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1. 发明授权

US08538576B2 Method of configuring a dicing device, and a dicing apparatus for dicing a workpiece 有权
标题翻译：配置切割装置的方法以及用于切割工件的切割装置
公开(公告)号：US08538576B2
公开(公告)日：2013-09-17
申请号：US13080009
申请日：2011-04-05
申请人： Chi Wah Cheng , Lap Kei Chow , Man Kin Leung , Hoi Shuen Tang
发明人： Chi Wah Cheng , Lap Kei Chow , Man Kin Leung , Hoi Shuen Tang
IPC分类号： G06F17/50
CPC分类号： B28D5/029
摘要： A method of configuring a dicing device 101, which dices along a cutting line of a workpiece 111 according to a dicing step, is disclosed. Numerical input of a dicing order of the dicing device 101 to dice a workpiece 111 is time-consuming and prone to errors. The disclosed method comprises the step of depicting a graphical user interface 202, which includes a layout 203 of the workpiece 111 that further includes a plurality of cut lines relating to respective cutting lines along the workpiece 111. The disclosed method further comprises the step of graphically contacting a cut line from the layout 203 through a user-interface device 201, to allow selection of the cut line before the selected cut line is assigned to the dicing step of the dicing device 101. By providing the plurality of cut lines in the layout 203 that are graphically contactable through the user-interface device 201, the method advantageously allows an easier process of configuring the dicing step of the dicing device 101. Also disclosed are a dicing apparatus for dicing a workpiece 111, as well as a computer-readable medium having a computer program for instructing a computer to perform the disclosed method.
摘要翻译：公开了一种根据切割步骤配置沿着工件111的切割线切割的切割装置101的方法。切割装置101切割工件111的切割顺序的数字输入是耗时的并且容易出错。所公开的方法包括描绘图形用户界面202的步骤，其包括工件111的布局203，其还包括与沿着工件111的相应切割线相关的多条切割线。所公开的方法还包括图形化的步骤通过用户界面装置201从布局203接触切割线，以允许在将所选择的切割线分配给切割装置101的切割步骤之前选择切割线。通过在布局中提供多条切割线 203通过用户界面装置201图形地可接触，该方法有利地允许配置切割装置101的切割步骤的更简单的过程。还公开了一种用于将工件111切割的切割装置以及计算机可读介质具有用于指示计算机执行所公开的方法的计算机程序。

2. 发明授权

US08709916B2 Laser processing method and apparatus 有权
标题翻译：激光加工方法及装置
公开(公告)号：US08709916B2
公开(公告)日：2014-04-29
申请号：US13541865
申请日：2012-07-05
申请人： Chi Hang Kwok , Chi Wah Cheng , Lap Kei Chow
发明人： Chi Hang Kwok , Chi Wah Cheng , Lap Kei Chow
IPC分类号： H01L21/304 , H01L21/268
CPC分类号： B23K26/0853 , B23K26/40 , B23K26/53 , B23K2103/50
摘要： A laser processing method is disclosed, comprising the steps of: directing a laser beam to a workpiece; and effecting a relative motion between the laser beam and the workpiece. In particular, the step of directing the laser beam to the workpiece comprises focusing the laser beam within the workpiece until an internal damage forms within the workpiece and a crack propagates from the internal damage to at least one surface of the workpiece to form a surface crack on the workpiece. Further, the step of effecting the relative motion between the laser beam and the workpiece is such that the surface crack on the workpiece propagates along a line of separation on the workpiece. A laser processing apparatus is also disclosed.
摘要翻译：公开了一种激光加工方法，包括以下步骤：将激光束导向工件; 并且实现激光束和工件之间的相对运动。特别地，将激光束引导到工件的步骤包括将激光束聚焦在工件内直到在工件内形成内部损伤，并且裂纹从内部损伤传播到工件的至少一个表面以形成表面裂纹在工件上。此外，实现激光束和工件之间的相对运动的步骤使得工件上的表面裂纹沿着工件上的分离线传播。还公开了一种激光加工装置。

3. 发明授权

US08354612B2 Laser processing apparatus 有权
标题翻译：激光加工设备
公开(公告)号：US08354612B2
公开(公告)日：2013-01-15
申请号：US12748578
申请日：2010-03-29
申请人： Chi Wah Cheng , Lap Kei Chow , Zhuanyun Zhang , Sze Leong Lai
发明人： Chi Wah Cheng , Lap Kei Chow , Zhuanyun Zhang , Sze Leong Lai
IPC分类号： B23K26/00
CPC分类号： B23K26/0673 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , B23K2103/52 , H01L21/67092
摘要： A laser processing apparatus for cutting substrates comprises a laser head for generating a laser beam and first and second work holders on which substrates are mountable. A diverter positioned along a path of the laser beam is operative to selectively direct the laser beam towards a first substrate mounted on the first work holder to cut the first substrate, or towards a second substrate mounted on the second work holder to cut the second substrate, so that contemporaneous operations may be conducted on one substrate while the other substrate is being cut.
摘要翻译：用于切割基板的激光加工设备包括用于产生激光束的激光头和可安装基板的第一和第二工件保持器。沿着激光束的路径定位的分流器可操作以选择性地将激光束引向安装在第一工件保持器上的第一基板，以切割第一基板，或朝向安装在第二工件保持器上的第二基板切割第二基板从而可以在一个基板上同时进行操作，而另一个基板被切割。

4. 发明授权

US09016675B2 Apparatus and method for supporting a workpiece during processing 有权
标题翻译：在加工过程中支撑工件的装置和方法
公开(公告)号：US09016675B2
公开(公告)日：2015-04-28
申请号：US13542785
申请日：2012-07-06
申请人： Chi Wah Cheng , Lap Kei Chow , Chi Hang Leung
发明人： Chi Wah Cheng , Lap Kei Chow , Chi Hang Leung
IPC分类号： B25B11/00 , C23C16/00 , C23F1/00 , B24B7/00 , B24B9/00 , B28D5/00 , H01L21/67 , H01L21/687 , H01L21/683
CPC分类号： B28D5/0094 , H01L21/67126 , H01L21/6838 , H01L21/68792 , Y10T29/49998
摘要： An apparatus for supporting a workpiece during processing of the workpiece is disclosed. The apparatus comprises: a chassis having a vacuum chamber that is connectable to a vacuum source; a supporting device rotatable relative to the chassis, the supporting device having a hollow compartment and a supporting surface for holding the workpiece; and at least one sealing device arranged between the chassis and the supporting device, to provide an air-tight seal between the chassis and the supporting device while allowing for rotation of the supporting device with respect to the chassis, so as to form a vacuum passage extending from the supporting surface of the supporting device through the hollow compartment of the supporting device and the vacuum chamber of the chassis to the vacuum source, to thereby hold the workpiece to the supporting surface of the supporting device during processing of the workpiece.
摘要翻译：公开了一种用于在加工工件期间支撑工件的装置。该装置包括：具有可连接到真空源的真空室的底架; 支撑装置可相对于底盘旋转，支撑装置具有中空隔室和用于保持工件的支撑表面; 以及布置在底盘和支撑装置之间的至少一个密封装置，以在底架和支撑装置之间提供气密密封，同时允许支撑装置相对于底盘旋转，以便形成真空通道从支撑装置的支撑表面延伸穿过支撑装置的中空隔室和底盘的真空室到真空源，从而在工件加工期间将工件保持在支撑装置的支撑表面上。

5. 发明授权

US08289388B2 Alignment method for singulation system 有权
标题翻译：分割系统对齐方法
公开(公告)号：US08289388B2
公开(公告)日：2012-10-16
申请号：US12465766
申请日：2009-05-14
申请人： Chi Wah Cheng , Lap Kei Chow
发明人： Chi Wah Cheng , Lap Kei Chow
IPC分类号： H04N7/18
CPC分类号： H01L21/681 , H01L21/67092
摘要： A method for determining virtual cutting lines for a substrate prior to its singulation is provided whereby the substrate comprises first and second rows of alignment marks which are substantially parallel to each other such that a pair of alignment marks each from the first and second rows of alignment marks is configured for determining a position of a virtual cutting line. The method comprises the steps of positioning the first row of alignment marks along a relative motion path of a first camera and positioning the second row of alignment marks along a relative motion path of a second camera. While the substrate is being moved relative to the first and second cameras along the respective relative motion paths without stopping, the first and second cameras capture images of multiple pairs of alignment marks from the first and second rows of alignment marks during such motion. Thereafter, the position of each virtual cutting line is determined from the images of each pair of alignment marks along the first and second rows of alignment marks relating to the virtual cutting line and stored in a storage device for use during singulation.
摘要翻译：提供了一种用于在其单独化之前确定用于衬底的虚拟切割线的方法，由此所述衬底包括基本上彼此平行的第一和第二排对准标记，使得一对对准标记各自来自第一和第二排对准标记被配置用于确定虚拟切割线的位置。该方法包括以下步骤：沿着第一相机的相对运动路径定位第一排对准标记，并沿着第二相机的相对运动路径定位第二排对准标记。当基板相对于第一和第二相机相对于相应的相对运动路径移动而不停止时，第一和第二相机在这种运动期间从第一和第二排对准标记捕获多对对准标记的图像。此后，根据与虚拟切割线相关的第一和第二排对准标记的每对对准标记的图像确定每个虚拟切割线的位置，并存储在用于分割的存储装置中。

6. 发明授权

US06783316B2 Apparatus and method for testing semiconductor devices 有权
标题翻译：用于半导体器件测试的装置和方法
公开(公告)号：US06783316B2
公开(公告)日：2004-08-31
申请号：US09888571
申请日：2001-06-26
申请人： Ching Man Tsui , Lap Kei Chow , Hui Fai Ho , Cam Nguyin Ngo
发明人： Ching Man Tsui , Lap Kei Chow , Hui Fai Ho , Cam Nguyin Ngo
IPC分类号： B23Q104
CPC分类号： G01R1/04 , G01R31/2886
摘要： The present invention provides apparatus for supporting during a testing operation a leadframe formed with at least one row of non-singulated semiconductor devices. The apparatus comprises a main body and a leadframe support member, and the leadframe support member is formed with at least one groove for receiving semiconductor devices such that in use leads extending from said devices lie on a surface of said support member. The invention also relates to a system for transporting devices to and from a test probe head.
摘要翻译：本发明提供了一种用于在测试操作期间支撑由至少一行非单片半导体器件形成的引线框的装置。所述装置包括主体和引线框架支撑构件，并且所述引线框架支撑构件形成有用于接收半导体器件的至少一个凹槽，使得在使用中从所述装置延伸的引线位于所述支撑构件的表面上。本发明还涉及一种用于将设备传送到测试探针头和从测试探针头传送设备的系统。

7. 发明授权

US07486092B2 Apparatus for supporting semiconductor devices during testing 有权
标题翻译：用于在测试期间支持半导体器件的装置
公开(公告)号：US07486092B2
公开(公告)日：2009-02-03
申请号：US10829431
申请日：2004-04-22
申请人： Ching Man Tsui , Lap Kei Chow , Hui Fai Ho , Cam Nguyen Ronald Ngo
发明人： Ching Man Tsui , Lap Kei Chow , Hui Fai Ho , Cam Nguyen Ronald Ngo
IPC分类号： G01R31/02
CPC分类号： G01R1/04 , G01R31/2886
摘要： An apparatus supports, during a testing operation, a leadframe formed with at least one row of non-singulated semiconductor devices. The apparatus includes a main body and a leadframe support member, and the leadframe support is formed with at least one groove for receiving semiconductor devices such that in use leads extending from the semiconductor devices lie on a surface of the support member.
摘要翻译：在测试操作期间，设备支撑形成有至少一行非单片半导体器件的引线框架。该装置包括主体和引线框架支撑构件，并且引线框架支撑件形成有用于接收半导体器件的至少一个凹槽，使得在使用中从半导体器件延伸的引线位于支撑构件的表面上。

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