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    • 4. 发明授权
    • Semiconductor device, method for manufacturing same, communication
system and electric circuit system
    • 半导体装置及其制造方法,通信系统及电路系统
    • US5949097A
    • 1999-09-07
    • US932939
    • 1997-09-17
    • Koji HirataTomonori TanoueHiroshi MasudaHiroyuki UchiyamaKazuhiro Mochizuki
    • Koji HirataTomonori TanoueHiroshi MasudaHiroyuki UchiyamaKazuhiro Mochizuki
    • H01L21/331H01L21/768H01L27/06H01L29/737H01L29/04
    • H01L29/66318H01L27/0605H01L29/7371
    • The present invention relates to a contact structure not only for a semiconductor device having a hetero-junction bipolar transistor or a hetero-insulated gate field effect transistor but also for semiconductor devices at large. In a semiconductor layer of a polycrystalline or amorphous undoped III-V compound semiconductor or an alloy thereof, a through hole is formed for contact. The size of the through hole is set to permit exposure of at least part of a first conductor layer and a dielectric layer, such as an Si compound, present around the first conductor layer, and a second conductor layer is formed within the through hole so as to contact the first conductor layer. Since the semiconductor layer can be subjected to a selective dry etching for the dielectric layer, the dielectric layer is not etched at the time of forming the above through hole in the semiconductor layer. As a result an electric short-circuit of the second conductor layer with a single crystal semiconductor layer which underlies the dielectric layer can be prevented.
    • 本发明涉及不仅具有异质结双极晶体管或异质绝缘栅场效应晶体管的半导体器件的接触结构,而且还涉及用于半导体器件的半导体器件。 在多晶或非晶未掺杂的III-V族化合物半导体的半导体层或其合金中,形成用于接触的通孔。 通孔的尺寸被设定为允许暴露在第一导体层周围的第一导体层和诸如Si化合物的电介质层的至少一部分,并且在通孔内形成第二导体层,因此 以接触第一导体层。 由于可以对半导体层进行电介质层的选择性干蚀刻,所以在形成半导体层中的上述通孔时不会蚀刻电介质层。 结果,可以防止具有位于电介质层下面的单晶半导体层的第二导体层的电短路。
    • 7. 发明申请
    • Metal base transistor and oscillator using the same
    • 金属基极晶体管和振荡器使用相同
    • US20060163696A1
    • 2006-07-27
    • US11208561
    • 2005-08-23
    • Kazuhiro MochizukiShigehisa TanakaTomonori Tanoue
    • Kazuhiro MochizukiShigehisa TanakaTomonori Tanoue
    • H01L27/082
    • H01L29/7606H01L29/2003
    • The most important task in realizing a downsized and low cost THz band spectroscopic and fluoroscopic instrument is to achieve downsizing and cost reduction of oscillators used in the instrument. A metal base transistor is used for an active element of the oscillator. In order to improve the maximum oscillation frequency of the transistor to several THZ, InN having a high electron saturation velocity or a material mainly composed of InN is used for a collector layer. In order to obtain characteristics with excellent reproducibility, it is useful to insert InGaN into an interface between the collector layer and the base layer. Using the metal base transistor of the present invention makes it possible to constitute an oscillator allowing a THz band oscillation. Further, the present invention provides a spectroscopic instrument applying this oscillator to at least one of a signal source and a local oscillator.
    • 实现小型化,低成本的太赫兹频带光谱和荧光检测仪器最重要的任务是实现仪器中使用的振荡器的小型化和降低成本。 金属基极晶体管用于振荡器的有源元件。 为了将晶体管的最大振荡频率提高到几个THZ,具有高电子饱和速度的InN或主要由InN组成的材料用于集电极层。 为了获得具有优异再现性的特性,将InGaN插入到集电极层和基极层之间的界面是有用的。 使用本发明的金属基极晶体管可以构成允许THz频带振荡的振荡器。 此外,本发明提供了一种将该振荡器应用于信号源和本地振荡器中的至少一个的分光仪器。
    • 8. 发明授权
    • Semiconductor device and method for fabricating the same
    • 半导体装置及其制造方法
    • US06743691B2
    • 2004-06-01
    • US10026613
    • 2001-12-27
    • Atsushi KurokawaMasao YamaneKazuhiro Mochizuki
    • Atsushi KurokawaMasao YamaneKazuhiro Mochizuki
    • H01L218222
    • H01L29/7304H01L21/8252H01L27/0605H01L28/20H01L29/73
    • A bipolar transistor device with a large current capacity is formed by connecting a plurality of transistor elements to each other in parallel, each transistor element having a collector layer, a base layer, and an emitter layer formed respectively in a semiconductor substrate. In the bipolar transistor device, the base layers of a plurality of the transistor elements are extended in parallel to each other and those base layers are separated from each other. In each separated base layer, a first base electrode is formed on a part of the base layer which is separated from an emitter junction with the emitter layer, and a second base electrode is formed on another portion of the base layer closer to the emitter junction than the first base electrode. To dispose the base electrodes of a plurality of the transistor elements in parallel to each other, a base wiring is connected to the first base electrodes of those elements electrically. Consequently, a ballast resistor that causes no variation in the resistance value can be connected to each of a plurality of the transistor elements.
    • 通过并联连接多个晶体管元件来形成具有大电流容量的双极晶体管器件,每个晶体管元件具有分别形成在半导体衬底中的集电极层,基极层和发射极层。 在双极晶体管器件中,多个晶体管元件的基极层彼此平行地延伸,并且这些基极层彼此分离。 在每个分离的基底层中,第一基极形成在与发射极层的发射极结分离的基底层的一部分上,并且第二基极形成在基极层的更靠近发射极结的另一部分 比第一基极。 为了将多个晶体管元件的基极电极彼此平行地配置,基极配线与这些元件的第一基极电连接。 因此,不会导致电阻值变动的镇流电阻器可以连接到多个晶体管元件中的每一个。