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1. 发明申请

US20110031125A1 Method for the electrochemical coating of a substrate by brush plating and device for carrying out said method 有权
标题翻译：用于电镀电镀基板的方法和用于实施所述方法的装置
公开(公告)号：US20110031125A1
公开(公告)日：2011-02-10
申请号：US12736547
申请日：2009-04-01
申请人： Frank Heinrichsdorff , Jens Dahl Jensen , Hans-Richard Kretschmer , Daniel Reznik , Arno Steckenborn
发明人： Frank Heinrichsdorff , Jens Dahl Jensen , Hans-Richard Kretschmer , Daniel Reznik , Arno Steckenborn
IPC分类号： C25D5/06 , C25D15/00 , C25D17/00 , B82Y30/00
CPC分类号： C25D5/06 , C25D5/20 , C25D13/22 , C25D15/00 , C25D21/10
摘要： A method for the electrochemical coating of a substrate uses brush plating. This is to take place with an electrolyte in that particles are dispersed, which are embedded into the developing layer. It is proposed to add the particles to the carrier for the electrolyte by way of a separate conduit system. The electrolyte is added by way of a conduit system. In this way it is achieved that an agglomeration of the particles in the electrolyte can be prevented because only a short time passes between when the particles are fed and the layer is formed. A device for electrochemical coating has two conduit systems provided for this purpose.
摘要翻译：基板的电化学涂覆方法使用刷镀。这是通过电解质发生的，因为它们分散在嵌入显影层中的颗粒中。建议通过单独的管道系统将颗粒添加到电解质的载体中。电解质通过导管系统加入。以这种方式，可以防止颗粒在电解质中的聚集，因为在颗粒进料和形成层之间只有很短的时间。用于电化学涂层的装置具有为此目的提供的两个导管系统。

2. 发明申请

US20100330365A1 STRAND-LIKE MATERIAL COMPOSITE WITH CNT YARNS AND METHOD FOR THE MANUFACTURE THEREOF 审中-公开
标题翻译：具有CNT纱的棒状材料复合材料及其制造方法
公开(公告)号：US20100330365A1
公开(公告)日：2010-12-30
申请号：US12736068
申请日：2009-02-24
申请人： Jörg Hassel , Hans-Richard Kretschmer , Daniel Reznik , Arno Steckenborn
发明人： Jörg Hassel , Hans-Richard Kretschmer , Daniel Reznik , Arno Steckenborn
IPC分类号： B32B9/00 , B05D3/00 , C25D3/00
CPC分类号： D02G3/441 , B82Y30/00 , C22C26/00 , C22C47/025 , C22C47/04 , C22C2026/002 , C23C14/046 , C23C14/185 , C23C14/562 , C25D5/54 , C25D7/006 , C25D7/0607 , D02G3/16 , D06M11/83 , D10B2101/122 , Y10T428/2918
摘要： A strand-like material is formed of CNT yarns that are embedded in a metal matrix. The embedding in a common matrix has the advantage in that the material composite exhibits an improved electrical conductivity. This lies in the ability for electrons to switch from the CNT to the matrix and back again. The strand-like material composite is therefore suitable for use as an electrical conductor. Further proposed is a method for producing the strand-like material composite.
摘要翻译：线状材料由嵌入金属基体中的CNT纱线形成。嵌入共同的基质中的优点在于材料复合材料具有改进的导电性。这取决于电子从CNT转换到矩阵并再次返回的能力。因此，线状材料复合材料适用于电导体。进一步提出的是生产线状材料复合材料的方法。

3. 发明授权

US06781057B2 Electrical arrangement and method for producing an electrical arrangement 有权
标题翻译：用于生产电气布置的电气布置和方法
公开(公告)号：US06781057B2
公开(公告)日：2004-08-24
申请号：US10722311
申请日：2003-11-25
申请人： Daniel Reznik
发明人： Daniel Reznik
IPC分类号： H01L2302
CPC分类号： H01L23/045 , H01L23/49811 , H01L23/66 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48137 , H01L2224/4823 , H01L2224/85399 , H01L2924/00014 , H01L2924/0102 , H01L2924/12042 , H01L2924/30107 , H01L2924/3011 , H01S5/02212 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： The invention relates to an electrical arrangement having a mount device with at least one conductor track, having an electrical component that is mounted on the mount device and is electrically connected to the at least one conductor track. The arrangement further includes a housing base plate on which the mount device is mounted and through which at least one contact-making pin extends, with the at least one contact-making pin being electrically connected to the at least one conductor track. In order to improve the frequency response of the arrangement, the invention provides for the at least one contact-making pin to touch the mount device and, in the area of the touching point, for a connection without any bonding wire to be provided between the at least one contact-making pin and the at least one conductor track on the mount device.
摘要翻译：本发明涉及具有至少一个导体轨道的安装装置的电气装置，其具有安装在安装装置上并电连接至该至少一个导体轨道的电气部件。该装置还包括壳体基板，安装装置安装在壳体基板上，并且至少一个接触引脚延伸穿过该壳体基座板，该至少一个接触引脚与至少一个导体轨道电连接。为了提高布置的频率响应，本发明提供了至少一个接触引脚以接触安装装置，并且在接触点的区域中提供连接，而不需要在至少一个接触制造销和该安装装置上的至少一个导体轨道。

4. 发明授权

US09267207B2 Central tube for a linear concentrating solar thermal power plant, having an absorber layer, and method for applying said absorber layer 有权
标题翻译：具有吸收层的线性聚光太阳能发电厂的中心管，以及用于施加所述吸收层的方法
公开(公告)号：US09267207B2
公开(公告)日：2016-02-23
申请号：US13499384
申请日：2010-09-14
申请人： Ursus Krüger , Daniel Reznik , Oliver Stier
发明人： Ursus Krüger , Daniel Reznik , Oliver Stier
IPC分类号： F24J2/48 , C23C24/04 , F24J2/07 , F24J2/46
CPC分类号： C23C24/04 , F24S20/20 , F24S40/40 , F24S70/25 , Y02E10/41
摘要： A central tube for linear concentrating solar thermal power plants, has an absorber layer. The absorber layer is generated by cold gas sputtering, wherein suitable method parameters can in particular generate an increased surface roughness by means of pores in the surface region of the absorber layer. An absorber layer can thus be advantageously produced, having a quadratic roughness of no more than 1 μm, measured in a close range of no more than 50 μm diameter, and preferably being made of a corrosion-proof hard alloy comprising tungsten carbide, in particular WC—CoCr, WC—Co, WC—FeCo, WC—FeC, WC—FeNi, WC—Ni or WC—NiCr.
摘要翻译：用于线性聚光太阳能发电厂的中心管具有吸收层。通过冷气体溅射产生吸收层，其中合适的方法参数可以特别地通过吸收层表面区域中的孔产生增加的表面粗糙度。因此，可以有利地制造吸收层，其具有在不大于50μm的近似范围内测量的具有不大于1μm的二次粗糙度，优选由包含碳化钨的耐腐蚀硬质合金制成，特别是 WC-CoCr，WC-Co，WC-FeCo，WC-FeC，WC-FeNi，WC-Ni或WC-NiCr。

5. 发明申请

US20140123772A1 FORCE TRANSDUCER FORMING A CAPACITIVE LOAD CELL 有权
标题翻译：力传感器形成电容负载电池
公开(公告)号：US20140123772A1
公开(公告)日：2014-05-08
申请号：US14118114
申请日：2012-05-11
申请人： Karlheinz Amtmann , Dominik Braun , Jörg Hassel , Harry Hedler , Hans-Peter Lindner , Delphine Meunier , Daniel Reznik , Klaus Röther , Dirk Scheibner , Arno Steckenborn , Oliver Theile
发明人： Karlheinz Amtmann , Dominik Braun , Jörg Hassel , Harry Hedler , Hans-Peter Lindner , Delphine Meunier , Daniel Reznik , Klaus Röther , Dirk Scheibner , Arno Steckenborn , Oliver Theile
IPC分类号： G01L1/04 , G01L1/14
CPC分类号： G01L1/04 , G01G3/12 , G01G7/06 , G01L1/142
摘要： A force transducer, in particular a load cell, includes a spring body that deforms when loaded with a force or load to be measured. Two support parts, which are separated by a gap, are moved out of a position of rest. A capacitive displacement detector is used to detect the relative movement of the support parts, where the capacitor includes two electrode combs that are each held on one of the support parts and includes a multiplicity of electrode fingers. The electrode combs are configured designed and mounted on the two support parts such that the electrode fingers of the one electrode comb pass into the finger interspaces of the other electrode comb when the spring body is loaded so that the force transducer is resistant to overloading.
摘要翻译：力传感器，特别是称重传感器，包括弹簧体，当加载有要测量的力或载荷时，弹簧体变形。由间隙分开的两个支撑部件移出静止位置。电容位移检测器用于检测支撑部分的相对运动，其中电容器包括两个电极梳，每个电极梳被保持在一个支撑部分上并且包括多个电极指。电极梳配置设计并安装在两个支撑部分上，使得当弹簧体被装载时，一个电极梳的电极指进入另一个电极梳的指状空隙中，使得力传感器抵抗过载。

6. 发明授权

US07361936B2 Optical transmission and/or receiving device 有权
标题翻译：光传输和/或接收设备
公开(公告)号：US07361936B2
公开(公告)日：2008-04-22
申请号：US10642543
申请日：2003-08-15
申请人： Daniel Reznik , Oliver Stier , Melanie Ring , Werner Kuhlmann , Benjamin Prodinger , Nicola Iwanowski
发明人： Daniel Reznik , Oliver Stier , Melanie Ring , Werner Kuhlmann , Benjamin Prodinger , Nicola Iwanowski
IPC分类号： H01L27/15 , H01S3/14
CPC分类号： H01S5/02248 , H01L2224/48091 , H01L2924/30107 , H01L2924/3011 , H01S5/02276 , H01S5/06832 , H01L2924/00014 , H01L2924/00
摘要： An optical transmitting and/or receiving device has a semiconductor component with a first contact for connecting to a reference voltage and a second contact for obtaining or supplying a high-frequency electrical signal. There is also an electrically conducting carrier substrate with a first surface and a second surface. The semiconductor component is configured on the first surface of the carrier substrate. The second surface of the carrier substrate has a metallization that can be connected to a reference voltage applied by an electrical path through the carrier substrate to a first contacting region of the first surface of the carrier substrate. The first contact of the semiconductor component is electrically connected to the first contacting region.
摘要翻译：光发射和/或接收装置具有半导体部件，其具有用于连接到参考电压的第一触点和用于获得或提供高频电信号的第二触点。还有一种具有第一表面和第二表面的导电载体衬底。半导体元件配置在载体基板的第一表面上。载体衬底的第二表面具有金属化，其可以连接到通过载体衬底的电路径施加的参考电压到载体衬底的第一表面的第一接触区域。半导体部件的第一接触电连接到第一接触区域。

7. 发明申请

US20050190545A1 ARRANGEMENT FOR THE ELECTRICAL CONNECTION OF AN OPTOELECTRONIC COMPONENT TO AN ELECTRICAL COMPONENT 有权
标题翻译：光电组件与电气部件的电气连接的布置
公开(公告)号：US20050190545A1
公开(公告)日：2005-09-01
申请号：US10789429
申请日：2004-02-27
申请人： Daniel Reznik , Volker Plickert , Lutz Melchior
发明人： Daniel Reznik , Volker Plickert , Lutz Melchior
IPC分类号： H05K1/18 , H05K7/06
CPC分类号： H01R12/62 , H05K1/189
摘要： An arrangement including an optoelectronic component having terminal contacts, an electrical component having first electrical contacts and second electrical contacts, a printed circuit board, to which the second electrical contacts of the electrical component are connected, and a flexible conductor arrangement of a planar form having several conductor tracks. The conductor arrangement provides an electrical connection between the terminal contacts of the optoelectronic component and the first electrical contacts of the electrical component. The conductor arrangement has a first region with first contact regions and a second region with second contact regions. The optoelectronic component is mounted directly on the first region and its terminal contacts are connected to the first contact regions, and/or the electrical component is mounted directly on the second region and its first electrical contacts are connected to the second contact regions.
摘要翻译：一种包括具有端子触点的光电子部件，具有第一电触头和第二电触点的电子部件，电气部件的第二电触点连接到其上的印刷电路板的布置，以及具有平面形式的柔性导体装置，几条导轨。导体装置提供光电子部件的端子触点与电气部件的第一电触头之间的电连接。导体装置具有带有第一接触区域的第一区域和具有第二接触区域的第二区域。光电子部件直接安装在第一区域上，其端子触点连接到第一接触区域，和/或电气部件直接安装在第二区域上，并且其第一电触点连接到第二接触区域。

8. 发明授权

US06798040B2 Power semiconductor switch 有权
标题翻译：功率半导体开关
公开(公告)号：US06798040B2
公开(公告)日：2004-09-28
申请号：US09873227
申请日：2001-06-04
申请人： Daniel Reznik
发明人： Daniel Reznik
IPC分类号： H01L27082
CPC分类号： H01L29/7395 , H01L29/1095
摘要： An IGBT structure includes successive regions whose conductivities have alternating signs. The structure is dimensioned for punch-through and is provided with two buffer layers. As a result, the component becomes symmetrically blocking and is suitable as a semiconductor switch, e.g., for converters.
摘要翻译： IGBT结构包括电导率具有交替符号的连续区域。该结构的尺寸用于穿透，并且设置有两个缓冲层。结果，该部件变得对称地阻塞，并且适合作为半导体开关，例如用于转换器。

9. 发明授权

US6066542A Method for the manufacture of a power semiconductor component 有权
标题翻译：用于制造功率半导体部件的方法
公开(公告)号：US6066542A
公开(公告)日：2000-05-23
申请号：US240837
申请日：1999-02-01
申请人： Daniel Reznik , Hans-Joachim Schulze , Wolfgang Eckhard
发明人： Daniel Reznik , Hans-Joachim Schulze , Wolfgang Eckhard
IPC分类号： H01L29/74 , H01L21/20 , H01L21/301 , H01L21/331 , H01L21/332 , H01L21/336 , H01L21/60 , H01L29/739 , H01L29/749 , H01L29/78 , H01L21/76
CPC分类号： H01L24/80 , H01L21/2007 , H01L29/66333 , H01L29/66348 , H01L29/66363 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01075 , H01L2924/12036 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055
摘要： Component structures of, for example, IGBTs are manufactured on the respective top sides of two substrates, the substrates are thinned proceeding from their respective back sides, and, after polishing, the back sides of the thinned substrates are durably electrically conductively connected to one another by wafer bonding.
摘要翻译：在两个基板的相应顶面上制造例如IGBT的部件结构，基板从其各自的背面进行变薄，并且在抛光之后，薄的基板的背面彼此持久导电连接通过晶片接合。

10. 发明申请

US20060126317A1 Electrical printed circuit board 失效
标题翻译：电气印刷电路板
公开(公告)号：US20060126317A1
公开(公告)日：2006-06-15
申请号：US11009640
申请日：2004-12-10
申请人： Daniel Reznik , Mario Festag
发明人： Daniel Reznik , Mario Festag
IPC分类号： H05K7/06
CPC分类号： H05K1/0233 , H01L2224/16225 , H05K1/0225 , H05K1/0298 , H05K1/112 , H05K1/162 , H05K1/181 , H05K2201/086 , H05K2201/093 , H05K2201/09309 , H05K2201/09663 , H05K2201/10734
摘要： The invention relates to an electrical printed circuit board serving for electrical contact-connection of an integrated circuit. The printed circuit board has a dielectric forming the printed circuit board material; at least one ground inner layer connected to ground potential; and a supply voltage inner layer connected to the potential of the supply voltage. The invention further includes at least one locally formed inner layer electrically connected to the supply voltage inner layer; a first external terminal contact serving for electrical connection to a ground terminal of an integrated circuit; and a second external terminal contact serving for electrical connection to a supply voltage terminal of an integrated circuit. In addition, a first contact-connection is provided between the first external terminal contact and the at least one ground inner layer; and a second contact-connection is provided between the second external terminal contact and the at least one locally formed inner layer. The at least one locally formed inner layer and the at least one ground inner layer provide a printed circuit board decoupling capacitor for an integrated circuit.
摘要翻译：本发明涉及一种用于集成电路的电接触连接的电气印刷电路板。印刷电路板具有形成印刷电路板材料的电介质; 至少一个接地内层连接到地电位; 以及与电源电压的电位连接的电源电压内层。本发明还包括电连接到电源电压内层的至少一个局部形成的内层; 第一外部端子触点，用于电连接到集成电路的接地端子; 以及用于与集成电路的电源电压端子电连接的第二外部端子触点。另外，在第一外部端子触点和至少一个接地内层之间提供第一触点连接; 并且在所述第二外部端子触点和所述至少一个局部形成的内层之间提供第二触点连接。所述至少一个局部形成的内层和所述至少一个接地内层为集成电路提供印刷电路板去耦电容器。

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