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1. 发明申请

US20060278080A1 Negative ion air purifier 审中-公开
标题翻译：负离子空气净化器
公开(公告)号：US20060278080A1
公开(公告)日：2006-12-14
申请号：US11376003
申请日：2006-03-15
申请人： Chuang Li , Yong Du , Hong Li
发明人： Chuang Li , Yong Du , Hong Li
IPC分类号： B03C3/68
CPC分类号： B03C3/32 , B03C3/68
摘要： The utility model discloses a negative ion air purifier, comprising an electrostatic field-generating module and a voltage boost circuit. The voltage output end of the voltage boost circuit connects with the voltage input end of the electrostatic field-generating module. Said electrostatic field-generating module includes anodes and cathodes that are arrange alternately and equidistantly. A frequency conversion and voltage regulation module is further added, whose voltage signal sampling end connects with the voltage output end of said voltage boost circuit and whose control end connects with the voltage signal input end of said voltage boost circuit, thus making the device adapted to the fluctuation of the mains electricity between 180V to 240V and perform its functions steadily, and overcoming the disadvantages of existing products, such as the proneness to burnout and stop, unstable release of the ion flow, big noise and the difficulty in keeping effective.
摘要翻译：本实用新型公开了一种负离子空气净化器，包括静电场产生模块和升压电路。升压电路的电压输出端与静电场发生模块的电压输入端连接。所述静电场产生模块包括交替且等距布置的阳极和阴极。进一步增加了变频和电压调节模块，其电压信号采样端与所述升压电路的电压输出端连接，并且其控制端与所述升压电路的电压信号输入端相连，从而使该装置适于市电电压在180V至240V之间波动，稳定运行，克服了现有产品的缺点，如烧灼和停止倾向，离子流不稳定释放，噪音大，难以保持有效。

2. 外观设计

USD532504S1 Metallic dust-collecting plates 有权
标题翻译：金属集尘板
公开(公告)号：USD532504S1
公开(公告)日：2006-11-21
申请号：US29230691
申请日：2005-05-24
申请人： Hong Li , Chuang Li , Yong Du
设计人： Hong Li , Chuang Li , Yong Du

3. 外观设计

USD532505S1 Metallic dust-collecting plates 有权
公开(公告)号：USD532505S1
公开(公告)日：2006-11-21
申请号：US29230747
申请日：2005-05-24
申请人： Hong Li , Chuang Li , Yong Du
设计人： Hong Li , Chuang Li , Yong Du

4. 外观设计

USD529160S1 Air purifier 有权
公开(公告)号：USD529160S1
公开(公告)日：2006-09-26
申请号：US29229376
申请日：2005-05-06
申请人： Chuang Li , Yong Du , Hong Li
设计人： Chuang Li , Yong Du , Hong Li

5. 发明授权

US07923349B2 Wafer level surface passivation of stackable integrated circuit chips 有权
标题翻译：晶圆级表面钝化堆叠式集成电路芯片
公开(公告)号：US07923349B2
公开(公告)日：2011-04-12
申请号：US12142589
申请日：2008-06-19
申请人： Simon J. S. McElrea , Terrence Caskey , Scott McGrath , DeAnn Eileen Melcher , Reynaldo Co , Lawrence Douglas Andrews, Jr. , Weiping Pan , Grant Villavicencio , Yong Du , Scott Jay Crane , Zongrong Liu
发明人： Simon J. S. McElrea , Terrence Caskey , Scott McGrath , DeAnn Eileen Melcher , Reynaldo Co , Lawrence Douglas Andrews, Jr. , Weiping Pan , Grant Villavicencio , Yong Du , Scott Jay Crane , Zongrong Liu
IPC分类号： H01L21/46 , H01L21/78 , H01L21/301
CPC分类号： H01L21/6835 , H01L21/6836 , H01L21/78 , H01L23/3185 , H01L24/81 , H01L24/83 , H01L2221/68327 , H01L2221/6834 , H01L2221/68359 , H01L2221/68377 , H01L2224/2919 , H01L2224/81801 , H01L2224/83851 , H01L2924/14 , H01L2924/1461 , H01L2924/0665 , H01L2924/00014 , H01L2924/00
摘要： An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).
摘要翻译：至少在晶片加工过程中至少施加电绝缘保形涂层至模具的活性（前）侧和一个或多个侧壁。此外，模具具有至少施加到活性（前）侧和侧壁的电绝缘保形涂层。此外，组件包括这种模具的叠层，电互连的模 - 芯; 并且组件包括这种管芯或这种管芯的堆叠，电连接到下面的电路（例如在基板或电路板中）。

6. 发明申请

US20100099145A1 RECOMBINANT HUMAN EPO-FC FUSION PROTEINS WITH PROLONGED HALF-LIFE AND ENHANCED ERYTHROPOIETIC ACTIVITY IN VIVO 有权
公开(公告)号：US20100099145A1
公开(公告)日：2010-04-22
申请号：US12555742
申请日：2009-09-08
申请人： Haitao WANG , Chungsheng Mao , Jizhi Li , Jing XU , Rui ZHANG , Ling Wang , Yong Du , Longbin LIU
发明人： Haitao WANG , Chungsheng Mao , Jizhi Li , Jing XU , Rui ZHANG , Ling Wang , Yong Du , Longbin LIU
IPC分类号： C12P21/00 , C07H21/04 , C12N5/16
CPC分类号： C07K14/505 , A61K9/0019 , A61K38/00 , A61K47/6811 , C07K2317/53 , C07K2319/30
摘要： A recombinant fusion protein comprising a human erythropoietin peptide portion linked to an immunoglobulin peptide portion is described. The fusion protein has a prolonged half-life in vivo in comparison to naturally occurring or recombinant native human erythropoietin. In one embodiment of the invention, the protein has a half-life in vivo at least three fold higher than native human erythropoietin. The fusion protein also exhibits enhanced erythropoietic bioactivity in comparison to native human erythropoietin. In one embodiment, the fusion protein comprises the complete peptide sequence of a human erythropoietin (EPO) molecule and the peptide sequence of an Fc fragment of human immunoglobulin IgG1. The Fc fragment in the fusion protein includes the hinge region, CH2 and CH3 domains of human immunoglobulin IgG1. The EPO molecule may be linked directly to the Fc fragment to avoid extraneous peptide linkers and lessen the risk of an immunogenic response when administered in vivo. In one embodiment the hinge region is a human Fc fragment variant having a non-cysteine residue at amino acid 6. The invention also relates to nucleic acid and amino acid sequences encoding the fusion protein and transfected cell lines and methods for producing the fusion protein. The invention further includes pharmaceutical compositions comprising the fusion protein and methods of using the fusion protein and/or the pharmaceutical compositions, for example to stimulate erythropoiesis in subjects in need of therapy.

7. 发明授权

US07163839B2 Multi-chip module and method of manufacture 有权
标题翻译：多芯片模块及制造方法
公开(公告)号：US07163839B2
公开(公告)日：2007-01-16
申请号：US11116571
申请日：2005-04-27
申请人： John Yan , Yong Du , Bruce E. Symons
发明人： John Yan , Yong Du , Bruce E. Symons
IPC分类号： H01L21/44
CPC分类号： H01L25/50 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2224/05554 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06555 , H01L2225/06575 , H01L2924/00014 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/32225 , H01L2224/45099 , H01L2224/05599
摘要： A multi-chip module and a method for manufacturing the multi-chip module. A first semiconductor chip is mounted to a support substrate and a second semiconductor chip is mounted to the first semiconductor chip. The second semiconductor chip has a smaller dimension than the first semiconductor chip. A spacer is coupled to the second semiconductor chip. Bonding pads on the first and second semiconductor chips are wirebonded to bonding pads on the support substrate. A third semiconductor chip is mounted to the spacer and bonding pads on the third semiconductor chip are wirebonded to bonding pads on the support substrate.
摘要翻译：一种多芯片模块及其制造方法。第一半导体芯片安装在支撑基板上，第二半导体芯片安装在第一半导体芯片上。第二半导体芯片的尺寸比第一半导体芯片小。间隔件耦合到第二半导体芯片。第一和第二半导体芯片上的接合焊盘被引线键合到支撑衬底上的接合焊盘。第三半导体芯片安装到间隔件上，并且第三半导体芯片上的接合焊盘被引线接合到支撑衬底上的接合焊盘。

8. 发明授权

US08425895B2 Recombinant human interferon-like proteins 有权
标题翻译：重组人干扰素样蛋白
公开(公告)号：US08425895B2
公开(公告)日：2013-04-23
申请号：US12665682
申请日：2007-06-22
申请人： Haitao Wang , Chunsheng Mao , Jizhi Li , Ling Wang , Yong Du , Longbin Liu , Jing Xu , Rui Zhang
发明人： Haitao Wang , Chunsheng Mao , Jizhi Li , Ling Wang , Yong Du , Longbin Liu , Jing Xu , Rui Zhang
IPC分类号： A61K38/21 , C07K14/00 , C08H1/02 , C12P21/04 , C07H21/04 , A61K38/00
CPC分类号： C07K14/56 , A61K38/00 , C07K14/555
摘要： This application relates to recombinant human interferon-like proteins. In one embodiment a recombinant protein created by gene shuffling technology is described having enhanced anti-viral and anti-proliferative activities in comparison to naturally occurring human interferon alpha 2b (HuIFN-α2b). The invention encompasses a polynucleotide encoding the protein and recombinant vectors and host cells comprising the polynucleotide. Preferably the polynucleotide is selected from the group of polynucleotides each having a sequence at least 93% identical to SEQ ID: No. 1 and the protein is selected from the group of proteins each having an amino acid sequence at least 85% identical to SEQ ID NO: 2. The proteins and compositions comprising the proteins can be used for treatment of conditions responsive to interferon therapy, such as viral diseases and cancer.
摘要翻译：本申请涉及重组人类干扰素样蛋白。在一个实施方案中，与天然存在的人干扰素α2b（HuIFN-α2b）相比，描述了通过基因改组技术产生的重组蛋白质具有增强的抗病毒和抗增殖活性。本发明包括编码蛋白质的多核苷酸和包含多核苷酸的重组载体和宿主细胞。优选地，多核苷酸选自各自具有与SEQ ID：No.1至少93％相同的序列的多核苷酸，并且所述蛋白质选自蛋白质组，其各自具有与SEQ ID NO：至少85％相同的氨基酸序列包含蛋白质的蛋白质和组合物可用于治疗对干扰素治疗（例如病毒性疾病和癌症）有反应的病症。

9. 发明授权

US08023587B2 Device and method for pre-distorting a base-band digital signal 有权
标题翻译：用于预失真基带数字信号的装置和方法
公开(公告)号：US08023587B2
公开(公告)日：2011-09-20
申请号：US11945168
申请日：2007-11-26
申请人： Jiefeng Deng , Erni Zhu , Yong Du
发明人： Jiefeng Deng , Erni Zhu , Yong Du
IPC分类号： H04K1/02
CPC分类号： H03F1/3247 , H03F1/3241 , H04B2001/0425
摘要： A device and method for pre-distorting a base-band digital signal. The device includes an adaptive parameter calculation unit and a pre-distorter. The adaptive parameter calculation unit is adapted to calculate nonlinear filter parameters in accordance with samples of a base-band digital signal and a feedback signal of a radio frequency channel, and output a calculation result to the pre-distorter. The pre-distorter is adapted to store and update the nonlinear filter parameters, perform power statistics of the base-band digital signal, select nonlinear filter parameters corresponding to a result of the power statistics, pre-distort the base-band digital signal, and output the pre-distorted base-band digital signal. With the method, the non-linearity of a power amplifier may be improved, different non-linearity inverse models may be selected according to different input signals and power amplifier characteristics, and the efficiency of a base station transmitter may be improved.
摘要翻译：用于预失真基带数字信号的装置和方法。该装置包括自适应参数计算单元和预失真器。自适应参数计算单元适于根据基带数字信号和射频信道的反馈信号的采样来计算非线性滤波器参数，并将计算结果输出到预失真器。预失真器适于存储和更新非线性滤波器参数，执行基带数字信号的功率统计，选择对应于功率统计结果的非线性滤波器参数，对基带数字信号进行预失真，以及输出预失真的基带数字信号。利用该方法，可以提高功率放大器的非线性度，可以根据不同的输入信号和功率放大器特性选择不同的非线性逆模型，并且可以提高基站发射机的效率。

10. 发明申请

US20110147943A1 WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS 有权
标题翻译：可堆叠集成电路板的水平面钝化
公开(公告)号：US20110147943A1
公开(公告)日：2011-06-23
申请号：US13041192
申请日：2011-03-04
申请人： Simon J. S. McElrea , Terrence Caskey , Scott McGrath , DeAnn Eileen Melcher , Reynaldo Co , Lawrence Douglas Andrews, JR. , Weiping Pan , Grant Villavicencio , Yong Du , Scott Jay Crane , Zongrong Liu
发明人： Simon J. S. McElrea , Terrence Caskey , Scott McGrath , DeAnn Eileen Melcher , Reynaldo Co , Lawrence Douglas Andrews, JR. , Weiping Pan , Grant Villavicencio , Yong Du , Scott Jay Crane , Zongrong Liu
IPC分类号： H01L23/48 , H01L21/78
CPC分类号： H01L21/6835 , H01L21/6836 , H01L21/78 , H01L23/3185 , H01L24/81 , H01L24/83 , H01L2221/68327 , H01L2221/6834 , H01L2221/68359 , H01L2221/68377 , H01L2224/2919 , H01L2224/81801 , H01L2224/83851 , H01L2924/14 , H01L2924/1461 , H01L2924/0665 , H01L2924/00014 , H01L2924/00
摘要： An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).
摘要翻译：至少在晶片加工过程中至少施加电绝缘保形涂层至模具的活性（前）侧和一个或多个侧壁。此外，模具具有至少施加到活性（前）侧和侧壁的电绝缘保形涂层。此外，组件包括这种模具的叠层，电互连的模 - 芯; 并且组件包括这种管芯或这种管芯的堆叠，电连接到下面的电路（例如在基板或电路板中）。

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