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1. 发明申请

US20060243997A1 High power LEDs 有权
标题翻译：大功率LED
公开(公告)号：US20060243997A1
公开(公告)日：2006-11-02
申请号：US11415150
申请日：2006-05-02
申请人： Chun Yang , Hong-Xi Cao , Chia-Tai Kuo , Chih-Li Chen , Cheng-Fa Chen , Ji-Bin Horng
发明人： Chun Yang , Hong-Xi Cao , Chia-Tai Kuo , Chih-Li Chen , Cheng-Fa Chen , Ji-Bin Horng
IPC分类号： H01L33/00
CPC分类号： H01L33/641 , H01L33/483 , H01L33/60 , H01L33/647 , H01L2224/45144 , H01L2224/48091 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： A high power LED has at least a porous material layer, a thermal conductive layer and a chip. The thermal conductive layer is disposed on the surface of the porous material layer and the chip is disposed on the thermal conductive layer. Heat generated by the chip is conducted from the thermal conductive layer to the porous material layer, and convected outside via the porous material layer. Thereby, surface area in contact with the air is increased and high thermal conductivity and high heat convection are also achieved.
摘要翻译：大功率LED至少具有多孔材料层，导热层和芯片。导热层设置在多孔材料层的表面上，芯片设置在导热层上。由芯片产生的热量从导热层传导到多孔材料层，并通过多孔材料层在外面对流。因此，与空气接触的表面积增加，并且也实现了高导热性和高热对流性。

2. 发明授权

US07598533B2 High heat dissipating LED having a porous material layer 有权
标题翻译：具有多孔材料层的高散热LED
公开(公告)号：US07598533B2
公开(公告)日：2009-10-06
申请号：US11415150
申请日：2006-05-02
申请人： Chun Chieh Yang , Hong-Xi Cao , Chia-Tai Kuo , Chih-Li Chen , Cheng-Fa Chen , Ji-Bin Horng
发明人： Chun Chieh Yang , Hong-Xi Cao , Chia-Tai Kuo , Chih-Li Chen , Cheng-Fa Chen , Ji-Bin Horng
IPC分类号： H01L33/00 , H01L31/0256
CPC分类号： H01L33/641 , H01L33/483 , H01L33/60 , H01L33/647 , H01L2224/45144 , H01L2224/48091 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： A high power LED has at least a porous material layer, a thermal conductive layer and a chip. The thermal conductive layer is disposed on the surface of the porous material layer and the chip is disposed on the thermal conductive layer. Heat generated by the chip is conducted from the thermal conductive layer to the porous material layer, and convected outside via the porous material layer. Thereby, surface area in contact with the air is increased and high thermal conductivity and high heat convection are also achieved.
摘要翻译：大功率LED至少具有多孔材料层，导热层和芯片。导热层设置在多孔材料层的表面上，芯片设置在导热层上。由芯片产生的热量从导热层传导到多孔材料层，并通过多孔材料层在外面对流。因此，与空气接触的表面积增加，并且也实现了高导热性和高热对流性。

3. 发明授权

US08053791B2 Structure of AC light-emitting diode dies 有权
标题翻译：交流发光二极管管芯的结构
公开(公告)号：US08053791B2
公开(公告)日：2011-11-08
申请号：US12424109
申请日：2009-04-15
申请人： Ming-Te Lin , Fei-Chang Hwang , Chia-Tai Kuo
发明人： Ming-Te Lin , Fei-Chang Hwang , Chia-Tai Kuo
IPC分类号： H01L33/00 , H01L33/62
CPC分类号： H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.
摘要翻译：具有设置在芯片上的至少一个AC LED微管芯单元形成的具有AC环路（AC LED管芯的结构）的发光二极管（LED）裸片的结构。交流LED微型模具的单元包括两个彼此相反取向并且彼此并联连接的LED微型模具，可以施加交流电源，使得LED单元响应于正向连续地发光 - 交流电源中的一次波电压和一个负半波电压。由于每个AC LED微型裸片都是正向运行的，所以AC LED芯片的结构也提供了防止静电荷（ESD）的保护，并且可以在高电压下工作。

4. 发明授权

US08368099B2 Light emitting device and fabricating method thereof 有权
标题翻译：发光元件及其制造方法
公开(公告)号：US08368099B2
公开(公告)日：2013-02-05
申请号：US12182218
申请日：2008-07-30
申请人： Chien-Chun Lu , Chia-Tai Kuo , Chen-Peng Hsu , Hung-Lieh Hu , Chien-Jen Sun
发明人： Chien-Chun Lu , Chia-Tai Kuo , Chen-Peng Hsu , Hung-Lieh Hu , Chien-Jen Sun
IPC分类号： H01L33/00
CPC分类号： H01L33/505 , H01L33/508 , H01L33/60 , H01L2924/0002 , H05B33/10 , H01L2924/00
摘要： A light emitting device and a fabricating method thereof are described. The light emitting device includes a substrate, a light emitting chip, a tubular structure, and a fluorescent conversion layer. The tubular structure is formed on a surface of the substrate. The light emitting chip is disposed on the surface of the substrate and is surrounded by the tubular structure. The fluorescent conversion layer is disposed in the tubular structure and covers the light emitting chip. A ratio of a maximal vertical thickness and a maximal horizontal thickness of the fluorescent conversion layer at the light emitting chip is between 0.1 and 10. A distance for the light ray to pass through the fluorescent conversion layer is controlled by using the tubular structure, so as to solve a problem of the conventional art that fluorescent powder coating package technique results in non-uniform color temperature of the emitted light.
摘要翻译：描述了发光器件及其制造方法。发光器件包括衬底，发光芯片，管状结构和荧光转换层。管状结构形成在基板的表面上。发光芯片设置在基板的表面上并被管状结构包围。荧光转换层设置在管状结构中并覆盖发光芯片。发光芯片上的荧光转换层的最大垂直厚度与最大水平厚度的比率为0.1至10.通过使用管状结构来控制光线穿过荧光转换层的距离，因此为了解决现有技术的问题，荧光粉末涂布包装技术导致发出的光的不均匀的色温。

5. 发明申请

US20080218093A1 Structure of AC light-emitting diode dies 审中-公开
标题翻译：交流发光二极管管芯的结构
公开(公告)号：US20080218093A1
公开(公告)日：2008-09-11
申请号：US12149852
申请日：2008-05-09
申请人： Ming-Te Lin , Fei-Chang Hwang , Chia-Tai Kuo
发明人： Ming-Te Lin , Fei-Chang Hwang , Chia-Tai Kuo
IPC分类号： H05B37/02 , H05B41/24
CPC分类号： H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.
摘要翻译：具有设置在芯片上的至少一个AC LED微管芯单元形成的具有AC环路（AC LED管芯的结构）的发光二极管（LED）裸片的结构。交流LED微型模具的单元包括两个彼此相反取向并且彼此并联连接的LED微型模具，可以施加交流电源，使得LED单元响应于正向连续地发光 - 交流电源中的一次波电压和一个负半波电压。由于每个AC LED微型裸片都是正向运行的，所以AC LED芯片的结构也提供了防止静电荷（ESD）的保护，并且可以在高电压下工作。

6. 发明申请

US20090115313A1 LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20090115313A1
公开(公告)日：2009-05-07
申请号：US12182218
申请日：2008-07-30
申请人： Chien-Chun LU , Chia-Tai Kuo , Chen-Peng Hsu , Hung-Lieh Hu , Chien-Jen Sun
发明人： Chien-Chun LU , Chia-Tai Kuo , Chen-Peng Hsu , Hung-Lieh Hu , Chien-Jen Sun
IPC分类号： H01J1/62 , H01J9/02
CPC分类号： H01L33/505 , H01L33/508 , H01L33/60 , H01L2924/0002 , H05B33/10 , H01L2924/00
摘要： A light emitting device and a fabricating method thereof are described. The light emitting device includes a substrate, a light emitting chip, a tubular structure, and a fluorescent conversion layer. The tubular structure is formed on a surface of the substrate. The light emitting chip is disposed on the surface of the substrate and is surrounded by the tubular structure. The fluorescent conversion layer is disposed in the tubular structure and covers the light emitting chip. A ratio of a maximal vertical thickness and a maximal horizontal thickness of the fluorescent conversion layer at the light emitting chip is between 0.1 and 10. A distance for the light ray to pass through the fluorescent conversion layer is controlled by using the tubular structure, so as to solve a problem of the conventional art that fluorescent powder coating package technique results in non-uniform color temperature of the emitted light.
摘要翻译：描述了发光器件及其制造方法。发光器件包括衬底，发光芯片，管状结构和荧光转换层。管状结构形成在基板的表面上。发光芯片设置在基板的表面上并被管状结构包围。荧光转换层设置在管状结构中并覆盖发光芯片。发光芯片上的荧光转换层的最大垂直厚度与最大水平厚度之比在0.1和10之间。通过使用管状结构来控制光线通过荧光转换层的距离，因此为了解决现有技术的问题，荧光粉末涂布包装技术导致发出的光的不均匀的色温。

7. 发明授权

US08803166B2 Structure of AC light-emitting diode dies 有权
标题翻译：交流发光二极管管芯的结构
公开(公告)号：US08803166B2
公开(公告)日：2014-08-12
申请号：US12861495
申请日：2010-08-23
申请人： Ming-Te Lin , Fei-Chang Hwang , Chia-Tai Kuo
发明人： Ming-Te Lin , Fei-Chang Hwang , Chia-Tai Kuo
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： An arrangement of light emitting diodes including a first micro-die, a second micro-die, a first bridge, a second bridge and a substrate supporting the first micro-die and the second micro die. The first micro-die includes a first edge having a first end and a second end, a second edge opposite and not parallel to the first edge, a first connecting portion near the first end, and a second connecting portion near the second end.
摘要翻译：包括第一微型管芯，第二微型管芯，第一桥接器，第二桥接器和支撑第一微型管芯和第二微型管芯的衬底的发光二极管的布置。第一微型模头包括具有第一端和第二端的第一边缘，与第一边缘相对且不平行的第二边缘，靠近第一端的第一连接部分和靠近第二端部的第二连接部分。

8. 发明申请

US20110012137A1 STRUCTURE OF AC LIGHT-EMITTING DIODE DIES 有权
标题翻译：交流发光二极管的结构
公开(公告)号：US20110012137A1
公开(公告)日：2011-01-20
申请号：US12861495
申请日：2010-08-23
申请人： Ming-Te LIN , Fei-Chang Hwang , Chia-Tai Kuo
发明人： Ming-Te LIN , Fei-Chang Hwang , Chia-Tai Kuo
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.
摘要翻译：具有设置在芯片上的至少一个AC LED微管芯单元形成的具有AC环路（AC LED管芯的结构）的发光二极管（LED）裸片的结构。交流LED微型模具的单元包括两个彼此相反取向并且彼此并联连接的LED微型模具，可以施加交流电源，使得LED单元响应于正向连续地发光 - 交流电源中的一次波电压和一个负半波电压。由于每个AC LED微型裸片都是正向运行的，所以AC LED芯片的结构也提供了防止静电荷（ESD）的保护，并且可以在高电压下工作。

9. 发明授权

US07589354B2 Light emitting diode package and process of making the same 有权
标题翻译：发光二极管封装和制造过程相同
公开(公告)号：US07589354B2
公开(公告)日：2009-09-15
申请号：US11194630
申请日：2005-08-02
申请人： Ming-Te Lin , Sheng-Pan Huang , Chia-Tai Kuo , Chiu-Ling Chen , Ya-Hui Chiang , Ming-Yao Lin
发明人： Ming-Te Lin , Sheng-Pan Huang , Chia-Tai Kuo , Chiu-Ling Chen , Ya-Hui Chiang , Ming-Yao Lin
IPC分类号： H01L27/15 , H01L29/267 , H01L31/12 , H01L33/00
CPC分类号： H01L33/60 , H01L25/0753 , H01L33/483 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73265 , H01L2924/3025 , H01L2924/00 , H01L2924/00014
摘要： A light emitting diode (LED) package includes at least one LED chip, a carrier, a light reflection element and at least one outside connection electrode. The LED chip is disposed on the carrier and a conductive line or a flip chip method is used to connect the electrodes of the LED chip to the external connection electrodes. A transparent material is used for fixing the light reflection element and carrier, and forming a lens.
摘要翻译：发光二极管（LED）封装包括至少一个LED芯片，载体，光反射元件和至少一个外部连接电极。 LED芯片设置在载体上，并且使用导线或倒装芯片方法将LED芯片的电极连接到外部连接电极。透明材料用于固定光反射元件和载体，并形成透镜。

10. 发明申请

US20060145173A1 Light emitting diode package and process of making the same 有权
公开(公告)号：US20060145173A1
公开(公告)日：2006-07-06
申请号：US11194630
申请日：2005-08-02
申请人： Ming-Te Lin , Sheng-Pan Huang , Chia-Tai Kuo , Chiu-Ling Chen , Ya-Hui Chiang , Ming-Yao Lin
发明人： Ming-Te Lin , Sheng-Pan Huang , Chia-Tai Kuo , Chiu-Ling Chen , Ya-Hui Chiang , Ming-Yao Lin
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L25/0753 , H01L33/483 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73265 , H01L2924/3025 , H01L2924/00 , H01L2924/00014
摘要： A light emitting diode (LED) package includes at least one LED chip, a carrier, a light reflection element and at least one outside connection electrode. The LED chip is disposed on the carrier and a conductive line or a flip chip method is used to connect the electrodes of the LED chip to the external connection electrodes. A transparent material is used for fixing the light reflection element and carrier, and forming a lens.

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