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1. 发明申请

US20040188064A1 Channeled flat plate fin heat exchange system, device and method 有权
标题翻译：通风平板翅片换热系统，装置及方法
公开(公告)号：US20040188064A1
公开(公告)日：2004-09-30
申请号：US10699505
申请日：2003-10-30
申请人： Cooligy Inc.
发明人： Girish Upadhya , Richard Herms , Peng Zhou , Kenneth Goodson
IPC分类号： H05K007/20
CPC分类号： F28F3/02 , F04B17/00 , F04B19/006 , F28D15/0266 , F28F3/12 , F28F2210/10 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A device, method, and system for a fluid cooled channeled heat exchange device is disclosed. The fluid cooled channeled heat exchange device utilizes fluid circulated through a channel heat exchanger for high heat dissipation and transfer area per unit volume. The device comprises a highly thermally conductive material, preferably with less than 200 W/m-K. The preferred channel heat exchanger comprises two coupled flat plates and a plurality of fins coupled to the flat plates. At least one of the plates preferably to receive flow of a fluid in a heated state. The fluid preferably carries heat from a heat source (such as a CPU, for example). Specifically, at least one of the plates preferably comprises a plurality of condenser channels configured to receive, to condense, and to cool the fluid in the heated state. The fluid in a cooler state is preferably carried from the device to the heat source, thereby cooling the heat source.
摘要翻译：公开了一种用于流体冷却通道式热交换装置的装置，方法和系统。流体冷却通道热交换装置利用通过通道热交换器循环的流体，用于高散热和每单位体积的传递面积。该装置包括高导热性材料，优选小于200W / m-K。优选的通道热交换器包括两个联接的平板和耦合到平板的多个翅片。至少一个板优选地接收处于加热状态的流体的流动。流体优选地承载来自热源（例如CPU）的热量。具体地，至少一个板优选地包括多个冷凝器通道，其构造成在加热状态下接收，冷凝和冷却流体。处于较冷状态的流体优选从装置运送到热源，从而冷却热源。

2. 发明申请

US20040233639A1 Removeable heat spreader support mechanism and method of manufacturing thereof 审中-公开
标题翻译：可拆卸的散热器支撑机构及其制造方法
公开(公告)号：US20040233639A1
公开(公告)日：2004-11-25
申请号：US10746223
申请日：2003-12-24
申请人： Cooligy, Inc.
发明人： Girish Upadhya , Mark Munch , Peng Zhou , Kenneth Goodson , Thomas W. Kenny
IPC分类号： H05K007/20 , F28F007/00
CPC分类号： H01L23/36 , H01L23/10 , H01L2924/0002 , H01L2924/00
摘要： A mounting assembly comprises a rigid support bracket configured to substantially surround a heat source. The rigid support bracket is coupled to a circuit board. The mounting assembly also comprises a removable lid that is coupled to the rigid support bracket and configured to provide selective access to the heat source. The mounting assembly further comprises a heat exchanger coupled to the heat source, wherein the heat exchanger is positioned between the heat source and the removable lid. The removable lid is preferably configured and has a desired stiffness to urge the heat exchanger in contact by a substantially constant force with the heat source and prevents unwanted movement of the heat source. Further, the support bracket structure is configured to transfer the substantially constant force over a relatively large surface area on the circuit board thereby protecting the heat source from bending, breaking or collapsing from the substantially constant force. The removable lid is preferably made of a material, including but not limited to copper, which accommodates a desired amount of heat transfer from an area within the support bracket.
摘要翻译：安装组件包括构造成基本上围绕热源的刚性支撑支架。刚性支撑托架连接到电路板。安装组件还包括可拆卸盖，其被连接到刚性支撑托架并且构造成提供对热源的选择性接近。安装组件还包括耦合到热源的热交换器，其中热交换器位于热源和可移除盖之间。可移动盖优选地构造并且具有期望的刚度，以通过与热源的基本恒定的力来促使热交换器接触，并且防止热源的不期望的移动。此外，支撑托架结构构造成在电路板上相对较大的表面积上传递基本上恒定的力，从而保护热源免受基本恒定的力的弯曲，破坏或塌陷。可移除盖优选地由包括但不限于铜的材料制成，其适应从支撑托架内的区域的期望量的热传递。

3. 发明申请

US20040244950A1 Optimized multiple heat pipe blocks for electronics cooling 有权
标题翻译：优化多个热管块用于电子冷却
公开(公告)号：US20040244950A1
公开(公告)日：2004-12-09
申请号：US10440363
申请日：2003-05-16
申请人： Cooligy, Inc.
发明人： Peng Zhou , Dolf van Der Heide , Kenneth Goodson , Girish Upadhya
IPC分类号： F28D015/00
CPC分类号： F04B17/00 , F28D15/0266 , F28D20/026 , F28F23/00 , F28F2210/08 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for removing heat from a heat generating device is disclosed. The apparatus comprises a plate thermally coupled to the heat generating device and thermally coupled to two beat pipes wherein each heat pipe is configured to have a predetermined boiling point temperature selected according to design criteria. The apparatus can include one or more additional heat pipes coupled to the plate. The apparatus can include a heat spreader, wherein the heat spreader is in thermal contact with the heat generating device and with at least one of the heat pipes. The heat pipes can differ in outer cross-sectional dimensions depending on thermal distance position relative to the heat generating device, such that the heat pipes located a farther thermal distance from the heat generating device have smaller outer cross-sectional dimensions than the heat pipes located a shorter thermal distance from the heat generating device.
摘要翻译：公开了一种用于从发热装置中除热的装置。该装置包括热耦合到发热装置并热耦合到两个打浆管的板，其中每个热管被配置成具有根据设计标准选择的预定沸点温度。该装置可以包括耦合到该板的一个或多个附加热管。该装置可以包括散热器，其中散热器与发热装置和至少一个热管热接触。热管可以根据相对于发热装置的热距离位置的外截面尺寸不同，使得位于与发热装置更远的热距离的热管具有比位于的热管更小的外横截面尺寸距离发热装置的热距离更短。

4. 发明申请

US20040206477A1 Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device 有权
标题翻译：用于冷却发热装置的有效的垂直流体输送的方法和装置
公开(公告)号：US20040206477A1
公开(公告)日：2004-10-21
申请号：US10680584
申请日：2003-10-06
申请人： Cooligy, Inc.
发明人： Thomas W. Kenny , Mark Munch , Peng Zhou , James Gill Shook , Girish Upadhya , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
IPC分类号： F28F007/00
CPC分类号： F04B17/00 , F04B19/006 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F13/06 , F28F13/185 , F28F2210/10 , F28F2245/04 , F28F2260/02 , G06Q20/20 , H01L23/473 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.
摘要翻译：热交换器及其制造方法包括用于冷却热源的界面层。界面层耦合到热源并被配置成使流体从中流过。热交换器还包括耦合到界面层的歧管层。歧管层包括至少一个第一端口，其耦合到第一组个体化的孔，其将流体通过第一组。歧管层包括耦合到第二组个体化孔的至少一个第二端口，其将流体通过第二组。第一组孔和第二组孔布置成在第一和第二端口之间提供最小化的流体路径距离，以充分冷却热源。优选地，第一组中的每个孔定位成与第二组的相邻孔最接近的最佳距离。

5. 发明申请

US20040112571A1 Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device 审中-公开
标题翻译：用于冷却发热装置的有效的垂直流体输送的方法和装置
公开(公告)号：US20040112571A1
公开(公告)日：2004-06-17
申请号：US10698179
申请日：2003-10-30
申请人： Cooligy, Inc.
发明人： Thomas W. Kenny , Mark Munch , Peng Zhou , James Gill Shook , Girish Upadhya , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette , James Hom
IPC分类号： F28F007/00 , F28F013/18 , F28F019/02
CPC分类号： H01L23/473 , F04B17/00 , F04B19/006 , F25B21/02 , F25B2321/0252 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F13/06 , F28F13/185 , F28F2210/10 , G06F1/20 , G06F2200/201 , G06Q20/20 , H01L23/38 , H01L23/4735 , H01L35/30 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for cooling a hat source configured along a lane. The heat exchanger comprises an interface layer that perform thermal exchanger with the heat source and configured to pass fluid from a first side to a second side. The manifold layer comprises a first layer in contact with the heat source and has an appropriate thermal conductivity to pass heat to the interface layer. The manifold layer further comprises a second layer couple to the first layer and in contact with the second side of the interface layer. The first layer comprises a recess area having a heat conducting region in contact with the heat exchanging layer. The first layer includes at least one inlet and/or outlet port. The second layer includes at least one inlet and/or outlet port. At least one inlet and/or outlet port is positioned substantially parallel or perpendicular with respect to the plane.
摘要翻译：一种用于冷却沿着车道配置的帽子源的方法和装置。热交换器包括界面层，该界面层与热源一起执行热交换器，并被配置为将流体从第一侧传送到第二侧。歧管层包括与热源接触的第一层，并且具有适当的导热性以将热量传递到界面层。歧管层还包括与第一层耦合并与界面层的第二侧接触的第二层。第一层包括具有与热交换层接触的导热区域的凹部区域。第一层包括至少一个入口和/或出口。第二层包括至少一个入口和/或出口。至少一个入口端口和/或出口端口相对于该平面基本平行或垂直地定位。

6. 发明申请

US20040182551A1 Boiling temperature design in pumped microchannel cooling loops 审中-公开
标题翻译：泵送微通道冷却回路中的沸腾温度设计
公开(公告)号：US20040182551A1
公开(公告)日：2004-09-23
申请号：US10643638
申请日：2003-08-18
申请人： Cooligy, Inc.
发明人： Peng Zhou , Shulin Zeng , Thomas Kenny , Mark Munch , Girish Upadhya , Kenneth Goodson , Juan Santiago
IPC分类号： F28D015/00
CPC分类号： H01L23/473 , F28D15/0266 , F28D15/06 , H01L2924/0002 , H01L2924/00
摘要： A method of cooling at least one heat generating device using a cooling system is disclosed. The method comprises the steps of using at least one pump to cause a fluid to flow in at least one heat exchanger and adjusting a pressure of the fluid to correspondingly adjust a boiling point temperature of the fluid in the at least one heat exchanger. The method can also include the step of providing at least one heat rejector for rejecting heat from the system, the at least one heat rejector being situated downstream of the at least one heat exchanger. The step of adjusting a pressure of the fluid can comprise adjusting a pressure of the fluid during charging and sealing of the system. Further, the step of adjusting a pressure of the fluid can comprise adjusting a composition and volume of a gas and liquid introduced during charging of the system.
摘要翻译：公开了一种使用冷却系统来冷却至少一个发热装置的方法。该方法包括以下步骤：使用至少一个泵来使流体在至少一个热交换器中流动并且调节流体的压力以相应地调节至少一个热交换器中的流体的沸点温度。该方法还可以包括提供至少一个散热器以排除来自系统的热的步骤，所述至少一个热排出器位于至少一个热交换器的下游。调节流体压力的步骤可以包括在系统充电和密封期间调节流体的压力。此外，调节流体压力的步骤可以包括调节在系统充电期间引入的气体和液体的组成和体积。

7. 发明申请

US20040148959A1 Remedies to prevent cracking in a liquid system 有权
标题翻译：补救措施以防止液体系统中的开裂
公开(公告)号：US20040148959A1
公开(公告)日：2004-08-05
申请号：US10643641
申请日：2003-08-18
申请人： Cooligy, Inc.
发明人： Mark Munch , Kenneth Goodson , David Corbin , Shulin Zeng , Thomas W. Kenny , James Gill Shook
IPC分类号： F25D011/00 , F25B001/00
CPC分类号： H01L23/473 , F04B17/00 , F28D15/00 , F28F19/006 , F28F2245/02 , F28F2250/08 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are designed to prevent cracking of their enclosures and chambers. Also described are methods of preventing cracking in a liquid cooling system. In all these cases, the system must be designed to tolerate expansion when water is frozen.
摘要翻译：提供使用最小尺寸和体积的外壳，气穴，可压缩物体和柔性物体的液体冷却系统，以防止冻结时水性溶液的膨胀。在这种系统中，管道，泵和热交换器被设计成防止其外壳和腔室的破裂。还描述了防止液体冷却系统中的裂纹的方法。在所有这些情况下，系统必须设计成在水被冻结时容忍膨胀。

8. 发明申请

US20040112585A1 Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device 有权
标题翻译：用于在发热装置中实现温度均匀性和热点冷却的方法和装置
公开(公告)号：US20040112585A1
公开(公告)日：2004-06-17
申请号：US10698304
申请日：2003-10-30
申请人： Cooligy Inc.
发明人： Kenneth Goodson , Thomas Kenny , Peng Zhou , Girish Upadhya , Mark Munch , Mark McMaster , James Hom
IPC分类号： F28F007/00 , F28F013/18 , B21D053/02 , G05D023/00 , F28F019/02
CPC分类号： F28F3/048 , F04B19/006 , F28D15/00 , F28F3/12 , F28F2260/02 , H01L23/427 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exchanging surface, wherein the first temperature fluid undergoes thermal exchange with the heat source along the heat exchanging surface. The method comprises channeling a second temperature fluid from the heat exchange surface, wherein fluid is channeled to minimize temperature differences along the heat source. The temperature differences are minimized by optimizing and controlling the fluidic and thermal resistances in the heat exchanger. The resistances to the fluid are influenced by size, volume and surface area of heat transferring features, multiple pumps, fixed and variable valves and flow impedance elements in the fluid path, pressure and flow rate control of the fluid, and other factors.
摘要翻译：一种控制与热交换器的热交换表面接触的热源的温度的方法，其中所述热交换表面沿着平面基本上对齐。该方法包括将第一温度流体引导到热交换表面，其中第一温度流体沿着热交换表面与热源进行热交换。该方法包括从热交换表面引导第二温度流体，其中流体被引导以最小化沿着热源的温度差。通过优化和控制热交换器中的流体和热电阻来最小化温差。对流体的阻力受传热特征，多个泵，固定和可变阀以及流体路径中的流量阻抗元件，流体的压力和流量控制等因素的尺寸，体积和表面积的影响。

9. 发明申请

US20040188066A1 Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange 有权
标题翻译：最优的撒布机系统，流体冷却微型热交换的装置和方法
公开(公告)号：US20040188066A1
公开(公告)日：2004-09-30
申请号：US10698180
申请日：2003-10-30
申请人： Cooligy, Inc.
发明人： Girish Upadhya , Richard Herms , Peng Zhou , Kenneth Goodson , James Hom
IPC分类号： H05K007/20
CPC分类号： F28F3/02 , F04B17/00 , F04B19/006 , F28D15/0266 , F28F3/12 , F28F2210/10 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A device, method, and system for a fluid cooled micro-scaled heat exchanger is disclosed. The fluid cooled micro-scaled heat exchanger utilizes a micro-scaled region and a spreader region with specific materials and ranges of dimensions, to yield high heat dissipation and transfer area per unit volume from a heat source. The micro-scaled region preferably comprises microchannels, but in alternate embodiments, comprises a micro-porous structure, or micro-pillars, or is comprised from the group of microchannels, a micro-porous structure, and micro-pillars.
摘要翻译：公开了一种用于流体冷却的微型热交换器的装置，方法和系统。流体冷却的微型热交换器利用具有特定材料和尺寸范围的微尺度区域和扩展器区域，以从热源产生高的散热和每单位体积的传递面积。微尺度区域优选地包括微通道，但是在替代实施例中，微孔结构包括微孔结构或微柱，或由微通道，微孔结构和微柱组成。

10. 发明申请

US20040104022A1 Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device 有权
标题翻译：用于冷却发热装置中所需热点的柔性流体输送的方法和装置
公开(公告)号：US20040104022A1
公开(公告)日：2004-06-03
申请号：US10439635
申请日：2003-05-16
申请人： Cooligy, Inc.
发明人： Thomas W. Kenny , Mark Munch , Peng Zhou , James Gill Shook , Girish Upadhya , Kenneth Goodson , David Corbin
IPC分类号： G05D023/00 , F28F013/18 , F28F019/02 , B21D053/02
CPC分类号： G06Q20/20 , F04B17/00 , F04B19/006 , F28D15/0266 , F28D21/0015 , F28F3/12 , F28F13/06 , F28F2210/10 , F28F2260/02 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.
摘要翻译：一种热交换器装置和制造方法，包括：用于冷却热源并被配置为使流体通过其中的界面层，所述界面层具有适当的导热性和用于向界面层提供流体的歧管层，其中所述歧管层为被配置为优选地通过冷却界面热点区域来实现热源中的温度均匀性。多个流体端口被配置到诸如入口和出口的热交换器，由此流体端口被垂直和水平地配置。歧管层将流体循环到界面层中的预定界面热点区域，其中界面热点区域与热点相关联。热交换器优选地包括位于界面和歧管层之间的中间层，并且将流体最佳地通向界面热点区域。

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