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1. 发明授权

US08102379B2 Touch sensing device and touch sensing apparatus 有权
标题翻译：触摸感应装置和触摸感应装置
公开(公告)号：US08102379B2
公开(公告)日：2012-01-24
申请号：US12139833
申请日：2008-06-16
申请人： Chung-Cheng Chou , William Wang , Chia-Hung Hsu , Chin-Yung Chen
发明人： Chung-Cheng Chou , William Wang , Chia-Hung Hsu , Chin-Yung Chen
IPC分类号： G06F3/041 , B41J2/41 , G02B26/00
CPC分类号： G06F3/041
摘要： The invention discloses a touch sensing device, which includes a containing space, a first substrate layer, a second substrate layer, a driver, and a sensor. The first substrate layer and the second substrate layer define the containing space for containing a fluid. The driver can provide charges to a first conducting layer of the first substrate layer, a second conducting layer of the second substrate layer, and the fluid. The sensor can sense the electric characteristics of the fluid. When a point unit approaches the touch sensing device and influences the charges, the appearance of the fluid could be changed and then the electric characteristics could also be changed.
摘要翻译：本发明公开了一种触摸感测装置，其包括容纳空间，第一基板层，第二基板层，驱动器和传感器。第一衬底层和第二衬底层限定用于容纳流体的容纳空间。驱动器可以向第一衬底层的第一导电层，第二衬底层的第二导电层和流体提供电荷。传感器可感测流体的电气特性。当点单元接近触摸感测装置并影响电荷时，可以改变流体的外观，然后电特性也可以改变。

2. 发明授权

US07829388B2 Integrated circuit package and fabricating method thereof 有权
标题翻译：集成电路封装及其制造方法
公开(公告)号：US07829388B2
公开(公告)日：2010-11-09
申请号：US12694239
申请日：2010-01-26
申请人： Chin-Yung Chen , Chia-Hung Hsu , William Wang , Chung-Cheng Chou
发明人： Chin-Yung Chen , Chia-Hung Hsu , William Wang , Chung-Cheng Chou
IPC分类号： H01L21/00
CPC分类号： H01L23/3735 , H01L23/3677 , H01L24/48 , H01L2224/16 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.
摘要翻译：本发明公开了一种集成电路封装。集成电路封装包括具有第一表面和与其相对的第二表面的基板以及从第一表面到第二表面穿过基板的第一孔。多个导电线设置在基板的第二表面的一部分上。半导体芯片设置在衬底的第二表面上方，其中在半导体芯片和衬底之间形成腔室。多个接合焊盘设置在半导体芯片的朝向衬底的第二表面的一侧上，其中至少一个接合焊盘电连接到多条导线之一。第一散热层设置在第一孔中并延伸到腔室中。还提供了一种用于制造集成电路封装的方法。

3. 发明授权

US07804169B2 Integrated circuit package and fabricating method thereof 有权
公开(公告)号：US07804169B2
公开(公告)日：2010-09-28
申请号：US12102439
申请日：2008-04-14
申请人： Chin-Yung Chen , Chia-Hung Hsu , William Wang , Chung-Cheng Chou
发明人： Chin-Yung Chen , Chia-Hung Hsu , William Wang , Chung-Cheng Chou
IPC分类号： H01L23/10
CPC分类号： H01L23/3735 , H01L23/3677 , H01L24/48 , H01L2224/16 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.

4. 发明申请

US20090179324A1 Integrated circuit package and fabricating method thereof 有权
标题翻译：集成电路封装及其制造方法
公开(公告)号：US20090179324A1
公开(公告)日：2009-07-16
申请号：US12102439
申请日：2008-04-14
申请人： Chin-Yung Chen , Chia-Hung Hsu , William Wang , Chung-Cheng Chou
发明人： Chin-Yung Chen , Chia-Hung Hsu , William Wang , Chung-Cheng Chou
IPC分类号： H01L23/36 , H01L21/56
CPC分类号： H01L23/3735 , H01L23/3677 , H01L24/48 , H01L2224/16 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.
摘要翻译：本发明公开了一种集成电路封装。集成电路封装包括具有第一表面和与其相对的第二表面的基板以及从第一表面到第二表面穿过基板的第一孔。多个导电线设置在基板的第二表面的一部分上。半导体芯片设置在衬底的第二表面上方，其中在半导体芯片和衬底之间形成腔室。多个接合焊盘设置在半导体芯片的朝向衬底的第二表面的一侧上，其中至少一个接合焊盘电连接到多条导线之一。第一散热层设置在第一孔中并延伸到腔室中。还提供了一种用于制造集成电路封装的方法。

5. 发明申请

US20100129963A1 INTEGRATED CIRCUIT PACKAGE AND FABRICATING METHOD THEREOF 有权
标题翻译：集成电路封装及其制作方法
公开(公告)号：US20100129963A1
公开(公告)日：2010-05-27
申请号：US12694239
申请日：2010-01-26
申请人： Chin-Yung Chen , Chia-Hung Hsu , William Wang , Chung-Cheng Chou
发明人： Chin-Yung Chen , Chia-Hung Hsu , William Wang , Chung-Cheng Chou
IPC分类号： H01L21/60
CPC分类号： H01L23/3735 , H01L23/3677 , H01L24/48 , H01L2224/16 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.
摘要翻译：本发明公开了一种集成电路封装。集成电路封装包括具有第一表面和与其相对的第二表面的基板以及从第一表面到第二表面穿过基板的第一孔。多个导电线设置在基板的第二表面的一部分上。半导体芯片设置在衬底的第二表面上方，其中在半导体芯片和衬底之间形成腔室。多个接合焊盘设置在半导体芯片的朝向衬底的第二表面的一侧上，其中至少一个接合焊盘电连接到多条导线之一。第一散热层设置在第一孔中并延伸到腔室中。还提供了一种用于制造集成电路封装的方法。

6. 发明申请

US20090179326A1 SEMICONDUCTOR DEVICE PACKAGE 审中-公开
标题翻译：半导体器件封装
公开(公告)号：US20090179326A1
公开(公告)日：2009-07-16
申请号：US12106148
申请日：2008-04-18
申请人： Ko-Yang Tso , Chung-Cheng Chou , William Wang , Chia-Hung Hsu
发明人： Ko-Yang Tso , Chung-Cheng Chou , William Wang , Chia-Hung Hsu
IPC分类号： H01L23/49
CPC分类号： H01L24/06 , H01L23/49838 , H01L24/16 , H01L24/48 , H01L24/49 , H01L2224/0401 , H01L2224/05553 , H01L2224/05554 , H01L2224/05647 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48227 , H01L2224/48235 , H01L2224/49175 , H01L2224/4943 , H01L2224/73204 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/10161 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The invention provides a semiconductor device package. The package includes a chip disposed on a supported board and a conductive path formed between the chip and the supported board, on the backside of the supported board, or on the chip, so that the conductive path does not have to go around a region where the chip is located. Accordingly, the dimensions of the semiconductor device package are reduced.
摘要翻译：本发明提供一种半导体器件封装。该封装包括设置在支撑板上的芯片和形成在芯片和支撑板之间，支撑板的背面或芯片上的导电路径，使得导电路径不必绕过芯片位于。因此，半导体器件封装的尺寸减小。

7. 发明授权

US08593414B2 Optical touch system and operating method thereof 有权
标题翻译：光触摸系统及其操作方法
公开(公告)号：US08593414B2
公开(公告)日：2013-11-26
申请号：US12718658
申请日：2010-03-05
申请人： Meng-Shin Yen , William Wang , Chung-Cheng Chou
发明人： Meng-Shin Yen , William Wang , Chung-Cheng Chou
IPC分类号： G06F3/041
CPC分类号： G06F3/0423 , G06F1/1643
摘要： An optical touch system is disclosed. The optical touch system includes an optical touch apparatus, a control apparatus, and a rotating apparatus. When the control apparatus receives a mode switching signal, the control apparatus selects a corresponding specific using mode from a plurality of default using modes according to the mode switching signal. And, the specific using mode corresponds to a specific rotating angle. The rotating apparatus rotates the optical touch apparatus with the specific rotating angle to make the optical touch apparatus is rotated from a first location to a second location, so that a user can perform an input action via the optical touch apparatus according to the specific using mode.
摘要翻译：公开了一种光学触摸系统。光学触摸系统包括光学触摸装置，控制装置和旋转装置。当控制装置接收到模式切换信号时，控制装置根据模式切换信号从多个默认使用模式中选择对应的特定使用模式。而且，具体使用模式对应于特定的旋转角度。旋转装置以特定的旋转角旋转光学触摸装置，使得光学触摸装置从第一位置旋转到第二位置，使得用户可以根据特定的使用模式经由光学触摸装置执行输入动作。

8. 发明授权

US08564784B2 Large area optical diagnosis apparatus and operating method thereof 有权
标题翻译：大面积光诊断装置及其操作方法
公开(公告)号：US08564784B2
公开(公告)日：2013-10-22
申请号：US13204132
申请日：2011-08-05
申请人： William Wang , Chung-Cheng Chou , Che-Liang Tsai
发明人： William Wang , Chung-Cheng Chou , Che-Liang Tsai
IPC分类号： G01B9/02
CPC分类号： G01N21/4795 , A61B5/0066 , A61B5/0073 , G01B9/02019 , G01B9/02027 , G01B9/02091 , G01B2290/45
摘要： A large area optical diagnosis apparatus and the operating method thereof are disclosed. The large area optical diagnosis apparatus includes a light source, a light path structure, and a sensing module. The light source is used to at least emit a coherent light. The light path structure includes a plurality of optical units used for dividing the coherent light into a plurality of first incident lights and a plurality of second incident lights. The plurality of first incident lights are emitted toward an object to be diagnosed and the plurality of second incident lights are emitted toward a reference end. The object to be diagnosed and the reference end reflect the plurality of first incident lights and the plurality of second incident lights to be a plurality of reflected lights. The sensing module senses the plurality of reflected lights to generate a sensing result related to the object to be diagnosed.
摘要翻译：公开了一种大面积光诊断装置及其操作方法。大面积光诊断装置包括光源，光路结构和感测模块。光源用于至少发出相干光。光路结构包括用于将相干光分为多个第一入射光和多个第二入射光的多个光学单元。多个第一入射光朝向被诊断对象发射，并且多个第二入射光朝向参考端发射。要诊断的对象和参考端将多个第一入射光和多个第二入射光反射成多个反射光。感测模块感测多个反射光以产生与被诊断对象相关的感测结果。

9. 发明授权

US08562912B2 Portable biochemical testing apparatus and operating method thereof 失效
标题翻译：便携式生化检测仪器及其操作方法
公开(公告)号：US08562912B2
公开(公告)日：2013-10-22
申请号：US13190602
申请日：2011-07-26
申请人： Chung-Cheng Chou , William Wang
发明人： Chung-Cheng Chou , William Wang
IPC分类号： G01N21/01
CPC分类号： G01N27/447
摘要： A portable biochemical testing apparatus and operating method thereof are disclosed. The portable biochemical testing apparatus includes a light source module, a sample module, a photoconductive material layer, a touch module, and a control module. At least one sample is disposed in the sample module. The photoconductive material layer is disposed between the sample module and the light source module. The touch module generates a driving signal according to a touch action of the user to drive the light source module to emit a light. When the light is emitted to the photoconductive material layer, the photoconductive material layer will generate a photoelectric driving effect. The at least one sample is affected by the photoelectric driving effect and generates a change corresponding to the touch action.
摘要翻译：公开了一种便携式生化测试装置及其操作方法。便携式生化测试装置包括光源模块，样品模块，感光材料层，触摸模块和控制模块。样品模块中至少放置一个样品。光电导材料层设置在样品模块和光源模块之间。触摸模块根据用户的触摸动作产生驱动信号，以驱动光源模块发光。当光被发射到光导材料层时，光导材料层将产生光电驱动效果。至少一个样品受到光电驱动效应的影响，并产生与触摸动作相对应的变化。

10. 发明申请

US20120239017A1 OPTICAL APPARATUS AND OPERATING METHOD THEREOF 审中-公开
标题翻译：光学装置及其操作方法
公开(公告)号：US20120239017A1
公开(公告)日：2012-09-20
申请号：US13419999
申请日：2012-03-14
申请人： William Wang , Chung-Cheng Chou
发明人： William Wang , Chung-Cheng Chou
IPC分类号： A61B18/20 , A61N5/067
CPC分类号： A61B18/203 , A61B2018/00452 , A61B2018/00702 , A61B2018/00732
摘要： An optical apparatus is disclosed. The optical apparatus includes an optical emitting module, a sensing module, and a processing module. The optical emitting module is used to emit a laser toward a specific region of skin surface. The sensing module is used to sense tissue distribution information under the specific region of skin surface. The processing module is used to adjust at least one laser parameter used during the optical emitting module emits the laser toward the specific region of skin surface according to the tissue distribution information.
摘要翻译：公开了一种光学装置。光学装置包括光发射模块，感测模块和处理模块。光发射模块用于向皮肤表面的特定区域发射激光。感测模块用于感测皮肤表面特定区域下的组织分布信息。处理模块用于根据组织分布信息来调整在光发射模块期间使用的至少一个激光参数朝向皮肤表面的特定区域发射激光。

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