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1. 发明申请

US20050012693A1 Damping and muffling structure for EL cell 审中-公开
标题翻译： EL电池的阻尼和消音结构
公开(公告)号：US20050012693A1
公开(公告)日：2005-01-20
申请号：US10621421
申请日：2003-07-18
申请人： Chih-Yuan Wang , Yen-Chia Lin , Heng-Yi Chang , Ya-Ling Hsu , Ya-Hui Huang
发明人： Chih-Yuan Wang , Yen-Chia Lin , Heng-Yi Chang , Ya-Ling Hsu , Ya-Hui Huang
IPC分类号： G09G3/30
CPC分类号： H05B33/22
摘要： Damping and muffling structure for EL cell includes a transparent substrate, a front electrode layer and a lighting layer. The front electrode layer and lighting layer are sequentially overlaid on the substrate. An inducing layer and at least one conductive layer are laid on the lighting layer. A back electrode layer is laid on the inducing layer. The conductive layer is laid on the lighting layer in such a position as not to affect light emitting of the lighting region. The conductive layer is also laid on at least one side between both the lighting layer and the inducing layer and connected with the back electrode layer to electrically connect the inducing layer with the back electrode layer. The back electrode layer is connected to a grounding electrode, whereby the conductive layer can quickly remove the charge accumulating on the inducing layer.
摘要翻译：用于EL电池的阻尼和消音结构包括透明基板，前电极层和照明层。前电极层和发光层顺序地覆盖在基板上。诱导层和至少一个导电层铺设在照明层上。背面电极层铺设在诱导层上。导电层在不影响照明区域的发光的位置上被放置在照明层上。导电层也被放置在发光层和感应层之间的至少一个侧面上，并与背面电极层连接，以将感应层与背面电极层电连接。背面电极层连接到接地电极，由此导电层可以快速去除累积在感应层上的电荷。

2. 发明申请

US20070241435A1 Optical display package and the method thereof 审中-公开
标题翻译：光学显示封装及其方法
公开(公告)号：US20070241435A1
公开(公告)日：2007-10-18
申请号：US11580124
申请日：2006-10-13
申请人： Chih-Yuan Wang , Heng-Yi Chang , Ya-Ling Hsu , Yi-Te Lee
发明人： Chih-Yuan Wang , Heng-Yi Chang , Ya-Ling Hsu , Yi-Te Lee
IPC分类号： H01L23/02
CPC分类号： H01L24/10 , G02F1/13452 , H01L24/13 , H01L24/81 , H01L33/62 , H01L2224/10135 , H01L2224/13 , H01L2224/13099 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13311 , H01L2224/13316 , H01L2224/13324 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13355 , H01L2224/16 , H01L2224/81139 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/81801 , H01L2224/81805 , H01L2224/83101 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： The present invention includes a substrate with a glass plate, a plurality of oxide wires on the glass plate and a plurality of flip chip bumps on the oxide wires and an integrated circuit chip with a plurality of bump pads. The substrate and the integrated circuit chip are hot pressed with a predetermined bonding pressure and temperature to bond the bump pads to the flip chip bumps respectively by eutectic bonding.
摘要翻译：本发明包括具有玻璃板的基板，玻璃板上的多个氧化物线和氧化物线上的多个倒装芯片凸块和具有多个凸点焊盘的集成电路芯片。基板和集成电路芯片以预定的接合压力和温度被热压以分别通过共晶接合将凸块焊接到倒装芯片凸块。

3. 发明申请

US20060154102A1 Soft thin laminated substrate 审中-公开
标题翻译：软薄层压基板
公开(公告)号：US20060154102A1
公开(公告)日：2006-07-13
申请号：US11031040
申请日：2005-01-10
申请人： Chih-Yuan Wang , Heng-Yi Chang , Hui-Yu Chang , Ya-Ling Hsu , Chin-Pei Hwang , Kevin Hsu
发明人： Chih-Yuan Wang , Heng-Yi Chang , Hui-Yu Chang , Ya-Ling Hsu , Chin-Pei Hwang , Kevin Hsu
IPC分类号： B21C37/00 , B21D39/00
CPC分类号： H05K3/388 , C23C14/025 , C23C14/20 , H05K1/0393 , Y10T428/12431 , Y10T428/12438 , Y10T428/12556
摘要： A soft thin laminated substrate including a plastic substrate, an alloy copper layer overlaid on the plastic substrate and a copper foil overlaid on the alloy copper layer. The alloy copper layer is an alloy of copper metal and at least one of nickel, chromium, manganese, molybdenum, iron and phosphorus. The alloy copper layer serves as a tie-coating of the copper foil, whereby the copper foil can tightly attach to the alloy copper layer to associate with the plastic substrate and form the soft thin laminated substrate.
摘要翻译：一种柔软的薄层压基板，包括塑料基板，覆盖在塑料基板上的合金铜层和覆盖在合金铜层上的铜箔。合金铜层是铜金属和镍，铬，锰，钼，铁和磷中的至少一种的合金。合金铜层用作铜箔的粘结层，由此铜箔可以紧密地附着在合金铜层上以与塑料基板相连，并形成柔软的薄层压基板。

4. 发明申请

US20070076389A1 Electronic device with conductive connection structure 审中-公开
标题翻译：具有导电连接结构的电子设备
公开(公告)号：US20070076389A1
公开(公告)日：2007-04-05
申请号：US11339697
申请日：2006-01-26
申请人： Chih-Yuan Wang , Heng-Yi Chang , Ya-Ling Hsu
发明人： Chih-Yuan Wang , Heng-Yi Chang , Ya-Ling Hsu
IPC分类号： H05K7/00
CPC分类号： H01L24/10 , H01L23/49816 , H01L24/13 , H01L24/28 , H01L24/83 , H01L24/90 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/13011 , H01L2224/13016 , H01L2224/13099 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/81903 , H01L2224/838 , H01L2224/83851 , H01L2224/90 , H01L2924/00014 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H05K3/323 , H05K3/326 , H05K3/4007 , H05K2201/0367 , H05K2201/0394 , H05K2201/10674 , H01L2924/3512 , H01L2924/00 , H01L2224/05599
摘要： The present invention provides an electronic device with a conductive connection structure, which has a substrate with conductive media thereon. The conductive media are electrically connected to conductive saliences respectively. These saliences are electrically connected to other electronic devices directly or indirectly. Each of the saliences has a space therein and at least a hollow portion communicated with the space. The spaces provide the saliences with a capacity of deformation. Glue can be filled in the spaces to reinforce the bonding strength.
摘要翻译：本发明提供一种具有导电连接结构的电子器件，其具有在其上具有导电介质的衬底。导电介质分别电连接到导电孔。这些细节直接或间接地与其他电子设备电连接。每个盐水在其中具有空间，并且至少与该空间连通的中空部分。这些空间为变形的容量提供了色彩。可以在空间填充胶水以增强粘结强度。

5. 发明授权

US06924595B2 Damping and muffling structure for EL cell 失效
标题翻译： EL电池的阻尼和消音结构
公开(公告)号：US06924595B2
公开(公告)日：2005-08-02
申请号：US10449060
申请日：2003-06-02
申请人： Chih-Yuan Wang , Heng Yi Chang
发明人： Chih-Yuan Wang , Heng Yi Chang
IPC分类号： H01J1/18 , H02K5/24 , H05B33/22 , H05B33/26
CPC分类号： H05B33/22
摘要： Damping and muffling structure for EL cell includes a transparent substrate, a front electrode layer, a lighting layer, an inducing layer and an insulating layer that are sequentially overlaid on the substrate. A back electrode layer and a conductive member are laid on the inducing layer. The conductive member is adjacent to the back electrode layer without contacting therewith. The conductive member is laid on both the inducing layer and the front electrode layer to electrically connect the inducing layer with the front electrode layer. The front electrode layer is connected to a grounding electrode of the driving circuit, whereby the conductive member can quickly remove the charge accumulating on the inducing layer so as to minify or even eliminate the vibration and noise of the EL cell.
摘要翻译： EL电池的阻尼和消音结构包括依次覆盖在基板上的透明基板，前电极层，照明层，感应层和绝缘层。背面电极层和导电构件被放置在诱导层上。导电构件与背电极层相邻，而不与其接触。将导电构件放置在感应层和前电极层两者上以将感应层与前电极层电连接。前电极层连接到驱动电路的接地电极，由此导电部件可以快速去除积累在感应层上的电荷，从而减少甚至消除EL电池的振动和噪声。

6. 发明申请

US20070108999A1 Thin film probe card 失效
标题翻译：薄膜探针卡
公开(公告)号：US20070108999A1
公开(公告)日：2007-05-17
申请号：US11595943
申请日：2006-11-13
申请人： Chih-Yuan Wang , Heng-Yi Chang
发明人： Chih-Yuan Wang , Heng-Yi Chang
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G09G3/006
摘要： A thin film probe card includes a plate and a plurality of wires on the plate, each of which is electrically connected with at least a thin film probe. A plurality of elastic members are provided between the probes, which absorbs the force of the probes in the test to protect the probes from wear and extend the product life of the probe card.
摘要翻译：薄膜探针卡包括板和板上的多根电线，每根电线与至少一个薄膜探针电连接。在探针之间设置有多个弹性构件，其在测试中吸收探针的力以保护探针免受磨损并延长探针卡的产品寿命。

7. 发明授权

US07573277B2 Thin film probe card 失效
标题翻译：薄膜探针卡
公开(公告)号：US07573277B2
公开(公告)日：2009-08-11
申请号：US11595943
申请日：2006-11-13
申请人： Chih-Yuan Wang , Heng-Yi Chang
发明人： Chih-Yuan Wang , Heng-Yi Chang
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G09G3/006
摘要： A thin film probe card includes a plate and a plurality of wires on the plate, each of which is electrically connected with at least a thin film probe. A plurality of elastic members are provided between the probes, which absorbs the force of the probes in the test to protect the probes from wear and extend the product life of the probe card.
摘要翻译：薄膜探针卡包括板和板上的多根电线，每根电线与至少一个薄膜探针电连接。在探针之间设置有多个弹性构件，其在测试中吸收探针的力以保护探针免受磨损并延长探针卡的产品寿命。

8. 发明申请

US20170309986A1 HEAT DISSIPATER WITH AN ANTENNA STRUCTURE 审中-公开
公开(公告)号：US20170309986A1
公开(公告)日：2017-10-26
申请号：US15133232
申请日：2016-04-20
申请人： Chih-Yuan Wang
发明人： Chih-Yuan Wang
IPC分类号： H01Q1/02 , H05K7/20 , H01Q9/04
CPC分类号： H01Q1/02 , H01Q1/243 , H01Q5/371 , H01Q5/378 , H01Q9/04 , H01Q9/42 , H05K7/2039
摘要： A heat dissipater with an antenna structure comprises a heat conductive portion capable of being contacted with a heat source of an electronic device for heat dissipation; and an antennal portion integrally formed to the heat conductive portion so as to form as an integral body; and the antenna portion comprises at least one sheet body. A conductive layer is coated on a surface of the sheet body; in that the conductive layer can be connected to a conductive wire for being lead to the portable electronic device for signal receiving and transmission. The heat conductive portion 10 has the function of heat dissipation and the antenna portion 20 has the function of wireless transmission which are made integrally with a compact space so that the space in an portable electronic device for receiving the heat conductive device is sufficient to receiving the whole structure.

9. 发明授权

US08852721B2 Method for cutting tempered glass and preparatory tempered glass structure 有权
标题翻译：切割钢化玻璃和预备钢化玻璃结构的方法
公开(公告)号：US08852721B2
公开(公告)日：2014-10-07
申请号：US13013415
申请日：2011-01-25
申请人： Jeng-Jye Hung , Yi-Te Lee , Hen-Ta Kang , Chih-Yuan Wang
发明人： Jeng-Jye Hung , Yi-Te Lee , Hen-Ta Kang , Chih-Yuan Wang
IPC分类号： B32B3/30 , C03C21/00 , B24B7/24 , C03B33/023
CPC分类号： C03B33/02 , B24B7/241 , B32B3/30 , C03B33/023 , C03C15/00 , C03C21/00 , C03C21/002 , Y02P40/57 , Y10T428/24479 , Y10T428/2457
摘要： A preparatory tempered glass structure for a cutting treatment includes a glass substrate and at least one trench. The glass substrate is given a strengthening treatment to form, from a surface to the inside of the glass substrate, at least one compression stress layer and a tensile stress layer corresponding to the compression stress layer. The trench is formed in the compression stress layer of the glass substrate and overlaps a predetermined cutting path for the cutting treatment.
摘要翻译：用于切割处理的预备强化玻璃结构包括玻璃基板和至少一个沟槽。对玻璃基板进行强化处理，从玻璃基板的表面到内部形成至少一个与压缩应力层相对应的压缩应力层和拉伸应力层。沟槽形成在玻璃基板的压缩应力层中，并与用于切割处理的预定切割路径重叠。

10. 发明申请

US20130206568A1 TOUCH PANEL 审中-公开
标题翻译：触控面板
公开(公告)号：US20130206568A1
公开(公告)日：2013-08-15
申请号：US13759040
申请日：2013-02-05
申请人： Yu-Hua Wu , Cheng-Yi Chou , Chih-Yuan Wang , Ting-Yu Chang , Ching-Fu Hsu , Hsiao-Hui Liao
发明人： Yu-Hua Wu , Cheng-Yi Chou , Chih-Yuan Wang , Ting-Yu Chang , Ching-Fu Hsu , Hsiao-Hui Liao
IPC分类号： H01H13/10
CPC分类号： H01H13/10 , G06F3/044
摘要： A touch panel including a first substrate, a second substrate, a first sensing layer, a second sensing layer, and a plurality of spacers is provided. The second substrate is parallel to and opposite to the first substrate in a top-bottom manner. The first sensing layer is disposed on the first substrate and located between the first substrate and the second substrate. The second sensing layer is disposed on the second substrate. The spacers are located between the first sensing layer and the second sensing layer, and the spacers includes a plurality of movable first spacers and a plurality of second spacers fixed on the second substrate, wherein each of the first spacers is surrounded by a portion of the second spacers.
摘要翻译：提供了包括第一基板，第二基板，第一感测层，第二感测层和多个间隔件的触摸面板。第二衬底以顶部底部的方式平行于第一衬底并与第一衬底相对。第一感测层设置在第一基板上并且位于第一基板和第二基板之间。第二感测层设置在第二基板上。间隔件位于第一感测层和第二感测层之间，并且间隔件包括多个可移动的第一间隔件和固定在第二基板上的多个第二间隔件，其中每个第一间隔件被一部分第二间隔物。

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