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    • 1. 发明授权
    • Texture-induced magnetic anisotropy of soft underlayers for perpendicular recording media
    • 用于垂直记录介质的软底层的纹理感应磁各向异性
    • US06667118B1
    • 2003-12-23
    • US09911738
    • 2001-07-25
    • Chung-Hee ChangRajiv Yadav Ranjan
    • Chung-Hee ChangRajiv Yadav Ranjan
    • G11B566
    • G11B5/667G11B5/656G11B5/7315G11B5/8404Y10S428/90Y10T428/24975Y10T428/265
    • Perpendicular magnetic recording media having no, or substantially reduced, Barkhausen noise are manufactured by a method comprising steps of: (a) providing a non-magnetic substrate having a surface; (b) providing the surface of the substrate with a unidirectional texture pattern; (c) forming an underlayer of a soft magnetic material over the unidirectional texture pattern, the layer of soft magnetic material having positive magnetostriction and uniaxial magnetic anisotropy and including a multiplicity of magnetic domains; and (d) forming a magnetic recording layer of a hard magnetic material over the underlayer; wherein the uniaxial magnetic anisotropy of the underlayer of soft magnetic material is sufficiently large to orient the magnetic domains thereof along the axis of the uniaxial magnetic anisotropy and thereby restrict domain wall formation and/or movement, whereby generation of Barkhausen noise in the soft underlayer is suppressed.
    • 通过包括以下步骤的方法制造没有或基本上减少的巴克豪森噪声的垂直磁记录介质:(a)提供具有表面的非磁性基板;(b)为基板的表面提供单向纹理图案; (c)在单向纹理图案上形成软磁材料的底层,所述软磁材料层具有正的磁致伸缩和单轴磁各向异性并且包括多个磁畴; 以及(d)在所述底层上形成硬磁性材料的磁记录层;其中,所述软磁性材料的底层的单轴磁各向异性足够大以使其沿着所述单轴磁各向异性轴的方向取向, 畴壁形成和/或移动,从而抑制软底层中的巴克豪森噪声的产生。
    • 2. 发明授权
    • Perpendicular magnetic recording media with improved interlayer
    • 具有改善中间层的垂直磁记录介质
    • US06777066B1
    • 2004-08-17
    • US09986063
    • 2001-11-07
    • Chung-Hee ChangRajiv Yadav Ranjan
    • Chung-Hee ChangRajiv Yadav Ranjan
    • G11B5667
    • G11B5/667G11B5/656
    • A low noise, high areal recording density, perpendicular magnetic recording medium comprises: (a) a non-magnetic substrate having a surface; and (b) a layer stack formed over the substrate surface, the layer stack comprising, in overlying sequence from the substrate surface: (i) a magnetically soft underlayer; (ii) at least one non-magnetic interlayer; and (iii) a CoCr-based, magnetically hard perpendicular recording layer; wherein the compositions of the at least one non-magnetic interlayer and the CoCr-based, magnetically hard perpendicular recording layer are selected to provide the medium with a negative nucleation field Hn, remanent squareness of about 1, and high coercivity of at least about 5,000 Oe. A method for manufacturing the medium by means of DC magnetron sputtering of layers (i)-(iii) is also disclosed.
    • 低噪声,高面积记录密度,垂直磁记录介质包括:(a)具有表面的非磁性基底; 以及(b)形成在所述衬底表面上的层叠层,所述层堆叠以从衬底表面的顺序包括:(i)软磁性底层;(ii)至少一个非磁性中间层; 和(iii)基于CoCr的磁性硬的垂直记录层;其中选择所述至少一个非磁性中间层和所述CoCr基磁性硬垂直记录层的组成以向所述介质提供负成核场Hn ,约1的残余矩形度和至少约5,000Oe的高矫顽力。还公开了通过层(i) - (iii)的DC磁控溅射制造介质的方法。
    • 4. 发明授权
    • MRAM fabrication method with sidewall cleaning
    • MRAM制造方法与侧壁清洁
    • US08574928B2
    • 2013-11-05
    • US13443818
    • 2012-04-10
    • Kimihiro SatohYiming HuaiYuchen ZhouJing ZhangDong Ha JungEbrahim AbedifardRajiv Yadav RanjanParviz Keshtbod
    • Kimihiro SatohYiming HuaiYuchen ZhouJing ZhangDong Ha JungEbrahim AbedifardRajiv Yadav RanjanParviz Keshtbod
    • H01L21/00
    • H01L27/222H01L43/12
    • Fabrication methods for MRAM are described wherein any re-deposited metal on the sidewalls of the memory element pillars is cleaned before the interconnection process is begun. In embodiments the pillars are first fabricated, then a dielectric material is deposited on the pillars over the re-deposited metal on the sidewalls. The dielectric material substantially covers any exposed metal and therefore reduces sources of re-deposition during subsequent etching. Etching is then performed to remove the dielectric material from the top electrode and the sidewalls of the pillars down to at least the bottom edge of the barrier. The result is that the previously re-deposited metal that could result in an electrical short on the sidewalls of the barrier is removed. Various embodiments of the invention include ways of enhancing or optimizing the process. The bitline interconnection process proceeds after the sidewalls have been etched clean as described.
    • 描述了用于MRAM的制造方法,其中在互连过程开始之前清洁存储元件柱的侧壁上的任何重新沉积的金属。 在实施例中,首先制造柱,然后将介电材料沉积在侧壁上的再沉积金属上的柱上。 电介质材料基本上覆盖任何暴露的金属,因此在随后的蚀刻期间减少再沉积的来源。 然后进行蚀刻以将电介质材料从顶部电极和柱的侧壁向下移动到至少阻挡层的底部边缘。 结果是可能导致在屏障的侧壁上导致电短路的先前重新沉积的金属被去除。 本发明的各种实施方案包括增强或优化方法的方法。 如所描述的那样,在侧壁被蚀刻清洁之后,进行位线互连处理。