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    • 3. 发明申请
    • METHOD OF ADHESIVELESS LAMINATION OF POLYMER FILMS INTO MICROFLUIDIC NETWORKS WITH HIGH DIMENSIONAL FIDELITY
    • 将聚合物薄膜粘贴到具有高维度的微流网络中的方法
    • US20060272716A1
    • 2006-12-07
    • US11382779
    • 2006-05-11
    • Kenneth HawkinsDavid MarkelPaul YagerMatthew Munson
    • Kenneth HawkinsDavid MarkelPaul YagerMatthew Munson
    • F15C1/06
    • F15C1/06Y10T137/2224
    • A method for fabricating an adhesiveless microfluidic device using solvent assisted thermal welding is provided. The method comprises use of a plurality of device layers of a bulk chemical conformation composition having a glass transition temperature that can be disrupted by a disrupting agent without total solvation, wherein the plurality of device layers when assembled define a plurality of defined component features. The device layers are immersed into the disrupting agent for a time period sufficient to disrupt the glass transition temperature of a defined depth of the surfaces of the device layers prior to their removal from the disrupting agent. The plurality of device layers are assembled and registered by contacting the plurality of device layer surfaces to form the defined component features. Pressure and heat are simultaneously applied to bring the assembly to a temperature below the pressure-specific, glass transition temperature of the bulk chemical conformation composition; but above the pressure-specific, glass transition temperature of the disrupted surface layer of the composition, for a time period sufficient to affect a weld between the contacted surfaces of the plurality of device layers. The temperature of the assembly is reduced over a time period sufficient to anneal the contacted surfaces of the plurality of device layers to form the microfluidic device.
    • 提供了使用溶剂辅助热焊接制造无粘合微流体装置的方法。 该方法包括使用大量化学构象组合物的多个器件层,其具有玻璃化转变温度,所述玻璃化转变温度可被破坏剂破坏而不具有全部溶剂化,其中所述多个器件层在组装时限定多个限定的部件特征。 将装置层浸入破碎剂中足以破坏装置层的表面的规定深度的玻璃化转变温度,然后再将其从干扰剂中除去。 多个器件层通过接触多个器件层表面来组装和注册以形成限定的部件特征。 同时施加压力和热量以使组件达到低于本体化学构象组合物的压力特定玻璃化转变温度的温度; 但高于组合物破坏的表面层的压力特定的玻璃化转变温度,持续足以影响多个器件层的接触表面之间的焊接的时间段。 组件的温度在足以退火多个器件层的接触表面以形成微流体器件的时间段内减小。