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1. 发明申请

US20230110427A1 ELECTRONIC DEVICE INCLUDING ANTENNA 有权
公开(公告)号：US20230110427A1
公开(公告)日：2023-04-13
申请号：US18080177
申请日：2022-12-13
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Woosup LEE , Jungsik PARK , Jungoh SUNG , Muyeol LEE , Sehwan CHOI , Sukgi HONG
IPC分类号： H01Q1/24 , H01Q1/02 , H01Q7/06 , H01Q9/04 , H01Q1/52 , H01Q25/00 , H05K9/00 , H05K7/20
摘要： An electronic device including an antenna according to various embodiments comprises: a printed circuit board disposed in a first area of the electronic device; a battery disposed in a second area of the electronic device; a heat dissipation member including a thermally conductive material disposed on the upper part of the printed circuit board and the battery; a first antenna disposed in the first area on the heat dissipation member; and a second antenna disposed in the second area on the heat dissipation member, wherein the frequency bands and the dielectric constants of the first antenna and the second antenna may be configured differently.

2. 发明申请

US20230048947A1 ANTENNA APPARATUS HAVING ANTENNA SPACER 有权
公开(公告)号：US20230048947A1
公开(公告)日：2023-02-16
申请号：US17974064
申请日：2022-10-26
申请人： Space Exploration Technologies Corp.
发明人： David Milroy , Duncan E. Adams , Ersin Yetisir
IPC分类号： H01Q1/42 , H01Q9/04 , H01Q1/02 , H01Q1/12 , H01Q1/22 , H01Q1/38 , H01Q23/00 , H01Q15/14 , H01Q21/06 , H01Q21/10 , H01Q21/00
摘要： In one embodiment of the present disclosure, an antenna assembly includes a patch antenna array including an upper patch antenna layer, a lower patch antenna layer, and a spacer therebetween, wherein the spacer includes a plurality of apertures defined by cell walls, wherein the each aperture aligns with an upper patch antenna element and a lower patent antenna element from the patch antenna array.

3. 发明授权

US11581662B2 Electronic device including antenna 有权
公开(公告)号：US11581662B2
公开(公告)日：2023-02-14
申请号：US16986793
申请日：2020-08-06
申请人： Samsung Electronics Co., Ltd.
发明人： Yonghyun Yoon , Mincheol Seo , Seho Kim , Minkyung Lee , Jongheon Lee , Sooyoung Jang , Hyuntae Jung , Kyunggu Kim , Jinwoo Jung
IPC分类号： H01Q21/28 , H01Q5/335 , H01Q1/02 , H01Q1/24
摘要： An electronic device includes a housing including a front plate and a rear plate disposed opposite the front plate, and a display disposed in a space between the front plate and the rear plate, and disposed at least partially along the front plate. The electronic device further includes a first antenna structure disposed in the space and configured to transmit or receive a first signal in a first frequency band, wherein the first antenna structure includes at least one first conductive pattern. The electronic device also includes a second antenna structure disposed in the space without being overlapped with the first conductive pattern when viewed from above the rear plate, and configured to transmit or receive a second signal in a second frequency band different from the first frequency band. In addition, the electronic device includes a conductive sheet disposed in the space and on the rear plate. The conductive sheet is physically separated from the first conductive pattern, and at least partially overlapped with the first conductive pattern when viewed from above the rear plate.

4. 发明授权

US11563274B2 PCB fed antennas integrated with metallic body 有权
公开(公告)号：US11563274B2
公开(公告)日：2023-01-24
申请号：US17083802
申请日：2020-10-29
申请人： Plume Design, Inc.
发明人： Miroslav Samardzija , Arthur Tung , Brian Nam , Liem Hieu Dinh Vo
IPC分类号： H01Q1/22 , H01Q9/16 , H01Q1/38 , H01Q1/02
摘要： An integrated metallic component includes a metallic body and an antenna. The metallic body is adapted to at least one of act as a heat exchanger and at least partially enclose electronic components on a Printed Circuit Board (PCB. The antenna includes an antenna element, a short wall, and an antenna feed leg. The antenna element is offset from the metallic body and includes a length extending along a perimeter of the metallic body. The short wall connects the antenna element to the metallic body. The antenna feed leg is offset from the short wall in a direction of the length of the antenna element and adapted to extend from the antenna element to the PCB and to form an electrical connection with an electrical contact for a Radio Frequency (RF) signal trace on the PCB.

5. 发明申请

US20220354018A1 COOLING APPARATUS FOR ELECTRONIC ELEMENT 有权
公开(公告)号：US20220354018A1
公开(公告)日：2022-11-03
申请号：US17864424
申请日：2022-07-14
申请人： KMW INC.
发明人： Duk Yong KIM , Jin Soo YEO , Kyu Chul CHOI , In Hwa CHOI , Youn Jun CHO , Jeong Hyun CHOI , Jae Hyun PARK
IPC分类号： H05K7/20 , H01Q1/02 , H01Q1/42
摘要： Provided is a cooling apparatus for an electronic element having improved heat dissipation performance while minimizing the size. To this end, the cooling apparatus for an electronic element according to the present invention includes a first chamber in a non-vacuum state, the first chamber being configured such that a printed circuit board equipped with a heat-generating element is disposed in the first chamber, a second chamber in a vacuum state, the second chamber being configured such that a spray unit configured to spray a refrigerant and a refrigerant supply unit configured to supply the refrigerant to the spray unit are disposed in the second chamber, and an evaporation unit disposed between the first chamber and the second chamber, in which the spray unit sprays the refrigerant, which is supplied by the refrigerant supply unit and condensed in the second chamber, into the second chamber, and in which the evaporation unit evaporates the refrigerant, which is sprayed into the second chamber by the spray unit, by using sensible heat transferred from the first chamber to the evaporation unit and latent heat transferred from the evaporation unit to the second chamber.

6. 发明授权

US11476557B1 Dual-polarization heat-dissipating antenna array element 有权
公开(公告)号：US11476557B1
公开(公告)日：2022-10-18
申请号：US17395673
申请日：2021-08-06
申请人： The United States of America, as represented by the Secretary of the Navy
发明人： Satish K. Sharma , Jia-Chi Samuel Chieh
IPC分类号： H01Q1/02 , H01Q21/06 , H01Q21/00 , H01Q13/08 , H01Q23/00 , H01Q25/00
摘要： An antenna element transfers a radiofrequency signal and dissipates heat. The antenna element includes a periphery and first and second pairs of fins. The periphery has a length and a width with the length approximately equaling the width. The first and second pairs of fins extend in height from inside the periphery. The first pair of fins are separated by a shared gap for transferring a first polarization of the radiofrequency signal, and the second pair of fins are separated by the shared gap for transferring a second polarization of the radiofrequency signal that is orthogonal to the first polarization. An antenna array includes multiple instances of the antenna element for transferring the radiofrequency signal and for dissipating the heat.

7. 发明申请

US20220322516A1 ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE 有权
公开(公告)号：US20220322516A1
公开(公告)日：2022-10-06
申请号：US17713438
申请日：2022-04-05
申请人： Samsung Electronics Co., Ltd.
发明人： Yongyoun KIM , Chanhee OH , Dongkee JUNG
IPC分类号： H05K1/02 , H01Q9/04 , H01Q5/25 , H01Q1/02
摘要： According to various embodiments of the disclosure, an electronic device may include a housing, a non-conductive supporting member disposed in the housing and including a first area, a second area spaced apart from the first area, and a third area connecting the first area and the second area, a conductive pattern portion disposed over the first area of the supporting member, a heat dissipation member disposed to at least partially overlap the conductive pattern portion, and an antenna including a circuit board, a conductive portion, and a ground portion. The conductive portion of the antenna may be disposed over the second area. The heat dissipation member may extend from the first area to the third area, and the ground portion of the antenna may extend from the second area to the third area to contact at least a portion of the heat dissipation member.

8. 发明授权

US11431089B2 Antenna housing 有权
公开(公告)号：US11431089B2
公开(公告)日：2022-08-30
申请号：US16459827
申请日：2019-07-02
申请人： CommScope Technologies LLC
发明人： Ruixin Su , Puliang Tang , Meihua Yin
IPC分类号： H01Q1/42 , H01Q1/02
摘要： The present disclosure relates to an antenna housing, comprising: a front housing having a front housing edge; and a back housing having a back housing edge, the front housing edge and the back housing edge engaging each other to assemble the front housing and the back housing together to form the antenna housing. The front housing edge and the back housing edge cooperate with each other to form a sealing interface, including: a first sealing member provided with a first sealing portion; and a second sealing member provided with a second sealing portion, the first sealing portion abutting against the second sealing portion when the front housing and the back housing are assembled so that a clearance fit is formed between the front housing edge and the back housing edge, wherein the second sealing member is further provided with a channel positioned inside the second sealing portion and extending parallel to the second sealing portion.

9. 发明授权

US11424551B2 Modular electronically scanned array (ESA) 有权
公开(公告)号：US11424551B2
公开(公告)日：2022-08-23
申请号：US16446339
申请日：2019-06-19
申请人： RAYTHEON COMPANY
发明人： Andrew Gamalski , Andrew K. Brown , Darren Himbaza , Kenneth W. Brown
IPC分类号： H01Q21/00 , H01Q1/02 , H01Q1/22 , H04B1/04 , H05K7/20
摘要： A modular communications array includes: an antenna card including a patch antenna array for communicating RF signals; a chip carrier card including a plurality of monolithic microwave integrated circuits (MMICs), each with a power amplifier (PA) and positioned on a respective metal post of a plurality of metal posts, wherein; a phase shifter card including a plurality of phase shifter circuits for beam steering and gain control and a plurality of cavities. Each of the cavities corresponds to a location for the respective metal post on the chip carrier card; and a cooling block coupled to the chip carrier card by a thermally conductive epoxy for cooling, where the phase shifter card is replaceable without affecting the components of the antenna card and the chip carrier card.

10. 发明授权

US11422228B2 Method for constructing vehicular radar sensor with copper PCB 有权
公开(公告)号：US11422228B2
公开(公告)日：2022-08-23
申请号：US16948472
申请日：2020-09-21
申请人： MAGNA ELECTRONICS INC.
发明人： Wilhelm Johann Wolfgang Woehlte
IPC分类号： G01S7/03 , G01S13/931 , H05K1/11 , H05K1/02 , G05D1/02 , H05K3/46 , H01Q1/32 , H01Q1/02 , H01Q21/00 , H04B1/04 , H05K1/09 , H04B1/16 , H01P3/12
摘要： A method for constructing a vehicular radar sensor includes providing antenna structure and a printed circuit board having a first layer and a second layer with a copper layer disposed between the first and second layers. The antenna structure includes transmitting antennas that are operable to transmit radio signals, and receiving antennas that receive radio signals transmitted by the transmitting antennas and reflected from an object. The first layer is joined to a first side of the copper layer and the second layer is joined to a second side of the copper layer, with the copper layer spanning between and contacting opposed surfaces of the first and second layers. At least one waveguide is established through the copper layer. Electronic circuitry is disposed at the first layer of the printed circuit board and at least part of the antenna structure is disposed at the second layer of the printed circuit board.

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