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1. 发明授权

US5572029A Thermal isolation for hybrid thermal detectors 失效
公开(公告)号：US5572029A
公开(公告)日：1996-11-05
申请号：US488390
申请日：1995-06-07
申请人： William K. Walker , John P. Long , Robert A. Owen , Bert T. Runnels , Gail D. Shelton
发明人： William K. Walker , John P. Long , Robert A. Owen , Bert T. Runnels , Gail D. Shelton
IPC分类号： G01J5/20 , H01L37/02 , G01J5/10
CPC分类号： G01J5/20 , H01L37/02
摘要： A hybrid thermal detector (10, 110) includes a focal plane array (20, 120), a thermal isolation structure (40, 140), and an integrated circuit substrate (60, 160). The focal plane array (20, 120) includes thermal sensors (30, 130). The thermal isolation structure (40, 140) includes untrimmed mesa-type formations (44, 146, 148) and mesa strip conductors (42, 142, 144) that provide thermal isolation, signal transport, and structural support of the focal plane array (20, 120) when mounted on the integrated circuit substrate (60, 160). Hybrid thermal detector (10) includes a common electrode (28) which provides a bias voltage to all thermal sensors (30). Hybrid thermal detector (110) has electrically isolated thermal sensors (130), each thermal sensor (130) is supported by mesa strip conductors (142, 144), which provide a bias voltage to and receive a signal voltage from the thermal sensor (130). To improve both pixel-substrate and inter-pixel thermal isolation, mesa strip conductors (42, 142, 144) and common electrode (28) may be formed from a thermally insulating material, such as cermet or a semiconductive material. Untrimmed mesa-type formations (44, 146, 148) may be anisotropically etched to remove excess mesa material and improve pixel-substrate thermal isolation.

2. 发明授权

US5574282A Thermal isolation for hybrid thermal detectors 失效
标题翻译：混合热探测器的热隔离
公开(公告)号：US5574282A
公开(公告)日：1996-11-12
申请号：US268365
申请日：1994-06-30
申请人： William K. Walker , John P. Long , Robert A. Owen , Bert T. Runnels , Gail D. Shelton
发明人： William K. Walker , John P. Long , Robert A. Owen , Bert T. Runnels , Gail D. Shelton
IPC分类号： G01J5/20 , H01L37/02 , G01J5/06
CPC分类号： G01J5/20 , H01L37/02
摘要： A hybrid thermal detector (10, 110) includes a focal plane array (20, 120), a thermal isolation structure (40, 140), and an integrated circuit substrate (60, 160). The focal plane array (20, 120) includes thermal sensors (30, 130). The thermal isolation structure (40, 140) includes untrimmed mesa-type formations (44, 146, 148) and mesa strip conductors (42, 142, 144) that provide thermal isolation, signal transport, and structural support of the focal plane array (20, 120) when mounted on the integrated circuit substrate (60, 160). Hybrid thermal detector (10) includes a common electrode (28) which provides a bias voltage to all thermal sensors (30). Hybrid thermal detector (110) has electrically isolated thermal sensors (130), each thermal sensor (130) is supported by mesa strip conductors (142, 144), which provide a bias voltage to and receive a signal voltage from the thermal sensor (130). To improve both pixel-substrate and inter-pixel thermal isolation, mesa strip conductors (42, 142, 144) and common electrode (28) may be formed from a thermally insulating material, such as cermet or a semiconductive material. Untrimmed mesa-type formations (44, 146, 148) may be anisotropically etched to remove excess mesa material and improve pixel-substrate thermal isolation.
摘要翻译：混合热检测器（10,110）包括焦平面阵列（20,120），热隔离结构（40,140）和集成电路衬底（60,160）。焦平面阵列（20,120）包括热传感器（30,130）。热隔离结构（40,140）包括提供聚焦平面阵列的热隔离，信号传输和结构支撑的未整形的台面型结构（44,146,148）和台面状导体（42,142,144） 20，120）安装在集成电路基板（60,160）上。混合式热检测器（10）包括向所有热传感器（30）提供偏置电压的公共电极（28）。混合热检测器（110）具有电隔离的热传感器（130），每个热传感器（130）由台面状导体（142,144）支撑，其向热传感器（130）提供偏置电压并从其接收信号电压）。为了改进像素 - 衬底和像素间隔热隔离，台状导体（42,142,144）和公共电极（28）可以由绝热材料例如金属陶瓷或半导电材料形成。可以各向异性地蚀刻未成像的台面型结构（44,146,148）以去除多余的台面材料并改善像素 - 衬底热隔离。

3. 发明授权

US5578826A Thermal isolation for hybrid thermal detectors 失效
公开(公告)号：US5578826A
公开(公告)日：1996-11-26
申请号：US468159
申请日：1995-06-06
申请人： William K. Walker , John P. Long , Robert A. Owen , Bert T. Runnels , Gail D. Shelton
发明人： William K. Walker , John P. Long , Robert A. Owen , Bert T. Runnels , Gail D. Shelton
IPC分类号： G01J5/20 , H01L37/02 , G01J5/10
CPC分类号： G01J5/20 , H01L37/02
摘要： A hybrid thermal detector (10, 110) includes a focal plane array (20, 120), a thermal isolation structure (40, 140), and an integrated circuit substrate (60, 160). The focal plane array (20, 120) includes thermal sensors (30, 130). The thermal isolation structure (40, 140) includes untrimmed mesa-type formations (44, 146, 148) and mesa strip conductors (42, 142, 144) that provide thermal isolation, signal transport, and structural support of the focal plane array (20, 120) when mounted on the integrated circuit substrate (60, 160). Hybrid thermal detector (10) includes a common electrode (28) which provides a bias voltage to all thermal sensors (30). Hybrid thermal detector (110) has electrically isolated thermal sensors (130), each thermal sensor (130) is supported by mesa strip conductors (142, 144), which provide a bias voltage to and receive a signal voltage from the thermal sensor (130). To improve both pixel-substrate and inter-pixel thermal isolation, mesa strip conductors (42, 142, 144) and common electrode (28) may be formed from a thermally insulating material, such as cermet or a semiconductive material. Untrimmed mesa-type formations (44, 146, 148) may be anisotropically etched to remove excess mesa material and improve pixel-substrate thermal isolation.

4. 发明授权

US5426303A Thermal isolation structure for hybrid thermal detectors 失效
标题翻译：用于混合热探测器的隔热结构
公开(公告)号：US5426303A
公开(公告)日：1995-06-20
申请号：US235068
申请日：1994-04-29
申请人： Robert A. Owen , John P. Long , Bert T. Runnels , Gail D. Shelton , William K. Walker
发明人： Robert A. Owen , John P. Long , Bert T. Runnels , Gail D. Shelton , William K. Walker
IPC分类号： H01L37/02 , H04N5/33
CPC分类号： H01L37/02
摘要： A thermal detection system (10, 110, 210) includes a focal plane array (20, 120, 220), a thermal isolation structure (40, 140, 240), and an integrated circuit substrate (60, 160, 260). The focal plane array (20, 120, 220) includes a plurality of thermal sensors (30, 130, 230). The thermal isolation structure (40, 140, 240) includes mesa-type formations (44, 146, 148, 244) and bridge structures (42, 142, 144, 242) that provide thermal isolation, signal transport, and structural support of the focal plane array (20, 120, 220) when mounted on the integrated circuit substrate (60, 160, 260). Thermal detection system (10) includes an infrared absorber and common electrode assembly (22) which provides a bias voltage to all thermal sensors (30). Thermal detection system (110) has a plurality of electrically isolated thermal sensors (130), each thermal sensor (130) is supported by bridge structures (142, 144), which provide a bias voltage to and receive a signal voltage from the thermal sensor (130). Thermal detection system ( 220) has a plurality of electrically isolated thermal sensors (230), each thermal sensor (230) is electrically coupled to a pair of leads (246, 247), which are supported by a reinforcing layer (245). Bridge structures (42, 142, 144, 242) may be formed from a low thermal conductivity and adequate electrical conductivity material, such as silicon monoxide and chromium or other selected cermets.
摘要翻译：热检测系统（10,110,210）包括焦平面阵列（20,120,220），热隔离结构（40,140,240）和集成电路衬底（60,160,260）。焦平面阵列（20,120,220）包括多个热传感器（30,130,230）。热隔离结构（40,140,240）包括提供热隔离，信号传输和结构支撑的台面型结构（44,146,148,244）和桥结构（42,142,144,242）焦平面阵列（20,120,220），当安装在集成电路基板（60,160,260）上时。热检测系统（10）包括向所有热传感器（30）提供偏置电压的红外吸收器和公共电极组件（22）。热检测系统（110）具有多个电隔离的热传感器（130），每个热传感器（130）由桥结构（142,144）支撑，其提供偏置电压并从热传感器接收信号电压（130）。热检测系统（220）具有多个电隔离的热传感器（230），每个热传感器（230）电耦合到由加强层（245）支撑的一对引线（246,247）。桥结构（42,142,144,242）可以由低热导率和足够的导电性材料（例如一氧化硅和铬或其它选择的金属陶瓷）形成。

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