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    • 8. 发明申请
    • MEMS device and method of forming MEMS device
    • MEMS器件和MEMS器件的形成方法
    • US20050106772A1
    • 2005-05-19
    • US11019780
    • 2004-12-21
    • Michael MonroeEric NikkelDennis Lazaroff
    • Michael MonroeEric NikkelDennis Lazaroff
    • B81B3/00B81C1/00G02B26/08H01L21/8242
    • G02B26/0841B81B3/0083B81B2201/042B81B2203/0181B81B2203/058Y10S359/904
    • A method of forming a MEMS device includes depositing a conductive material on a substructure, forming a first sacrificial layer over the conductive material, including forming a substantially planar surface of the first sacrificial layer, and forming a first element over the substantially planar surface of the first sacrificial layer, including communicating the first element with the conductive material through the first sacrificial layer. In addition, the method includes forming a second sacrificial layer over the first element, including forming a substantially planar surface of the second sacrificial layer, forming a support through the second sacrificial layer to the first element after forming the second sacrificial layer, including, filling the support, and forming a second element over the support and the substantially planar surface of the second sacrificial layer. As such, the method further includes substantially removing the first sacrificial layer and the second sacrificial layer, thereby supporting the second element relative to the first element with the support.
    • 形成MEMS器件的方法包括在基底结构上沉积导电材料,在导电材料上形成第一牺牲层,包括形成第一牺牲层的基本平坦的表面,以及在第一牺牲层的基本平坦的表面上形成第一元件 第一牺牲层,包括通过第一牺牲层将第一元件与导电材料连通。 另外,该方法包括在第一元件上形成第二牺牲层,包括形成第二牺牲层的基本平坦的表面,在形成第二牺牲层之后,通过第二牺牲层形成支撑件到第一元件,包括填充 支撑件,以及在第二牺牲层的支撑件和基本平坦的表面上形成第二元件。 这样,该方法还包括基本上去除第一牺牲层和第二牺牲层,从而相对于第一元件与支撑件支撑第二元件。