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    • 1. 发明申请
    • Semiconductor device and fabrication method thereof
    • 半导体器件及其制造方法
    • US20070164386A1
    • 2007-07-19
    • US11648045
    • 2006-12-28
    • Cheng-Yi ChangChien-Ping HuangYu-Po WangChih-Ming HuangCheng-Hsu Hsiao
    • Cheng-Yi ChangChien-Ping HuangYu-Po WangChih-Ming HuangCheng-Hsu Hsiao
    • H01L31/0203H01L21/56
    • H01L27/14687H01L24/97H01L27/14618H01L2224/48091H01L2224/48227H01L2224/8592H01L2224/97H01L2924/01033H01L2924/15311H01L2924/16195H01L2224/85H01L2924/00014
    • A semiconductor device and the fabrication method thereof are provided. The fabrication method includes providing a substrate module plate having a plurality of substrates; attaching at least one sensor chip to each of the substrates of the substrate module plate; electrically connecting each of the sensor chips to each of the substrates through bonding wires; forming an insulating layer between each sensor chip on the substrate module plate, wherein the height of the insulating layers are not greater than the thickness of the sensor chips so as to prevent flash from the insulating layers from contaminating the sensor chips; forming an adhesive lip on the insulating layer or forming a second insulating layer followed by forming the adhesive layer, wherein the adhesive layer or the second insulating layer is higher than the highest loop-height of the bonding wires; adhering a light transmitting cover to each adhesive layer to cover the sensor chip; and cutting the substrate module plate to separate the substrates to form a plurality of semiconductor devices each integrated with at least one sensor chip. As the adhesive layers are not in contact with the bonding wires, the problems of damaging or breaking the bonding wires can be prevented in the process of adhering the light transmitting cover.
    • 提供半导体器件及其制造方法。 该制造方法包括提供具有多个基板的基板模块板; 将至少一个传感器芯片附接到所述基板模块板的每个基板; 通过接合线将每个传感器芯片电连接到每个基板; 在衬底模块板上的每个传感器芯片之间形成绝缘层,其中绝缘层的高度不大于传感器芯片的厚度,以防止来自绝缘层的闪光污染传感器芯片; 在所述绝缘层上形成粘合剂唇缘或形成第二绝缘层,接着形成所述粘合剂层,其中所述粘合剂层或所述第二绝缘层高于所述接合线的最高环高度; 将透光盖粘附到每个粘合剂层以覆盖传感器芯片; 以及切割所述基板模块板以分离所述基板以形成多个半导体器件,每个半导体器件与至少一个传感器芯片集成。 由于粘合层不与接合线接触,所以在粘接透光罩的过程中可以防止损坏或断裂接合线的问题。