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    • 3. 发明申请
    • Passivated Emitter Rear Locally Patterned Epitaxial Solar Cell
    • 钝化发射体后局部图案外延太阳能电池
    • US20150059847A1
    • 2015-03-05
    • US14461250
    • 2014-08-15
    • Crystal Solar, Incorporated
    • Kramadhati V. RaviTirunelveli S. Ravi
    • H01L31/0224H01L31/18H01L31/0368H01L31/028H01L31/0216
    • H01L31/022433H01L31/02167H01L31/022425H01L31/056H01L31/1804Y02E10/52Y02E10/547Y02P70/521
    • Passivated emitter rear local epitaxy (PERL-e) thin Si solar cells may be formed with a heavily doped epitaxial back surface field (BSF) layer, which is patterned to form well spaced point contacts to the silicon base on the rear of the solar cell. The back side of the cell may be finished with a dielectric passivation layer and a metallization layer for making electrical contact to the cell. PERL-e thick Si solar cells may be formed with heavily doped epitaxial films as the back point contacts, where the point contacts are defined by the provision of a selectively patterned thermal oxide on the rear wafer surface. Furthermore, absorption of longer wavelength, infrared (IR), light in thin silicon solar cells may be improved by the addition of a dielectric stack on the rear surface of the solar cell (a back reflector), the stack acting to reflect the longer wavelength light back through the active layers of the solar cell.
    • 钝化的发射体后局部外延(PERL-e)薄Si太阳能电池可以用重掺杂的外延后表面场(BSF)层形成,其被图案化以形成与太阳能电池背面上的硅基极好的间隔开的点接触 。 电池的背面可以用电介质钝化层和用于与电池电接触的金属化层来完成。 PERL-e厚Si太阳能电池可以用重掺杂的外延膜形成作为背点接触,其中通过在后晶片表面上提供选择性图案化的氧化物来限定点接触。 此外,通过在太阳能电池(背面反射器)的后表面上添加电介质堆叠可以改善薄硅太阳能电池中长波长,红外(IR)光的吸收,该反应堆反射更长的波长 通过太阳能电池的有源层回光。
    • 4. 发明申请
    • HIGH THROUGHPUT MULTI-WAFER EPITAXIAL REACTOR
    • 高通量多波长外延反应器
    • US20140311403A1
    • 2014-10-23
    • US14216434
    • 2014-03-17
    • Crystal Solar, Incorporated
    • Visweswaren SivaramakrishnanKedarnath SangamTirunelveli S. RaviAndrzej KaszubaQuoc Vinh Truong
    • C30B25/12
    • C30B25/12C30B25/08C30B25/105C30B35/005
    • An epitaxial reactor enabling simultaneous deposition of thin films on a multiplicity of wafers is disclosed. During deposition, a number of wafers are contained within a wafer sleeve comprising a number of wafer carrier plates spaced closely apart to minimize the process volume. Process gases flow preferentially into the interior volume of the wafer sleeve, which is heated by one or more lamp modules. Purge gases flow outside the wafer sleeve within a reactor chamber to minimize deposition on the chamber walls. Sequencing of the illumination of the individual lamps in the lamp module may further improve the linearity of variation in deposition rates within the wafer sleeve. To improve uniformity, the direction of process gas flow may be varied in a cross-flow configuration. Combining lamp sequencing with cross-flow processing in a multiple reactor system enables high throughput deposition with good film uniformities and efficient use of process gases.
    • 公开了一种能够在多个晶片上同时沉积薄膜的外延反应器。 在沉积期间,许多晶片被包含在晶片套筒内,其包括间隔开的多个晶片承载板,以最小化处理体积。 工艺气体优先流入由一个或多个灯模块加热的晶片套筒的内部容积。 吹扫气体在反应器室内的晶片套筒外部流动,以最小化室壁上的沉积。 对灯模组中的各个灯的照明进行排序可以进一步提高晶片套筒内沉积速率变化的线性。 为了改善均匀性,工艺气体流动的方向可以在横流构型中变化。 将灯排序与多反应器系统中的交叉流处理相结合,可实现高通量沉积,具有良好的膜均匀性和有效利用工艺气体。
    • 5. 发明授权
    • High throughput multi-wafer epitaxial reactor
    • 高通量多晶圆外延反应堆
    • US08663753B2
    • 2014-03-04
    • US13664332
    • 2012-10-30
    • Crystal Solar, Incorporated
    • Visweswaren SivaramakrishnanKedarnath SangamTirunelveli S. RaviAndrzej KaszubaQuoc Vinh
    • C23C8/00C23C16/00
    • C23C16/481C23C16/0209C23C16/455C23C16/4582C23C16/46C23C16/463C23C16/54C30B25/105C30B25/12C30B29/06
    • An epitaxial reactor enabling simultaneous deposition of thin films on a multiplicity of wafers is disclosed. During deposition, a number of wafers are contained within a wafer sleeve comprising a number of wafer carrier plates spaced closely apart to minimize the process volume. Process gases flow preferentially into the interior volume of the wafer sleeve, which is heated by one or more lamp modules. Purge gases flow outside the wafer sleeve within a reactor chamber to minimize wall deposition. In addition, sequencing of the illumination of the individual lamps in the lamp module may further improve the linearity of variation in deposition rates within the wafer sleeve. To improve uniformity, the direction of process gas flow may be varied in a cross-flow configuration. Combining lamp sequencing with cross-flow processing in a multiple reactor system enables high throughput deposition with good film uniformities and efficient use of process gases.
    • 公开了一种能够在多个晶片上同时沉积薄膜的外延反应器。 在沉积期间,许多晶片被包含在晶片套筒内,其包括间隔开的多个晶片承载板,以最小化处理体积。 工艺气体优先流入由一个或多个灯模块加热的晶片套筒的内部容积。 吹扫气体在反应器室内的晶片套筒外部流动,以最小化壁沉积。 此外,灯模组中各灯的照明顺序可以进一步提高晶片套筒内沉积速率变化的线性。 为了改善均匀性,工艺气体流动的方向可以在横流构型中变化。 将灯排序与多反应器系统中的交叉流处理相结合,可实现高通量沉积,具有良好的膜均匀性和有效利用工艺气体。