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    • 2. 发明授权
    • Planarization method using hybrid oxide and polysilicon CMP
    • 使用混合氧化物和多晶硅CMP的平面化方法
    • US07829464B2
    • 2010-11-09
    • US11551390
    • 2006-10-20
    • David MatsumotoVidyut Gopal
    • David MatsumotoVidyut Gopal
    • H01L21/461H01L21/302
    • H01L21/31053C09G1/02H01L21/76819
    • A method of planarizing a semiconductor device is provided. The semiconductor device includes a substrate, first and second components provided on the surface of the substrate, and a first material provided between and above the first and second components. The first component has a height greater than a height of the second component. The method includes performing a first polishing step on the semiconductor device to remove the first material above a top surface of the first component, to remove the first material above a top surface of the second component, and to level the top surface of the first component. The method also includes performing a second polishing step on the semiconductor device to planarize the top surfaces of the first and second components.
    • 提供了一种平面化半导体器件的方法。 半导体器件包括衬底,设置在衬底的表面上的第一和第二组件以及设置在第一和第二组件之间和之上的第一材料。 第一部件的高度大于第二部件的高度。 该方法包括在半导体器件上执行第一抛光步骤以去除第一部件的顶表面上方的第一材料,以去除第二部件的顶表面上方的第一材料,并且使第一部件的顶表面平整 。 该方法还包括在半导体器件上执行第二抛光步骤以平坦化第一和第二部件的顶表面。
    • 3. 发明申请
    • PLANARIZATION METHOD USING HYBRID OXIDE AND POLYSILICON CMP
    • 使用混合氧化物和多晶硅CMP的平面化方法
    • US20080096388A1
    • 2008-04-24
    • US11551390
    • 2006-10-20
    • David MatsumotoVidyut Gopal
    • David MatsumotoVidyut Gopal
    • H01L21/302
    • H01L21/31053C09G1/02H01L21/76819
    • A method of planarizing a semiconductor device is provided. The semiconductor device includes a substrate, first and second components provided on the surface of the substrate, and a first material provided between and above the first and second components. The first component has a height greater than a height of the second component. The method includes performing a first polishing step on the semiconductor device to remove the first material above a top surface of the first component, to remove the first material above a top surface of the second component, and to level the top surface of the first component. The method also includes performing a second polishing step on the semiconductor device to planarize the top surfaces of the first and second components.
    • 提供了一种平面化半导体器件的方法。 半导体器件包括衬底,设置在衬底的表面上的第一和第二组件以及设置在第一和第二组件之间和之上的第一材料。 第一部件的高度大于第二部件的高度。 该方法包括在半导体器件上执行第一抛光步骤以去除第一部件的顶表面上方的第一材料,以去除第二部件的顶表面上方的第一材料,并且使第一部件的顶表面平整 。 该方法还包括在半导体器件上执行第二抛光步骤以平坦化第一和第二部件的顶表面。
    • 4. 发明授权
    • Planarization method using hybrid oxide and polysilicon CMP
    • 使用混合氧化物和多晶硅CMP的平面化方法
    • US07972962B2
    • 2011-07-05
    • US12887182
    • 2010-09-21
    • David MatsumotoVidyut Gopal
    • David MatsumotoVidyut Gopal
    • H01L21/461H01L21/302
    • H01L21/31053C09G1/02H01L21/76819
    • A method of planarizing a semiconductor device is provided. The semiconductor device includes a substrate, first and second components provided on the surface of the substrate, and a first material provided between and above the first and second components. The first component has a height greater than a height of the second component. The method includes performing a first polishing step on the semiconductor device to remove the first material above a top surface of the first component, to remove the first material above a top surface of the second component, and to level the top surface of the first component. The method also includes performing a second polishing step on the semiconductor device to planarize the top surfaces of the first and second components.
    • 提供了一种平面化半导体器件的方法。 半导体器件包括衬底,设置在衬底的表面上的第一和第二组件以及设置在第一和第二组件之间和之上的第一材料。 第一部件的高度大于第二部件的高度。 该方法包括在半导体器件上执行第一抛光步骤以去除第一部件的顶表面上方的第一材料,以去除第二部件的顶表面上方的第一材料,并且使第一部件的顶表面平整 。 该方法还包括在半导体器件上执行第二抛光步骤以平坦化第一和第二部件的顶表面。
    • 5. 发明申请
    • SYSTEMS AND METHODS FOR ANALYZING FACIAL EXPRESSIONS, IDENTIFYING INTENT AND TRANSFORMING IMAGES THROUGH REVIEW OF FACIAL EXPRESSIONS
    • 用于分析FACIAL表达的系统和方法,通过对FACIAL表达的评估来识别INTENT和变换图像
    • US20110026779A1
    • 2011-02-03
    • US12646211
    • 2009-12-23
    • David MatsumotoPaul Ekman
    • David MatsumotoPaul Ekman
    • G06K9/00
    • G09B7/02G06K9/6253G06K9/6255
    • Methods of analyzing a plurality of facial expressions are disclosed that include: identifying a subject person, utilizing the subject person to create an image of a known target, removing at least one distracter expression from the target image to form a revised target image, and reviewing the revised target image with at least one third party participant to form a final target image. Additional methods of analyzing a plurality of facial expressions include: identifying a subject person, utilizing the subject person to create an image of a known target, digitizing the target image, removing at least one distracter expression from the target image to transform the target image to a revised target image, and reviewing the revised target image with at least one third party participant to transform the revised target image to a final target image. Software for implementing contemplated methods include: a set speed function, a pre-test phase function, an instruction phase function, a practice phase function, and a post-test phase function.
    • 公开了分析多个面部表情的方法,包括:识别对象人,利用对象人创建已知目标的图像,从目标图像中移除至少一个分离符表达以形成修订的目标图像,以及查看 修改的目标图像与至少一个第三方参与者形成最终目标图像。 分析多个面部表情的附加方法包括:识别被摄体人,利用对象人创建已知目标的图像,数字化目标图像,从目标图像中移除至少一个分离符表达,以将目标图像转换为 修改的目标图像,并且与至少一个第三方参与者一起检查修改的目标图像以将修正的目标图像变换为最终目标图像。 用于实现预期方法的软件包括:设定速度功能,预测相位功能,指令相位功能,练习相位功能和测试后相位功能。
    • 10. 发明授权
    • Systems and methods for analyzing facial expressions, identifying intent and transforming images through review of facial expressions
    • 用于分析面部表情的系统和方法,通过审视面部表情来识别意图和转换图像
    • US08416988B2
    • 2013-04-09
    • US12646211
    • 2009-12-23
    • David MatsumotoPaul Ekman
    • David MatsumotoPaul Ekman
    • G06K9/00G08B29/00
    • G09B7/02G06K9/6253G06K9/6255
    • Methods of analyzing a plurality of facial expressions are disclosed that include: identifying a subject person, utilizing the subject person to create an image of a known target, removing at least one distracter expression from the target image to form a revised target image, and reviewing the revised target image with at least one third party participant to form a final target image. Additional methods of analyzing a plurality of facial expressions include: identifying a subject person, utilizing the subject person to create an image of a known target, digitizing the target image, removing at least one distracter expression from the target image to transform the target image to a revised target image, and reviewing the revised target image with at least one third party participant to transform the revised target image to a final target image. Software for implementing contemplated methods include: a set speed function, a pre-test phase function, an instruction phase function, a practice phase function, and a post-test phase function.
    • 公开了分析多个面部表情的方法,包括:识别对象人,利用对象人创建已知目标的图像,从目标图像中移除至少一个分离符表达以形成修订的目标图像,以及查看 修改的目标图像与至少一个第三方参与者形成最终目标图像。 分析多个面部表情的附加方法包括:识别被摄体人,利用对象人创建已知目标的图像,数字化目标图像,从目标图像中移除至少一个分离符表达,以将目标图像转换为 修改的目标图像,并且与至少一个第三方参与者一起检查修改的目标图像以将修正的目标图像变换为最终目标图像。 用于实现预期方法的软件包括:设定速度功能,预测相位功能,指令相位功能,练习相位功能和测试后相位功能。