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1. 发明授权

US09508570B2 Singulation apparatus and method 有权
标题翻译：分割装置和方法
公开(公告)号：US09508570B2
公开(公告)日：2016-11-29
申请号：US14058396
申请日：2013-10-21
申请人： Chi Wah Cheng , Eric Lap Kei Chow , Joseph Hoi Shuen Tang , Chun Kit Liu
发明人： Chi Wah Cheng , Eric Lap Kei Chow , Joseph Hoi Shuen Tang , Chun Kit Liu
IPC分类号： H01L21/67 , B28D5/02 , H01L21/687
CPC分类号： H01L21/67092 , B28D5/024 , B28D5/029 , H01L21/68764
摘要： A singulation apparatus and method including: at least one chuck station to which a workpiece is securable, the at least one chuck station being configured to move along a feed direction; a bridge extending above the at least one chuck station, the bridge having a first side and a second side opposite the first side; a first cutting device with members mounted to the bridge and being independently movable along the first side, transversely to the feed direction; and a second cutting device with members mounted to the bridge and being independently movable along the second side, transversely to the feed direction, the first and second cutting devices being configured and arranged for cutting the workpiece.
摘要翻译：一种切割装置和方法，包括：至少一个卡盘站，工件可固定到该夹持站上，所述至少一个卡盘站构造成沿着进给方向移动; 在所述至少一个卡盘站上方延伸的桥，所述桥具有与所述第一侧相对的第一侧和第二侧; 第一切割装置，其具有安装到桥上并且可沿着第一侧横向于进给方向独立地移动的构件; 以及第二切割装置，其具有安装到所述桥接件并且可沿着所述第二侧面横向于所述进给方向独立地移动，所述第一和第二切割装置被构造和布置成用于切割所述工件。

2. 发明授权

US09263352B2 Singulation apparatus comprising an imaging device 有权
标题翻译：分割装置包括成像装置
公开(公告)号：US09263352B2
公开(公告)日：2016-02-16
申请号：US14146875
申请日：2014-01-03
申请人： Chi Wah Cheng , Hoi Shuen Tang , Chun Kit Liu
发明人： Chi Wah Cheng , Hoi Shuen Tang , Chun Kit Liu
IPC分类号： H01L21/00 , B26D5/20 , H01L21/66 , H01L21/67 , H01L21/78 , B26D5/00 , B26D5/06 , B26D1/18 , H01L21/68
CPC分类号： H01L22/20 , B26D1/18 , B26D5/007 , B26D5/06 , H01L21/67092 , H01L21/67259 , H01L21/681 , H01L21/78 , Y10T83/162
摘要： Disclosed is a singulation apparatus for cutting a workpiece. The singulation apparatus comprises: i) a processor; ii) at least one chuck device for securing the workpiece to be cut; iii) a cutting device spaced from the at least one chuck device by a separation distance, the cutting device being for cutting the workpiece secured to the at least one chuck device; and iv) an imaging device operable to capture one or more images comprising the cutting device and a reference feature. In particular, the processor is configured to determine a separation distance between the cutting device and the reference feature based on the one or more images as captured by the imaging device, to thereby determine the separation distance between the cutting device and the workpiece as secured to the at least one chuck device.
摘要翻译：公开了一种用于切割工件的切割装置。分割装置包括：i）处理器; ii）至少一个用于固定要切割的工件的卡盘装置; iii）与所述至少一个卡盘装置隔开间隔距离的切割装置，所述切割装置用于切割固定到所述至少一个卡盘装置的工件; 以及iv）可操作以捕获包括切割装置和参考特征的一个或多个图像的成像装置。特别地，处理器被配置为基于由成像装置捕获的一个或多个图像来确定切割装置与参考特征之间的间隔距离，从而确定切割装置与工件之间的分离距离，所述至少一个卡盘装置。

3. 发明授权

US08538576B2 Method of configuring a dicing device, and a dicing apparatus for dicing a workpiece 有权
标题翻译：配置切割装置的方法以及用于切割工件的切割装置
公开(公告)号：US08538576B2
公开(公告)日：2013-09-17
申请号：US13080009
申请日：2011-04-05
申请人： Chi Wah Cheng , Lap Kei Chow , Man Kin Leung , Hoi Shuen Tang
发明人： Chi Wah Cheng , Lap Kei Chow , Man Kin Leung , Hoi Shuen Tang
IPC分类号： G06F17/50
CPC分类号： B28D5/029
摘要： A method of configuring a dicing device 101, which dices along a cutting line of a workpiece 111 according to a dicing step, is disclosed. Numerical input of a dicing order of the dicing device 101 to dice a workpiece 111 is time-consuming and prone to errors. The disclosed method comprises the step of depicting a graphical user interface 202, which includes a layout 203 of the workpiece 111 that further includes a plurality of cut lines relating to respective cutting lines along the workpiece 111. The disclosed method further comprises the step of graphically contacting a cut line from the layout 203 through a user-interface device 201, to allow selection of the cut line before the selected cut line is assigned to the dicing step of the dicing device 101. By providing the plurality of cut lines in the layout 203 that are graphically contactable through the user-interface device 201, the method advantageously allows an easier process of configuring the dicing step of the dicing device 101. Also disclosed are a dicing apparatus for dicing a workpiece 111, as well as a computer-readable medium having a computer program for instructing a computer to perform the disclosed method.
摘要翻译：公开了一种根据切割步骤配置沿着工件111的切割线切割的切割装置101的方法。切割装置101切割工件111的切割顺序的数字输入是耗时的并且容易出错。所公开的方法包括描绘图形用户界面202的步骤，其包括工件111的布局203，其还包括与沿着工件111的相应切割线相关的多条切割线。所公开的方法还包括图形化的步骤通过用户界面装置201从布局203接触切割线，以允许在将所选择的切割线分配给切割装置101的切割步骤之前选择切割线。通过在布局中提供多条切割线 203通过用户界面装置201图形地可接触，该方法有利地允许配置切割装置101的切割步骤的更简单的过程。还公开了一种用于将工件111切割的切割装置以及计算机可读介质具有用于指示计算机执行所公开的方法的计算机程序。

4. 发明授权

US08702017B2 Nozzle device employing high frequency wave energy 有权
标题翻译：采用高频波能的喷嘴装置
公开(公告)号：US08702017B2
公开(公告)日：2014-04-22
申请号：US12335675
申请日：2008-12-16
申请人： Lap Kei Eric Chow , Hoi Shuen Tang , Hon Keung Lai , Chi Wah Cheng
发明人： Lap Kei Eric Chow , Hoi Shuen Tang , Hon Keung Lai , Chi Wah Cheng
IPC分类号： B05B1/08
CPC分类号： F04F7/00
摘要： A nozzle device comprising a nozzle chamber includes a fluid inlet located at a first side of the nozzle chamber which is operative to introduce fluid into the nozzle chamber in an injection direction and a fluid outlet at a second side of the nozzle chamber which is operative to expel fluid from the nozzle chamber. A high frequency wave generator is also located in the nozzle chamber which is oriented and operative to generate high frequency waves in a direction which is substantially parallel to the injection direction, whereby to impart high frequency energy to the fluid in the nozzle chamber.
摘要翻译：包括喷嘴室的喷嘴装置包括位于喷嘴室的第一侧处的流体入口，该流体入口可操作以沿喷射方向将流体引入喷嘴室，并且在喷嘴室的第二侧具有流体出口，从喷嘴室排出流体。高频波发生器也位于喷嘴室中，其定向和操作以在基本上平行于喷射方向的方向上产生高频波，从而向喷嘴室中的流体施加高频能量。

5. 发明授权

US08978673B2 Megasonic cleaning system 有权
标题翻译：超声波清洗系统
公开(公告)号：US08978673B2
公开(公告)日：2015-03-17
申请号：US11836458
申请日：2007-08-09
申请人： Chi Wah Cheng , Wang Lung Alan Tse , Leung Por Boris Chan
发明人： Chi Wah Cheng , Wang Lung Alan Tse , Leung Por Boris Chan
IPC分类号： B08B3/12 , B08B3/02 , H01L21/67
CPC分类号： B08B3/12 , B08B3/02 , B08B2203/0288 , H01L21/67051
摘要： A system for cleaning semiconductor packages is provided which includes a pickhead that is configured to hold the semiconductor packages in an array arrangement and a plurality of nozzles, each of which is constructed and arranged to project a separate jet of cleaning fluid upwardly against the semiconductor packages. A megasonic energy generator is coupled for imparting megasonic energy to the cleaning fluid and a driving device drives relative movement between the plurality of nozzles and the pickhead to direct the said jets to clean the array of packages on the pickhead.
摘要翻译：提供了一种用于清洁半导体封装的系统，其包括构造成将阵列布置中的半导体封装保持的拾取头和多个喷嘴，每个喷嘴构造和布置成将单独的清洁流体射流向上突出抵靠半导体封装。兆声波能量发生器被耦合以将兆声波能量传递给清洁流体，并且驱动装置驱动多个喷嘴和拾取头之间的相对运动，以引导所述射流清洁拾取头上的包装阵列。

6. 发明授权

US08657181B2 Wedge bonder and a method of cleaning a wedge bonder 有权
标题翻译：楔形粘结机和清洁楔形粘合剂的方法
公开(公告)号：US08657181B2
公开(公告)日：2014-02-25
申请号：US13532966
申请日：2012-06-26
申请人： Chi Wah Cheng , Man Kit Mui
发明人： Chi Wah Cheng , Man Kit Mui
IPC分类号： B23K31/02 , H01L21/60
CPC分类号： H01L24/78 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/45124 , H01L2224/4847 , H01L2224/7801 , H01L2224/78313 , H01L2224/7855 , H01L2224/78753 , H01L2224/78901 , H01L2224/85122 , H01L2224/85205 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a wedge bonder, comprising a wedge for bonding a wire to surfaces to form an electrical interconnection therebetween, a cleaning device for cleaning the wedge, and a positioning device to which the wedge is mounted. In particular, the positioning device is operative to move the wedge to the cleaning device for cleaning. A method of cleaning a wedge of a wedge bonder is also disclosed.
摘要翻译：公开了一种楔形接合器，包括用于将线接合到表面以形成其间的电互连的楔子，用于清洁楔的清洁装置，以及安装楔的定位装置。特别地，定位装置可操作以将楔移动到清洁装置以进行清洁。还公开了一种清洁楔形接合器楔形物的方法。

7. 发明授权

US08434669B1 Universal bond head for wire bonders 有权
标题翻译：用于焊线机的通用焊头
公开(公告)号：US08434669B1
公开(公告)日：2013-05-07
申请号：US13344172
申请日：2012-01-05
申请人： Chi Wah Cheng , Man Kit Mui
发明人： Chi Wah Cheng , Man Kit Mui
IPC分类号： B23K31/02
CPC分类号： B23K20/004 , B23K20/10 , H01L24/45 , H01L24/78 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/48456 , H01L2224/78 , H01L2924/00015
摘要： A wedge wire bonder comprises a wedge that is operative to oscillate along a transducer axis for bonding a wire onto a surface and a wire clamp comprising a pair of parallel clamping plates for clamping the wire. The clamping plates having clamping surfaces that are oriented substantially perpendicularly to the transducer axis. Lateral guides are arranged on opposite sides of the wire, such that the lateral guides and the wire are generally aligned parallel to the clamping surfaces of the clamping plates for guiding the wire towards the wedge.
摘要翻译：楔形线接合器包括楔形件，其可操作以沿着换能器轴线振动以将线材接合到表面上，并且线夹具包括用于夹紧线材的一对平行夹紧板。夹紧板具有基本上垂直于换能器轴线定向的夹紧表面。横向引导件布置在线的相对侧上，使得侧向引导件和线通常对准平行于夹紧板的夹紧表面，以将导线引向楔形件。

8. 发明授权

US08251422B2 Apparatus for transferring electronic components in stages 有权
标题翻译：用于分阶段转移电子元件的装置
公开(公告)号：US08251422B2
公开(公告)日：2012-08-28
申请号：US12748777
申请日：2010-03-29
申请人： Chi Wah Cheng , Wang Lung Tse , Leung Por Chan
发明人： Chi Wah Cheng , Wang Lung Tse , Leung Por Chan
IPC分类号： H01L21/673 , H01L21/677
CPC分类号： H01L21/6838 , H01L21/67333
摘要： A transfer assembly for transferring first and second groups of electronic components simultaneously comprises a holding plate containing first and second sets of suction holes. The respective first and second sets of suction holes are operative to hold the first and second groups of electronic components respectively against the holding plate during transfer of the electronic components. A first vacuum chamber located next to the holding plate is connected only to the first set of suction holes. A vacuum compartment located within the first vacuum chamber encloses a second vacuum chamber. The vacuum compartment includes a sealing sheet in contact with the holding plate which has vacuum holes connecting the second vacuum chamber to the second set of suction holes. First and second vacuum sources are provided for applying vacuum suction forces separately in the first and second vacuum chambers.
摘要翻译：用于同时传送第一组和第二组电子部件的传送组件包括容纳第一组和第二组抽吸孔的保持板。相应的第一组和第二组抽吸孔可操作以在传送电子部件期间将第一组和第二组电子部件分别抵靠在保持板上。位于保持板附近的第一真空室仅与第一组吸入孔连接。位于第一真空室内的真空室包围第二真空室。真空室包括与保持板接触的密封片，该密封片具有将第二真空室连接到第二组吸入孔的真空孔。提供第一和第二真空源以在第一和第二真空室中分别施加真空吸力。

9. 发明授权

US08167524B2 Handling system for inspecting and sorting electronic components 有权
标题翻译：电子元件检查和分类处理系统
公开(公告)号：US08167524B2
公开(公告)日：2012-05-01
申请号：US11941372
申请日：2007-11-16
申请人： Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Lap Kei Eric Chow
发明人： Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Lap Kei Eric Chow
IPC分类号： B65H9/08
CPC分类号： H01L21/67271
摘要： A semiconductor package handling system is provided comprising a package holder for receiving and holding singulated semiconductor packages, and a first inspection device which is arranged and configured to inspect a first surface of the packages while they are being held by the package holder. An offloading device receives the packages from the package holder and conveys them packages to an offloader, and a second inspection device is arranged and configured to inspect a second surface of the packages which is opposite from the first surface while they are being held by the offloading device.
摘要翻译：提供一种半导体封装处理系统，包括用于接收和保持单个半导体封装的封装保持器，以及第一检查装置，其布置和构造成在包装夹持器被保持时检查包装的第一表面。卸载装置从包装夹持器接收包装并将包装输送到卸载器，并且第二检查装置被布置和配置成在通过卸载保持的状态下检查与第一表面相对的包装的第二表面设备。

10. 发明申请

US20080164646A1 WORKHOLDER FOR SUPPORTING ELECTRONIC DEVICES 审中-公开
标题翻译：支持电子设备的工作人员
公开(公告)号：US20080164646A1
公开(公告)日：2008-07-10
申请号：US11621531
申请日：2007-01-09
申请人： Chi Wah Cheng , Wang Lung Alan Tse
发明人： Chi Wah Cheng , Wang Lung Alan Tse
IPC分类号： B23Q3/02
CPC分类号： B23Q3/088 , B25B11/005 , B28D5/0094
摘要： A workholder, in particular a saw jig, is provided for mounting a substrate containing a plurality of electronic devices. The saw jig has a base platform having a plurality of pockets laid out in the same arrangement as the electronic devices are arranged on the substrate and a plurality of resilient collets are detachably inserted into the pockets, each collet being sized and configured to hold one electronic device by vacuum suction.
摘要翻译：为了安装包含多个电子设备的基板，提供了一个夹持器，特别是锯夹具。锯夹具具有基座平台，其具有以与电子设备布置在基底上相同的布置布置的多个口袋，并且多个弹性夹头可拆卸地插入到口袋中，每个夹头的尺寸和构造被容纳在一个电子设备通过真空抽吸。

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