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    • 1. 发明申请
    • Boiling temperature design in pumped microchannel cooling loops
    • 泵送微通道冷却回路中的沸腾温度设计
    • US20040182551A1
    • 2004-09-23
    • US10643638
    • 2003-08-18
    • Cooligy, Inc.
    • Peng ZhouShulin ZengThomas KennyMark MunchGirish UpadhyaKenneth GoodsonJuan Santiago
    • F28D015/00
    • H01L23/473F28D15/0266F28D15/06H01L2924/0002H01L2924/00
    • A method of cooling at least one heat generating device using a cooling system is disclosed. The method comprises the steps of using at least one pump to cause a fluid to flow in at least one heat exchanger and adjusting a pressure of the fluid to correspondingly adjust a boiling point temperature of the fluid in the at least one heat exchanger. The method can also include the step of providing at least one heat rejector for rejecting heat from the system, the at least one heat rejector being situated downstream of the at least one heat exchanger. The step of adjusting a pressure of the fluid can comprise adjusting a pressure of the fluid during charging and sealing of the system. Further, the step of adjusting a pressure of the fluid can comprise adjusting a composition and volume of a gas and liquid introduced during charging of the system.
    • 公开了一种使用冷却系统来冷却至少一个发热装置的方法。 该方法包括以下步骤:使用至少一个泵来使流体在至少一个热交换器中流动并且调节流体的压力以相应地调节至少一个热交换器中的流体的沸点温度。 该方法还可以包括提供至少一个散热器以排除来自系统的热的步骤,所述至少一个热排出器位于至少一个热交换器的下游。 调节流体压力的步骤可以包括在系统充电和密封期间调节流体的压力。 此外,调节流体压力的步骤可以包括调节在系统充电期间引入的气体和液体的组成和体积。