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    • 5. 发明授权
    • Thin buffer layers for SiGe growth on mismatched substrates
    • 用于SiGe在不匹配衬底上生长的薄缓冲层
    • US07902046B2
    • 2011-03-08
    • US11524499
    • 2006-09-19
    • Yu-Hsuan KuoJames S. Harris, Jr.
    • Yu-Hsuan KuoJames S. Harris, Jr.
    • H01L21/20H01L21/36
    • C30B33/02C30B29/52H01L21/02381H01L21/0245H01L21/02502H01L21/02532
    • Growth of SiGe on a significantly lattice mismatched substrate (e.g., Si) is provided by depositing a SiGe buffer layer at a growth temperature, then annealing the resulting structure at a temperature higher than the growth temperature. Additional buffer layers can be included following the same steps. The SiGe buffer is significantly lattice mismatched with respect to the substrate, and is preferably substantially lattice matched with a SiGe device to be grown on top of the buffer. The resulting buffer structure is relatively thin and provides low defect density, and low surface roughness. Disadvantages of thick graded buffer layers, such as high cost, high surface roughness, mechanical fragility, and CTE mismatch, are thereby avoided.
    • 通过在生长温度下沉积SiGe缓冲层,然后在高于生长温度的温度下对所得到的结构进行退火来提供SiGe在显着晶格错配衬底(例如Si)上的生长。 可以按照相同的步骤包括附加的缓冲层。 SiGe缓冲液相对于衬底显着地晶格失配,并且优选地与要在缓冲器顶部生长的SiGe器件基本上晶格匹配。 得到的缓冲结构相对较薄,提供低缺陷密度和低表面粗糙度。 从而避免了诸如高成本,高表面粗糙度,机械脆性和CTE不匹配等厚梯度缓冲层的缺点。
    • 6. 发明授权
    • Low temperature grown optical detector
    • 低温生长光检测器
    • US06653706B1
    • 2003-11-25
    • US09567179
    • 2000-05-08
    • David A. B. MillerJames S. Harris, Jr.
    • David A. B. MillerJames S. Harris, Jr.
    • H01C3100
    • H01L31/1852H01L31/09H01L31/1085Y02E10/544
    • A high efficiency optical interconnect (OI) deposited directly on a silicon based IC by a low temperature process that utilizes a heterogeneous crystalline structure of a III-V compound material to convert light pulses into electrical signals. The high efficiency is established by pulsing the light beams with a shorter duration than the life time of the generated carriers and by reducing the structural volume and consequently the internal capacitance of the III-V compound to a functional height of approximately 1 micron. The analog MSM characteristic of the OI is bypassed by differential two-beam signal processing, wherein the intensity difference of two synchronous light beams is transformed in two parallel OI's into two electrical signals that compensate in a central node. The resulting polarity in the node switches either a PMOS or a NMOS transistor, which connect either a positive or negative voltage to the output node.
    • 通过利用III-V复合材料的异质晶体结构的低温工艺将直接沉积在硅基IC上的高效光学互连(OI)将光脉冲转换成电信号。 通过以比产生的载流子的寿命短的持续时间脉冲光束和通过将III-V族化合物的内部电容降低到大约1微米的功能高度来建立高效率。 OI的模拟MSM特性被差分双波束信号处理旁路,其中两个同步光束的强度差在两个并行OI中变换成两个电信号,在中心节点进行补偿。 在节点中产生的极性切换PMOS或NMOS晶体管,其将正电压或负电压连接到输出节点。