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1. 发明申请

US20070164386A1 Semiconductor device and fabrication method thereof 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20070164386A1
公开(公告)日：2007-07-19
申请号：US11648045
申请日：2006-12-28
申请人： Cheng-Yi Chang , Chien-Ping Huang , Yu-Po Wang , Chih-Ming Huang , Cheng-Hsu Hsiao
发明人： Cheng-Yi Chang , Chien-Ping Huang , Yu-Po Wang , Chih-Ming Huang , Cheng-Hsu Hsiao
IPC分类号： H01L31/0203 , H01L21/56
CPC分类号： H01L27/14687 , H01L24/97 , H01L27/14618 , H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2224/97 , H01L2924/01033 , H01L2924/15311 , H01L2924/16195 , H01L2224/85 , H01L2924/00014
摘要： A semiconductor device and the fabrication method thereof are provided. The fabrication method includes providing a substrate module plate having a plurality of substrates; attaching at least one sensor chip to each of the substrates of the substrate module plate; electrically connecting each of the sensor chips to each of the substrates through bonding wires; forming an insulating layer between each sensor chip on the substrate module plate, wherein the height of the insulating layers are not greater than the thickness of the sensor chips so as to prevent flash from the insulating layers from contaminating the sensor chips; forming an adhesive lip on the insulating layer or forming a second insulating layer followed by forming the adhesive layer, wherein the adhesive layer or the second insulating layer is higher than the highest loop-height of the bonding wires; adhering a light transmitting cover to each adhesive layer to cover the sensor chip; and cutting the substrate module plate to separate the substrates to form a plurality of semiconductor devices each integrated with at least one sensor chip. As the adhesive layers are not in contact with the bonding wires, the problems of damaging or breaking the bonding wires can be prevented in the process of adhering the light transmitting cover.
摘要翻译：提供半导体器件及其制造方法。该制造方法包括提供具有多个基板的基板模块板; 将至少一个传感器芯片附接到所述基板模块板的每个基板; 通过接合线将每个传感器芯片电连接到每个基板; 在衬底模块板上的每个传感器芯片之间形成绝缘层，其中绝缘层的高度不大于传感器芯片的厚度，以防止来自绝缘层的闪光污染传感器芯片; 在所述绝缘层上形成粘合剂唇缘或形成第二绝缘层，接着形成所述粘合剂层，其中所述粘合剂层或所述第二绝缘层高于所述接合线的最高环高度; 将透光盖粘附到每个粘合剂层以覆盖传感器芯片; 以及切割所述基板模块板以分离所述基板以形成多个半导体器件，每个半导体器件与至少一个传感器芯片集成。由于粘合层不与接合线接触，所以在粘接透光罩的过程中可以防止损坏或断裂接合线的问题。

2. 发明授权

US08183092B2 Method of fabricating stacked semiconductor structure 有权
标题翻译：叠层半导体结构的制造方法
公开(公告)号：US08183092B2
公开(公告)日：2012-05-22
申请号：US12829704
申请日：2010-07-02
申请人： Chien-Ping Huang , Chih-Ming Huang , Han-Ping Pu , Yu-Po Wang , Cheng-Hsu Hsiao
发明人： Chien-Ping Huang , Chih-Ming Huang , Han-Ping Pu , Yu-Po Wang , Cheng-Hsu Hsiao
IPC分类号： H01L21/00 , H01L21/46
CPC分类号： H01L23/3128 , H01L21/561 , H01L21/565 , H01L23/16 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/49175 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06572 , H01L2225/06586 , H01L2924/00014 , H01L2924/01033 , H01L2924/15174 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stacked semiconductor structure and fabrication method thereof are provided. The method includes mounting and connecting electrically a semiconductor chip to a first substrate, mounting on the first substrate a plurality of supporting members corresponding in position to a periphery of the semiconductor chip, mounting a second substrate having a first surface partially covered with a tape and a second surface opposite to the first surface on the supporting members via the second surface, connecting electrically the first and second substrates by bonding wires, forming on the first substrate an encapsulant for encapsulating the semiconductor chip, the supporting members, the second substrate, the bonding wires, and the tape with an exposed top surface, and removing the tape to expose the first surface of the second substrate and allow an electronic component to be mounted thereon. The present invention prevents reflow-induced contamination, spares a special mold, and eliminates flash.
摘要翻译：提供了堆叠半导体结构及其制造方法。该方法包括将半导体芯片电连接到第一基板上，在第一基板上安装多个对应于半导体芯片的周边的支撑部件，安装第二基板，该第二基板具有部分被带覆盖的第一表面，经由第二表面与支撑构件上的第一表面相对的第二表面，通过接合线电连接第一和第二基板，在第一基板上形成用于封装半导体芯片的密封剂，支撑构件，第二基板，接合线和具有暴露的顶表面的带，并且移除带以露出第二基板的第一表面并允许电子部件安装在其上。本发明防止回流引起的污染，备有特殊的模具，并消除闪光。

3. 发明申请

US20100267202A1 METHOD OF FABRICATING STACKED SEMICONDUCTOR STRUCTURE 有权
标题翻译：制作堆叠半导体结构的方法
公开(公告)号：US20100267202A1
公开(公告)日：2010-10-21
申请号：US12829704
申请日：2010-07-02
申请人： Chien-Ping Huang , Chih-Ming Huang , Han-Ping Pu , Yu-Po Wang , Cheng-Hsu Hsiao
发明人： Chien-Ping Huang , Chih-Ming Huang , Han-Ping Pu , Yu-Po Wang , Cheng-Hsu Hsiao
IPC分类号： H01L21/50
CPC分类号： H01L23/3128 , H01L21/561 , H01L21/565 , H01L23/16 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/49175 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06572 , H01L2225/06586 , H01L2924/00014 , H01L2924/01033 , H01L2924/15174 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stacked semiconductor structure and fabrication method thereof are provided. The method includes mounting and connecting electrically a semiconductor chip to a first substrate, mounting on the first substrate a plurality of supporting members corresponding in position to a periphery of the semiconductor chip, mounting a second substrate having a first surface partially covered with a tape and a second surface opposite to the first surface on the supporting members via the second surface, connecting electrically the first and second substrates by bonding wires, forming on the first substrate an encapsulant for encapsulating the semiconductor chip, the supporting members, the second substrate, the bonding wires, and the tape with an exposed top surface, and removing the tape to expose the first surface of the second substrate and allow an electronic component to be mounted thereon. The present invention prevents reflow-induced contamination, spares a special mold, and eliminates flash.
摘要翻译：提供了堆叠半导体结构及其制造方法。该方法包括将半导体芯片电连接到第一基板上，在第一基板上安装多个对应于半导体芯片的周边的支撑部件，安装第二基板，该第二基板具有部分被带覆盖的第一表面，经由第二表面与支撑构件上的第一表面相对的第二表面，通过接合线电连接第一和第二基板，在第一基板上形成用于封装半导体芯片的密封剂，支撑构件，第二基板，接合线和具有暴露的顶表面的带，并且移除带以露出第二基板的第一表面并允许电子部件安装在其上。本发明防止回流引起的污染，备有特殊的模具，并消除闪光。

4. 发明授权

US07772685B2 Stacked semiconductor structure and fabrication method thereof 有权
标题翻译：叠层半导体结构及其制造方法
公开(公告)号：US07772685B2
公开(公告)日：2010-08-10
申请号：US11591974
申请日：2006-11-01
申请人： Chien-Ping Huang , Chih-Ming Huang , Han-Ping Pu , Yu-Po Wang , Cheng-Hsu Hsiao
发明人： Chien-Ping Huang , Chih-Ming Huang , Han-Ping Pu , Yu-Po Wang , Cheng-Hsu Hsiao
IPC分类号： H01L23/02
CPC分类号： H01L23/3128 , H01L21/561 , H01L21/565 , H01L23/16 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/49175 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06572 , H01L2225/06586 , H01L2924/00014 , H01L2924/01033 , H01L2924/15174 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stacked semiconductor structure and fabrication method thereof are provided. The method includes mounting and connecting electrically a semiconductor chip to a first substrate, mounting on the first substrate a plurality of supporting members corresponding in position to a periphery of the semiconductor chip, mounting a second substrate having a first surface partially covered with a tape and a second surface opposite to the first surface on the supporting members via the second surface, connecting electrically the first and second substrates by bonding wires, forming on the first substrate an encapsulant for encapsulating the semiconductor chip, the supporting members, the second substrate, the bonding wires, and the tape with an exposed top surface, and removing the tape to expose the first surface of the second substrate and allow an electronic component to be mounted thereon. The present invention prevents reflow-induced contamination, spares a special mold, and eliminates flash.
摘要翻译：提供了堆叠半导体结构及其制造方法。该方法包括将半导体芯片电连接到第一基板上，在第一基板上安装多个对应于半导体芯片的周边的支撑部件，安装第二基板，该第二基板具有部分被带覆盖的第一表面，经由第二表面与支撑构件上的第一表面相对的第二表面，通过接合线电连接第一和第二基板，在第一基板上形成用于封装半导体芯片的密封剂，支撑构件，第二基板，接合线和具有暴露的顶表面的带，并且移除带以露出第二基板的第一表面并允许电子部件安装在其上。本发明防止回流引起的污染，备有特殊的模具，并消除闪光。

5. 发明申请

US20080246142A1 Heat dissipation unit and a semiconductor package that has the heat dissipation unit 审中-公开
标题翻译：散热单元和具有散热单元的半导体封装
公开(公告)号：US20080246142A1
公开(公告)日：2008-10-09
申请号：US12080798
申请日：2008-04-04
申请人： Jeng-Yuan Lai , Chien-Ping Huang , Chih-Ming Huang , Yu-Po Wang , Cheng-Hsu Hsiao
发明人： Jeng-Yuan Lai , Chien-Ping Huang , Chih-Ming Huang , Yu-Po Wang , Cheng-Hsu Hsiao
IPC分类号： H01L23/367
CPC分类号： H01L23/4334 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A heat dissipation unit and a semiconductor package having the same are disclosed. The semiconductor package includes a carrier; an electronic component mounted on and electrically connected to the carrier; a heat dissipation unit, which includes a flat section attached to the electronic component, extension sections connected to the flat section, and a heat dissipation section connected to the extension sections; and an encapsulant encapsulating the electronic component and the heat dissipation unit, wherein stress releasing sections are at least disposed at intersectional corners between the extension sections and the flat section so as to prevent projections from being formed by concentrated stresses in a punching process of the heat dissipation unit, thereby maintaining flatness of the flat section and further preventing circuits of the electronic component from being damaged due to a contact point produced between the electronic component and the flat section in a molding process.
摘要翻译：公开了一种散热单元和具有该散热单元的半导体封装。半导体封装包括载体; 电子部件，其安装在所述载体上并与其电连接; 散热单元，其包括附接到所述电子部件的平坦部分，连接到所述平坦部分的延伸部分和连接到所述延伸部分的散热部分; 以及封装电子部件和散热部的密封剂，其中应力释放部至少设置在延伸部和平坦部之间的交叉角处，以防止在热冲压加工中由于集中应力而形成突起从而保持平坦部分的平坦度，并且进一步防止电子部件的电路在模制过程中由于在电子部件和平坦部分之间产生的接触点而损坏。

6. 发明申请

US20080088011A1 Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof 有权
标题翻译：可堆叠半导体器件的半导体封装及其制造方法
公开(公告)号：US20080088011A1
公开(公告)日：2008-04-17
申请号：US11974441
申请日：2007-10-12
申请人： Han-Ping Hu , Chien-Ping Huang , Chih-Ming Huang , Yu-Po Wang , Cheng-Hsu Hsiao
发明人： Han-Ping Hu , Chien-Ping Huang , Chih-Ming Huang , Yu-Po Wang , Cheng-Hsu Hsiao
IPC分类号： H01L23/49 , H01L21/58
CPC分类号： H01L21/568 , H01L23/3128 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/01079 , H01L2924/15192 , H01L2924/15311 , H01L2924/16151 , H01L2924/16195 , H01L2924/18161 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor package on which a semiconductor device can be stacked and fabrication method thereof are provided. The fabrication method includes the steps of mounting and electrically connecting at least one semiconductor chip on the substrate, mounting an electrical connecting structure consisting of an upper layer circuit board and a lower layer circuit board on the substrate and electrically connecting the electrical connecting structure to the substrate, where the semiconductor chip is received in a receiving space formed in the electrical connecting structure; forming an encapsulant on the substrate encapsulating the semiconductor chip and the electrical connecting structure, and after the encapsulant is formed, exposing top surface of the upper layer circuit board with a plurality of solder pads from the encapsulant to allow at least one semiconductor device to electrically connect the upper layer circuit board so as to form a stack structure.
摘要翻译：提供半导体器件可堆叠的半导体封装件及其制造方法。该制造方法包括以下步骤：在基板上安装和电连接至少一个半导体芯片，将由上层电路板和下层电路板组成的电连接结构安装在基板上，并将电连接结构电连接到衬底，其中所述半导体芯片被容纳在形成在所述电连接结构中的接收空间中; 在封装半导体芯片和电连接结构的基板上形成密封剂，并且在形成密封剂之后，用来自密封剂的多个焊盘将上层电路板的顶表面曝光，以允许至少一个半导体器件电连接上层电路板，形成堆叠结构。

7. 发明申请

US20070181990A1 Stacked semiconductor structure and fabrication method thereof 有权
标题翻译：叠层半导体结构及其制造方法
公开(公告)号：US20070181990A1
公开(公告)日：2007-08-09
申请号：US11591974
申请日：2006-11-01
申请人： Chien-Ping Huang , Chih-Ming Huang , Han-Ping Pu , Yu-Po Wang , Cheng-Hsu Hsiao
发明人： Chien-Ping Huang , Chih-Ming Huang , Han-Ping Pu , Yu-Po Wang , Cheng-Hsu Hsiao
IPC分类号： H01L23/02 , H01L21/00
CPC分类号： H01L23/3128 , H01L21/561 , H01L21/565 , H01L23/16 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/49175 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06572 , H01L2225/06586 , H01L2924/00014 , H01L2924/01033 , H01L2924/15174 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stacked semiconductor structure and fabrication method thereof are provided. The method includes mounting and connecting electrically a semiconductor chip to a first substrate, mounting on the first substrate a plurality of supporting members corresponding in position to a periphery of the semiconductor chip, mounting a second substrate having a first surface partially covered with a tape and a second surface opposite to the first surface on the supporting members via the second surface, connecting electrically the first and second substrates by bonding wires, forming on the first substrate an encapsulant for encapsulating the semiconductor chip, the supporting members, the second substrate, the bonding wires, and the tape with an exposed top surface, and removing the tape to expose the first surface of the second substrate and allow an electronic component to be mounted thereon. The present invention prevents reflow-induced contamination, spares a special mold, and eliminates flash.
摘要翻译：提供了堆叠半导体结构及其制造方法。该方法包括将半导体芯片电连接到第一基板上，在第一基板上安装多个对应于半导体芯片的周边的支撑部件，安装第二基板，该第二基板具有部分被带覆盖的第一表面，经由第二表面与支撑构件上的第一表面相对的第二表面，通过接合线电连接第一和第二基板，在第一基板上形成用于封装半导体芯片的密封剂，支撑构件，第二基板，接合线和具有暴露的顶表面的带，并且移除带以露出第二基板的第一表面并允许电子部件安装在其上。本发明防止回流引起的污染，备有特殊的模具，并消除闪光。

8. 发明授权

US07679178B2 Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof 有权
标题翻译：可堆叠半导体器件的半导体封装及其制造方法
公开(公告)号：US07679178B2
公开(公告)日：2010-03-16
申请号：US11974441
申请日：2007-10-12
申请人： Han-Ping Pu , Chien-Ping Huang , Chih-Ming Huang , Yu-Po Wang , Cheng-Hsu Hsiao
发明人： Han-Ping Pu , Chien-Ping Huang , Chih-Ming Huang , Yu-Po Wang , Cheng-Hsu Hsiao
IPC分类号： H01L23/02
CPC分类号： H01L21/568 , H01L23/3128 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/01079 , H01L2924/15192 , H01L2924/15311 , H01L2924/16151 , H01L2924/16195 , H01L2924/18161 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor package on which a semiconductor device can be stacked and fabrication method thereof are provided. The fabrication method includes the steps of mounting and electrically connecting at least one semiconductor chip on the substrate, mounting an electrical connecting structure consisting of an upper layer circuit board and a lower layer circuit board on the substrate and electrically connecting the electrical connecting structure to the substrate, where the semiconductor chip is received in a receiving space formed in the electrical connecting structure; forming an encapsulant on the substrate encapsulating the semiconductor chip and the electrical connecting structure, and after the encapsulant is formed, exposing top surface of the upper layer circuit board with a plurality of solder pads from the encapsulant to allow at least one semiconductor device to electrically connect the upper layer circuit board so as to form a stack structure.
摘要翻译：提供半导体器件可堆叠的半导体封装件及其制造方法。该制造方法包括以下步骤：在基板上安装和电连接至少一个半导体芯片，将由上层电路板和下层电路板组成的电连接结构安装在基板上，并将电连接结构电连接到衬底，其中所述半导体芯片被容纳在形成在所述电连接结构中的接收空间中; 在封装半导体芯片和电连接结构的基板上形成密封剂，并且在形成密封剂之后，用来自密封剂的多个焊盘将上层电路板的顶表面曝光，以允许至少一个半导体器件电连接上层电路板，形成堆叠结构。

9. 发明申请

US20060223216A1 Sensor module structure and method for fabricating the same 审中-公开
标题翻译：传感器模块结构及其制造方法
公开(公告)号：US20060223216A1
公开(公告)日：2006-10-05
申请号：US11208269
申请日：2005-08-18
申请人： Chin-Huang Chang , Chien-Ping Huang , Chih-Ming Huang , Cheng-Yi Chang , Cheng-Hsu Hsiao
发明人： Chin-Huang Chang , Chien-Ping Huang , Chih-Ming Huang , Cheng-Yi Chang , Cheng-Hsu Hsiao
IPC分类号： H01L21/00 , H01L23/495
CPC分类号： H01L27/14618 , H01L24/97 , H01L25/167 , H01L27/14625 , H01L27/14683 , H01L2224/32225 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A sensor module structure and a method for fabricating the same are proposed. A chip carrier module plate including a plurality of chip carriers is provided, each chip carrier having a first surface and a second surface. At least one semiconductor chip is mounted on and electrically connected to the first surface of each of the chip carriers. An encapsulation body is formed for completely encapsulating the semiconductor chips and the first surfaces of the chip carriers. A singulation process is performed to form individual package units integrated with the semiconductor chips. A sensor chip, a corresponding lens kit and a flexible printed circuit (FPC) board are attached to the second surface of each of the chip carriers, wherein the sensor chip and the FPC board are electrically connected to the chip carrier. This provides the sensor module structure fabricated with simple processes, low costs and high yields.
摘要翻译：提出了一种传感器模块结构及其制造方法。提供了包括多个芯片载体的芯片载体模块板，每个芯片载体具有第一表面和第二表面。至少一个半导体芯片安装在每个芯片载体的第一表面上并电连接到每个芯片载体的第一表面。形成用于完全封装半导体芯片和芯片载体的第一表面的封装体。执行单个处理以形成与半导体芯片集成的单个封装单元。传感器芯片，相应的透镜套件和柔性印刷电路板（FPC）板安装在每个芯片载体的第二表面上，其中传感器芯片和FPC基板电连接到芯片载体。这提供了以简单的工艺制造的传感器模块结构，低成本和高产量。

10. 发明申请

US20070278701A1 Semiconductor package and method for fabricating the same 审中-公开
标题翻译：半导体封装及其制造方法
公开(公告)号：US20070278701A1
公开(公告)日：2007-12-06
申请号：US11591800
申请日：2006-11-01
申请人： Cheng-Yi Chang , Chien-Ping Huang , Chih-Ming Huang , Chieh-Yuan Lin , Cheng-Hsu Hsiao
发明人： Cheng-Yi Chang , Chien-Ping Huang , Chih-Ming Huang , Chieh-Yuan Lin , Cheng-Hsu Hsiao
IPC分类号： H01L23/28
CPC分类号： H01L21/561 , H01L21/481 , H01L23/3121 , H01L23/49805 , H01L23/49811 , H01L24/48 , H01L24/97 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2224/85 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package and a method for fabricating the same are disclosed. The method includes installing a plurality of conductive components on a plurality of chip carriers of a chip carrier module, connecting electrically the conductive components to electrical connection points of the adjacent chip carriers, mounting and electrically connecting a semiconductor chip to each of the chip carries, forming an encapsulant for enveloping the semiconductor chip and the conductive components, cutting the chip carriers to separate the conductive components installed thereon, exposing a portion of the conductive components out of the encapsulant, forming on the exposed portion of the conductive components an electroplated layer of nickel/gold, and separating the chip carriers from each other. The conductive components exposed out of the encapsulant provide extra electrical connection points and thereby promote the functionalities of electronic products.
摘要翻译：公开了一种半导体封装及其制造方法。该方法包括在芯片载体模块的多个芯片载体上安装多个导电组件，将导电组件电连接到相邻芯片载体的电连接点，将半导体芯片安装并电连接到每个芯片载体，形成用于包封半导体芯片和导电部件的密封剂，切割芯片载体以分离安装在其上的导电组件，将一部分导电组分暴露于密封剂外，在导电组件的暴露部分上形成电镀层镍/金，并且将芯片载体彼此分离。从密封剂露出的导电组件提供额外的电连接点，从而促进电子产品的功能。

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