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1. 发明申请

US20080032041A1 ATOMIC LAYER DEPOSITION OF TANTALUM-CONTAINING MATERIALS USING THE TANTALUM PRECURSOR TAIMATA 有权
标题翻译：使用TANTALUM PRECURSOR TAIMATA的含钽材料的原子层沉积
公开(公告)号：US20080032041A1
公开(公告)日：2008-02-07
申请号：US11773302
申请日：2007-07-03
申请人： Christophe Marcadal , Rongjun Wang , Hua Chung , Nirmalya Maity
发明人： Christophe Marcadal , Rongjun Wang , Hua Chung , Nirmalya Maity
IPC分类号： B05D5/12
CPC分类号： H01L29/495 , C23C16/18 , C23C16/30 , C23C16/45553 , H01L21/28079 , H01L21/28562 , H01L21/76843 , H01L21/76864 , H01L29/4958 , H01L29/517
摘要： In one embodiment, a method for forming a tantalum-containing material on a substrate is provided which includes heating a liquid tantalum precursor containing tertiaryamylimido-tris(dimethylamido) tantalum (TAIMATA) to a temperature of at least 30° C. to form a tantalum precursor gas and exposing the substrate to a continuous flow of a carrier gas during an atomic layer deposition process. The method further provides exposing the substrate to the tantalum precursor gas by pulsing the tantalum precursor gas into the carrier gas and adsorbing the tantalum precursor gas on the substrate to form a tantalum precursor layer thereon. Subsequently, the tantalum precursor layer is exposed to at least one secondary element-containing gas by pulsing the secondary element-containing gas into the carrier gas while forming a tantalum barrier layer on the substrate. The tantalum barrier layer may contain tantalum, tantalum nitride, tantalum silicon nitride, tantalum boron nitride, tantalum phosphorous nitride or tantalum oxynitride.
摘要翻译：在一个实施方案中，提供了一种用于在基底上形成含钽材料的方法，其包括将含有叔戊酰亚氨基 - 三（二甲基氨基）钽（TAIMATA）的液体钽前体加热至至少30℃的温度以形成钽前体气体，并在原子层沉积过程中将衬底暴露于载气的连续流动。该方法进一步通过将钽前体气体脉冲到载气中并将钽前驱体气体吸附在基底上以在其上形成钽前体层而使衬底暴露于钽前体气体。随后，通过在衬底上形成钽阻挡层，将含二次元素的气体脉冲送入载气中，使钽前体层暴露于至少一个含二元素气体。钽阻挡层可以包含钽，氮化钽，氮化钽，氮化硼，氮化钽或氮氧化钽。

2. 发明授权

US07691742B2 Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA 失效
标题翻译：使用钽前体TAIMATA的含钽材料的原子层沉积
公开(公告)号：US07691742B2
公开(公告)日：2010-04-06
申请号：US12365310
申请日：2009-02-04
申请人： Christophe Marcadal , Rongjun Wang , Hua Chung , Nirmalya Maity
发明人： Christophe Marcadal , Rongjun Wang , Hua Chung , Nirmalya Maity
IPC分类号： H01L21/44 , H01L21/285
CPC分类号： H01L29/495 , C23C16/18 , C23C16/30 , C23C16/45553 , H01L21/28079 , H01L21/28562 , H01L21/76843 , H01L21/76864 , H01L29/4958 , H01L29/517
摘要： In one embodiment, a method for forming a tantalum-containing material on a substrate is provided which includes heating a liquid tantalum precursor containing tertiaryamylimido-tris(dimethylamido) tantalum (TAIMATA) to a temperature of at least 30° C. to form a tantalum precursor gas and exposing the substrate to a continuous flow of a carrier gas during an atomic layer deposition process. The method further provides exposing the substrate to the tantalum precursor gas by pulsing the tantalum precursor gas into the carrier gas and adsorbing the tantalum precursor gas on the substrate to form a tantalum precursor layer thereon. Subsequently, the tantalum precursor layer is exposed to at least one secondary element-containing gas by pulsing the secondary element-containing gas into the carrier gas while forming a tantalum barrier layer on the substrate. The tantalum barrier layer may contain tantalum, tantalum nitride, tantalum silicon nitride, tantalum boron nitride, tantalum phosphorous nitride or tantalum oxynitride.
摘要翻译：在一个实施方案中，提供了一种用于在基底上形成含钽材料的方法，其包括将含有叔戊酰亚氨基 - 三（二甲基氨基）钽（TAIMATA）的液体钽前体加热至至少30℃的温度以形成钽前体气体，并在原子层沉积过程中将衬底暴露于载气的连续流动。该方法进一步通过将钽前体气体脉冲到载气中并将钽前驱体气体吸附在基底上以在其上形成钽前体层而使衬底暴露于钽前体气体。随后，通过在衬底上形成钽阻挡层，将含二次元素的气体脉冲送入载气中，使钽前体层暴露于至少一个含二元素气体。钽阻挡层可以包含钽，氮化钽，氮化钽，氮化硼，氮化钽或氮氧化钽。

3. 发明授权

US07241686B2 Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA 有权
标题翻译：使用钽前体TAIMATA的含钽材料的原子层沉积
公开(公告)号：US07241686B2
公开(公告)日：2007-07-10
申请号：US11061039
申请日：2005-02-19
申请人： Christophe Marcadal , Rongjun Wang , Hua Chung , Nirmalya Maity
发明人： Christophe Marcadal , Rongjun Wang , Hua Chung , Nirmalya Maity
IPC分类号： H01L21/44 , H01L21/07
CPC分类号： H01L29/495 , C23C16/18 , C23C16/30 , C23C16/45553 , H01L21/28079 , H01L21/28562 , H01L21/76843 , H01L21/76864 , H01L29/4958 , H01L29/517
摘要： In one example of the invention, a method for depositing a tantalum-containing material on a substrate in a process chamber is provided which includes exposing the substrate to a tantalum precursor that contains TAIMATA and to at least one secondary precursor to deposit a tantalum-containing material during an atomic layer deposition (ALD) process. The ALD process is repeated until the tantalum-containing material is deposited having a predetermined thickness. Usually, the TAIMATA is preheated prior to pulsing the tantalum precursor into the process chamber. Subsequently, a metal layer, such as tungsten or copper, may be deposited on the tantalum-containing material. The tantalum-containing material may contain tantalum, tantalum nitride, tantalum silicon nitride, tantalum boron nitride, tantalum phosphorous nitride, or tantalum oxynitride. The tantalum-containing material may be deposited as a barrier or adhesion layer within a via or as a gate electrode material within a source/drain device.
摘要翻译：在本发明的一个实例中，提供了一种用于在处理室中的衬底上沉积含钽材料的方法，其包括将衬底暴露于含有TAIMATA的钽前体和至少一种次级前体以沉积含钽的材料在原子层沉积（ALD）过程中。重复ALD工艺，直到含有预定厚度的含钽材料沉积。通常，在将钽前体脉冲进入处理室之前，将TAIMATA预热。随后，诸如钨或铜的金属层可以沉积在含钽材料上。含钽材料可以包含钽，氮化钽，氮化钽，氮化硼，氮化钽或氮氧化钽。含钽材料可以作为阻挡层或粘合层沉积在源极/漏极器件内的通孔内或栅极电极材料中。

4. 发明申请

US20090202710A1 ATOMIC LAYER DEPOSITION OF TANTALUM-CONTAINING MATERIALS USING THE TANTALUM PRECURSOR TAIMATA 失效
标题翻译：使用TANTALUM PRECURSOR TAIMATA的含钽材料的原子层沉积
公开(公告)号：US20090202710A1
公开(公告)日：2009-08-13
申请号：US12365310
申请日：2009-02-04
申请人： Christophe Marcadal , Rongjun Wang , Hua Chung , Nirmalya Maity
发明人： Christophe Marcadal , Rongjun Wang , Hua Chung , Nirmalya Maity
IPC分类号： C23C16/18
CPC分类号： H01L29/495 , C23C16/18 , C23C16/30 , C23C16/45553 , H01L21/28079 , H01L21/28562 , H01L21/76843 , H01L21/76864 , H01L29/4958 , H01L29/517
摘要： In one embodiment, a method for forming a tantalum-containing material on a substrate is provided which includes heating a liquid tantalum precursor containing tertiaryamylimido-tris(dimethylamido) tantalum (TAIMATA) to a temperature of at least 30° C. to form a tantalum precursor gas and exposing the substrate to a continuous flow of a carrier gas during an atomic layer deposition process. The method further provides exposing the substrate to the tantalum precursor gas by pulsing the tantalum precursor gas into the carrier gas and adsorbing the tantalum precursor gas on the substrate to form a tantalum precursor layer thereon. Subsequently, the tantalum precursor layer is exposed to at least one secondary element-containing gas by pulsing the secondary element-containing gas into the carrier gas while forming a tantalum barrier layer on the substrate. The tantalum barrier layer may contain tantalum, tantalum nitride, tantalum silicon nitride, tantalum boron nitride, tantalum phosphorous nitride or tantalum oxynitride.
摘要翻译：在一个实施方案中，提供了一种用于在基底上形成含钽材料的方法，其包括将含有叔戊酰亚氨基 - 三（二甲基氨基）钽（TAIMATA）的液体钽前体加热至至少30℃的温度以形成钽前体气体，并在原子层沉积过程中将衬底暴露于载气的连续流动。该方法进一步通过将钽前体气体脉冲到载气中并将钽前驱体气体吸附在基底上以在其上形成钽前体层而使衬底暴露于钽前体气体。随后，通过在衬底上形成钽阻挡层，将含二次元素的气体脉冲送入载气中，使钽前体层暴露于至少一个含二元素气体。钽阻挡层可以包含钽，氮化钽，氮化钽，氮化硼，氮化钽或氮氧化钽。

5. 发明授权

US07524762B2 Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA 有权
标题翻译：使用钽前体TAIMATA的含钽材料的原子层沉积
公开(公告)号：US07524762B2
公开(公告)日：2009-04-28
申请号：US11773302
申请日：2007-07-03
申请人： Christophe Marcadal , Rongjun Wang , Hua Chung , Nirmalya Maity
发明人： Christophe Marcadal , Rongjun Wang , Hua Chung , Nirmalya Maity
IPC分类号： H01L21/44 , H01L21/07
CPC分类号： H01L29/495 , C23C16/18 , C23C16/30 , C23C16/45553 , H01L21/28079 , H01L21/28562 , H01L21/76843 , H01L21/76864 , H01L29/4958 , H01L29/517
摘要： In one embodiment, a method for forming a tantalum-containing material on a substrate is provided which includes heating a liquid tantalum precursor containing tertiaryamylimido-tris(dimethylamido) tantalum (TAIMATA) to a temperature of at least 30° C. to form a tantalum precursor gas and exposing the substrate to a continuous flow of a carrier gas during an atomic layer deposition process. The method further provides exposing the substrate to the tantalum precursor gas by pulsing the tantalum precursor gas into the carrier gas and adsorbing the tantalum precursor gas on the substrate to form a tantalum precursor layer thereon. Subsequently, the tantalum precursor layer is exposed to at least one secondary element-containing gas by pulsing the secondary element-containing gas into the carrier gas while forming a tantalum barrier layer on the substrate. The tantalum barrier layer may contain tantalum, tantalum nitride, tantalum silicon nitride, tantalum boron nitride, tantalum phosphorous nitride or tantalum oxynitride.
摘要翻译：在一个实施方案中，提供了一种用于在基底上形成含钽材料的方法，其包括将含有叔戊酰亚氨基 - 三（二甲基氨基）钽（TAIMATA）的液体钽前体加热至至少30℃的温度以形成钽前体气体，并在原子层沉积过程中将衬底暴露于载气的连续流动。该方法进一步通过将钽前体气体脉冲到载气中并将钽前驱体气体吸附在基底上以在其上形成钽前体层而使衬底暴露于钽前体气体。随后，通过在衬底上形成钽阻挡层，将含二次元素的气体脉冲送入载气中，使钽前体层暴露于至少一个含二元素气体。钽阻挡层可以包含钽，氮化钽，氮化钽，氮化硼，氮化钽或氮氧化钽。

6. 发明申请

US20060019495A1 Atomic layer deposition of tantalum-containing materials using the tantalum precursor taimata 有权
标题翻译：使用钽前体taimata的含钽材料的原子层沉积
公开(公告)号：US20060019495A1
公开(公告)日：2006-01-26
申请号：US11061039
申请日：2005-02-19
申请人： Christophe Marcadal , Rongjun Wang , Hua Chung , Nirmalya Maity
发明人： Christophe Marcadal , Rongjun Wang , Hua Chung , Nirmalya Maity
IPC分类号： H01L21/00
CPC分类号： H01L29/495 , C23C16/18 , C23C16/30 , C23C16/45553 , H01L21/28079 , H01L21/28562 , H01L21/76843 , H01L21/76864 , H01L29/4958 , H01L29/517
摘要： In one example of the invention, a method for depositing a tantalum-containing material on a substrate in a process chamber is provided which includes exposing the substrate to a tantalum precursor that contains TAIMATA and to at least one secondary precursor to deposit a tantalum-containing film during an atomic layer deposition (ALD) process. The ALD process is repeated until the tantalum-containing film is deposited with a predetermined thickness. Usually, the TAIMATA is preheated prior pulsing the tantalum precursor into the process chamber. A metal layer, such as tungsten or copper, may be deposited on the tantalum-containing material. The tantalum-containing material may include tantalum, tantalum nitride, tantalum silicon nitride, tantalum boron nitride, tantalum phosphorous nitride or tantalum oxynitride. The tantalum-containing material may be deposited as a barrier or adhesion layer within a via or as a gate electrode material within a source/drain device.
摘要翻译：在本发明的一个实例中，提供了一种用于在处理室中的衬底上沉积含钽材料的方法，其包括将衬底暴露于含有TAIMATA的钽前体和至少一种次级前体以沉积含钽的在原子层沉积（ALD）过程中的膜。重复ALD处理直到含有钽的膜以预定厚度沉积。通常，TAIMATA在将钽前体脉冲进入处理室之前被预热。诸如钨或铜的金属层可以沉积在含钽材料上。含钽材料可以包括钽，氮化钽，氮化钽，氮化硼，氮化钽或氮氧化钽。含钽材料可以作为阻挡层或粘附层沉积在源极/漏极器件内的通孔或栅电极材料内。

7. 发明申请

US20050009325A1 Atomic layer deposition of barrier materials 失效
标题翻译：阻隔材料的原子层沉积
公开(公告)号：US20050009325A1
公开(公告)日：2005-01-13
申请号：US10871864
申请日：2004-06-18
申请人： Hua Chung , Rongjun Wang , Nirmalya Maity
发明人： Hua Chung , Rongjun Wang , Nirmalya Maity
IPC分类号： C23C16/02 , C23C16/14 , C23C16/44 , C23C16/455 , H01L21/28 , H01L21/285 , H01L21/44 , H01L21/4763 , H01L21/768
CPC分类号： C23C16/45529 , C23C16/02 , C23C16/0281 , C23C16/14 , H01L21/28562 , H01L21/76843 , H01L21/76862 , H01L21/76871 , H01L21/76876
摘要： Methods for processing substrate to deposit barrier layers of one or more material layers by atomic layer deposition are provided. In one aspect, a method is provided for processing a substrate including depositing a metal nitride barrier layer on at least a portion of a substrate surface by alternately introducing one or more pulses of a metal containing compound and one or more pulses of a nitrogen containing compound and depositing a metal barrier layer on at least a portion of the metal nitride barrier layer by alternately introducing one or more pulses of a metal containing compound and one or more pulses of a reductant. A soak process may be performed on the substrate surface before deposition of the metal nitride barrier layer and/or metal barrier layer.
摘要翻译：提供了通过原子层沉积处理衬底以沉积一层或多层材料层的阻挡层的方法。在一个方面，提供了一种处理衬底的方法，包括通过交替地引入含有金属的化合物的一种或多种脉冲和含氮化合物的一个或多个脉冲，在衬底表面的至少一部分上沉积金属氮化物阻挡层以及通过交替地引入一种或多种含金属化合物的脉冲和一种或多种还原剂的脉冲，在金属氮化物阻挡层的至少一部分上沉积金属阻挡层。可以在沉积金属氮化物阻挡层和/或金属阻挡层之前在衬底表面上进行浸泡工艺。

8. 发明授权

US07211508B2 Atomic layer deposition of tantalum based barrier materials 失效
标题翻译：钽基阻挡材料的原子层沉积
公开(公告)号：US07211508B2
公开(公告)日：2007-05-01
申请号：US10871864
申请日：2004-06-18
申请人： Hua Chung , Rongjun Wang , Nirmalya Maity
发明人： Hua Chung , Rongjun Wang , Nirmalya Maity
IPC分类号： H01L21/4763
CPC分类号： C23C16/45529 , C23C16/02 , C23C16/0281 , C23C16/14 , H01L21/28562 , H01L21/76843 , H01L21/76862 , H01L21/76871 , H01L21/76876
摘要： Methods for processing substrate to deposit barrier layers of one or more material layers by atomic layer deposition are provided. In one aspect, a method is provided for processing a substrate including depositing a metal nitride barrier layer on at least a portion of a substrate surface by alternately introducing one or more pulses of a metal containing compound and one or more pulses of a nitrogen containing compound and depositing a metal barrier layer on at least a portion of the metal nitride barrier layer by alternately introducing one or more pulses of a metal containing compound and one or more pulses of a reductant. A soak process may be performed on the substrate surface before deposition of the metal nitride barrier layer and/or metal barrier layer.
摘要翻译：提供了通过原子层沉积处理衬底以沉积一层或多层材料层的阻挡层的方法。在一个方面，提供了一种处理衬底的方法，包括通过交替地引入含有金属的化合物的一种或多种脉冲和含氮化合物的一个或多个脉冲，在衬底表面的至少一部分上沉积金属氮化物阻挡层以及通过交替地引入一种或多种含金属化合物的脉冲和一种或多种还原剂的脉冲，在金属氮化物阻挡层的至少一部分上沉积金属阻挡层。可以在沉积金属氮化物阻挡层和/或金属阻挡层之前在衬底表面上进行浸泡工艺。

9. 发明授权

US07595263B2 Atomic layer deposition of barrier materials 失效
标题翻译：阻隔材料的原子层沉积
公开(公告)号：US07595263B2
公开(公告)日：2009-09-29
申请号：US11691617
申请日：2007-03-27
申请人： Hua Chung , Rongjun Wang , Nirmalya Maity
发明人： Hua Chung , Rongjun Wang , Nirmalya Maity
IPC分类号： H01L21/4763
CPC分类号： C23C16/45529 , C23C16/02 , C23C16/0281 , C23C16/14 , H01L21/28562 , H01L21/76843 , H01L21/76862 , H01L21/76871 , H01L21/76876
摘要： Methods for processing substrate to deposit barrier layers of one or more material layers by atomic layer deposition are provided. In one aspect, a method is provided for processing a substrate including depositing a metal nitride barrier layer on at least a portion of a substrate surface by alternately introducing one or more pulses of a metal containing compound and one or more pulses of a nitrogen containing compound and depositing a metal barrier layer on at least a portion of the metal nitride barrier layer by alternately introducing one or more pulses of a metal containing compound and one or more pulses of a reductant. A soak process may be performed on the substrate surface before deposition of the metal nitride barrier layer and/or metal barrier layer.
摘要翻译：提供了通过原子层沉积处理衬底以沉积一层或多层材料层的阻挡层的方法。在一个方面，提供了一种处理衬底的方法，包括通过交替地引入含有金属的化合物的一种或多种脉冲和含氮化合物的一个或多个脉冲，在衬底表面的至少一部分上沉积金属氮化物阻挡层以及通过交替地引入一种或多种含金属化合物的脉冲和一种或多种还原剂的脉冲，在金属氮化物阻挡层的至少一部分上沉积金属阻挡层。可以在沉积金属氮化物阻挡层和/或金属阻挡层之前在衬底表面上进行浸泡工艺。

10. 发明申请

US20050106865A1 Integration of ALD tantalum nitride for copper metallization 有权
标题翻译： ALD氮化钽的集成用于铜金属化
公开(公告)号：US20050106865A1
公开(公告)日：2005-05-19
申请号：US10865042
申请日：2004-06-10
申请人： Hua Chung , Nirmalya Maity , Jick Yu , Roderick Mosely , Mei Chang
发明人： Hua Chung , Nirmalya Maity , Jick Yu , Roderick Mosely , Mei Chang
IPC分类号： H01L21/44
CPC分类号： H01L21/28562 , C23C16/34 , C23C16/4411 , C23C16/45504 , C23C16/45508 , C23C16/45512 , C23C16/45525 , C23C16/45544 , C23C16/45563 , C23C16/45582 , H01L21/02063 , H01L21/76805 , H01L21/76843 , H01L21/76844 , H01L21/76846 , H01L21/76862 , H01L21/76865 , H01L21/76871
摘要： A method and apparatus for depositing a tantalum nitride barrier layer is provided for use in an integrated processing tool. The tantalum nitride is deposited by atomic layer deposition. The tantalum nitride is removed from the bottom of features in dielectric layers to reveal the conductive material under the deposited tantalum nitride. Optionally, a tantalum layer may be deposited by physical vapor deposition after the tantalum nitride deposition. Optionally, the tantalum nitride deposition and the tantalum deposition may occur in the same processing chamber.
摘要翻译：提供了一种用于沉积氮化钽阻挡层的方法和装置，用于集成处理工具中。通过原子层沉积来沉积氮化钽。从电介质层中的特征的底部去除氮化钽以露出沉积的氮化钽之下的导电材料。任选地，可以在氮化钽沉积之后通过物理气相沉积来沉积钽层。可选地，氮化钽沉积和钽沉积可以发生在相同的处理室中。

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