer 56 and conductive metallic layer 58) is elevated above the etch step material by an elevation layer (e.g. polyimide 49). For some applications, it has been experimentally verified that there is no loss, and sometimes a measured increase, in optical efficiency when the optical coating is not planar in topology. Novel fabrication methods also provide for the convenient electrical and mechanical bonding of each of the massive number of ceramic islands to a signal processor substrate (e.g. Si 86) containing a massive array of sensing circuits.
摘要翻译：新颖的网状阵列包括使用独特的图案化方法由新型材料制成的陶瓷岛（例如BST 40）。首先在前侧的每个陶瓷岛周围离子研磨浅蚀刻停止沟槽（46），然后填充蚀刻步骤材料（例如聚对二甲苯48）。光学涂层（例如透明金属层54，透明有机层56和导电金属层58）通过仰角层（例如聚酰亚胺49）在蚀刻步骤材料上方升高。对于一些应用，已经通过实验证实，当光学涂层在拓扑结构中不是平面的时，光学效率没有损失，有时是测量的增加。新颖的制造方法还提供了将大量陶瓷岛中的每一个的便利的电和机械结合到包含大量感测电路阵列的信号处理器基板（例如Si 86）。

9. 发明授权

US5604977A Method of fabricating focal plane array 失效
标题翻译：焦平面阵列的制作方法
公开(公告)号：US5604977A
公开(公告)日：1997-02-25
申请号：US478570
申请日：1995-06-07
申请人： James E. Robinson , James F. Belcher , Howard R. Beratan , Steven N. Frank , Charles M. Hanson , Paul O. Johnson , Robert J. S. Kyle , Edward G. Meissner , Robert A. Owen , Gail D. Shelton , William K. Walker
发明人： James E. Robinson , James F. Belcher , Howard R. Beratan , Steven N. Frank , Charles M. Hanson , Paul O. Johnson , Robert J. S. Kyle , Edward G. Meissner , Robert A. Owen , Gail D. Shelton , William K. Walker
IPC分类号： G01J1/02 , G01J5/34 , G01J5/48 , H01L37/02 , H04N5/33 , H01R43/00
CPC分类号： G01J5/34 , H01L37/02 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144
摘要： A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30). Thermal sensitive element (30) is coupled with one side to infrared absorber and common electrode assembly (36) and on the opposite side to an associated contact pad (20) disposed on the integrated circuit substrate (16). Reticulation kerfs (52a, 52b) separate adjacent thermal sensitive elements (30a, 30b, 30c) by a distance at least half the average width (44, 46) of a single thermal sensitive element (30a, 30b, 30c). A continuous, non-reticulated optical coating (38) may be disposed over thermal sensitive elements (30a, 30b, 30c) to maximize absorption of thermal radiation incident to focal plane array (12).
摘要翻译：热检测系统（10）包括焦平面阵列（12），热隔离结构（14）和集成电路基板（16）。焦平面阵列（12）包括热传感器（28），每个具有相关联的热敏元件（30）。热敏元件（30）与一侧耦合到红外线吸收器和公共电极组件（36），并且与设置在集成电路衬底（16）上的相关接触焊盘（20）的相对侧耦合。相邻的热敏元件（30a，30b，30c）与单个热敏元件（30a，30b，30c）的平均宽度（44,46）的至少一半的距离分开。可以在热敏元件（30a，30b，30c）上设置连续的非网状光学涂层（38），以最大程度地吸收入射到焦平面阵列（12）的热辐射。

10. 发明授权

US5572029A Thermal isolation for hybrid thermal detectors 失效
公开(公告)号：US5572029A
公开(公告)日：1996-11-05
申请号：US488390
申请日：1995-06-07
申请人： William K. Walker , John P. Long , Robert A. Owen , Bert T. Runnels , Gail D. Shelton
发明人： William K. Walker , John P. Long , Robert A. Owen , Bert T. Runnels , Gail D. Shelton
IPC分类号： G01J5/20 , H01L37/02 , G01J5/10
CPC分类号： G01J5/20 , H01L37/02
摘要： A hybrid thermal detector (10, 110) includes a focal plane array (20, 120), a thermal isolation structure (40, 140), and an integrated circuit substrate (60, 160). The focal plane array (20, 120) includes thermal sensors (30, 130). The thermal isolation structure (40, 140) includes untrimmed mesa-type formations (44, 146, 148) and mesa strip conductors (42, 142, 144) that provide thermal isolation, signal transport, and structural support of the focal plane array (20, 120) when mounted on the integrated circuit substrate (60, 160). Hybrid thermal detector (10) includes a common electrode (28) which provides a bias voltage to all thermal sensors (30). Hybrid thermal detector (110) has electrically isolated thermal sensors (130), each thermal sensor (130) is supported by mesa strip conductors (142, 144), which provide a bias voltage to and receive a signal voltage from the thermal sensor (130). To improve both pixel-substrate and inter-pixel thermal isolation, mesa strip conductors (42, 142, 144) and common electrode (28) may be formed from a thermally insulating material, such as cermet or a semiconductive material. Untrimmed mesa-type formations (44, 146, 148) may be anisotropically etched to remove excess mesa material and improve pixel-substrate thermal isolation.

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