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1. 发明授权

US08866236B2 Package structure having MEMS element 有权
标题翻译：具有MEMS元件的封装结构
公开(公告)号：US08866236B2
公开(公告)日：2014-10-21
申请号：US12769993
申请日：2010-04-29
申请人： Chi-Hsin Chiu , Chih-Ming Huang , Chang-Yueh Chan , Hsin-Yi Liao , Chun-Chi Ke
发明人： Chi-Hsin Chiu , Chih-Ming Huang , Chang-Yueh Chan , Hsin-Yi Liao , Chun-Chi Ke
IPC分类号： H01L29/84 , H01L23/31 , H01L21/56 , B81B7/00 , H01L23/552 , H01L23/00
CPC分类号： B81B7/0064 , B81B7/007 , B81B2207/095 , H01L21/56 , H01L23/315 , H01L23/552 , H01L24/48 , H01L2224/48227 , H01L2224/48465 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/1461 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package structure having at least an MEMS element is provided, including a chip having electrical connecting pads and the MEMS element; a lid disposed on the chip to cover the MEMS element and having a metal layer provided thereon; first sub-bonding wires electrically connecting to the electrical connecting pads; second sub-bonding wires electrically connecting to the metal layer; an encapsulant disposed on the chip, wherein the top ends of the first and second sub-bonding wires are exposed from the encapsulant; and metallic traces disposed on the encapsulant and electrically connecting to the first sub-bonding wires. The package structure advantageously features reduced size, relatively low costs, diverse bump locations, and an enhanced EMI shielding effect.
摘要翻译：提供具有至少MEMS元件的封装结构，其包括具有电连接焊盘和MEMS元件的芯片; 设置在所述芯片上以覆盖所述MEMS元件并且具有设置在其上的金属层的盖; 电连接到电连接焊盘的第一子接合线; 电连接到金属层的第二子接合线; 设置在所述芯片上的密封剂，其中所述第一和第二子接合线的顶端从所述密封剂露出; 以及设置在密封剂上并电连接到第一子接合线的金属迹线。封装结构有利地具有减小的尺寸，相对低的成本，不同的凸起位置和增强的EMI屏蔽效果。

2. 发明授权

US08367926B2 Electronic apparatus and cover mechanism 失效
标题翻译：电子仪器和盖机构
公开(公告)号：US08367926B2
公开(公告)日：2013-02-05
申请号：US12944654
申请日：2010-11-11
申请人： Wen-Tang Peng , Chih-Ming Huang
发明人： Wen-Tang Peng , Chih-Ming Huang
IPC分类号： H01B3/16 , H01J5/00 , H02G3/14 , H01R13/44 , H02B5/00
CPC分类号： H01R13/5213 , H01R2201/06
摘要： An electronic apparatus includes an enclosure defining a connector port, and a cover mechanism. The cover mechanism includes a bracket mounted to the enclosure, a cover rotatably mounted to the bracket to cover or uncover the connector port. The cover includes an elastic lock. When the cover is rotated to cover the connector port, the elastic lock is engaged with a sidewall of the connector port.
摘要翻译：电子设备包括限定连接器端口的外壳和盖机构。盖机构包括安装到外壳的支架，可旋转地安装到支架以覆盖或露出连接器端口的盖。盖子包括弹性锁。当盖旋转以覆盖连接器端口时，弹性锁与连接器端口的侧壁接合。

3. 发明授权

US08304891B2 Semiconductor package device, semiconductor package structure, and fabrication methods thereof 有权
标题翻译：半导体封装器件，半导体封装结构及其制造方法
公开(公告)号：US08304891B2
公开(公告)日：2012-11-06
申请号：US12315787
申请日：2008-12-04
申请人： Cheng-Chia Chiang , Chin-Huang Chang , Chien-Ping Huang , Chih-Ming Huang , Jung-Pin Huang
发明人： Cheng-Chia Chiang , Chin-Huang Chang , Chien-Ping Huang , Chih-Ming Huang , Jung-Pin Huang
IPC分类号： H01L23/28 , H01L23/31 , H01L23/52 , H01L23/00
CPC分类号： H01L23/4334 , H01L21/486 , H01L23/31 , H01L23/3128 , H01L23/3135 , H01L23/49827 , H01L24/97 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/15311 , H01L2924/157 , H01L2924/3511 , H01L2924/00 , H01L2224/81
摘要： A semiconductor package device, a semiconductor package structure, and fabrication methods thereof are provided, which mainly includes disposing a plurality of semiconductor chips on a wafer formed with TSVs (Through Silicon Vias) and electrically connecting the semiconductor chips to the TSVs; encapsulating the semiconductor chips with an encapsulant; and disposing a hard component on the encapsulant. The hard component ensures flatness of the wafer during a solder bump process and provides support to the wafer during a singulation process such that the wafer can firmly lie on a singulation carrier, thereby overcoming the drawbacks of the prior art, namely difficulty in mounting of solder bumps, and difficulty in cutting of the wafer.
摘要翻译：提供了一种半导体封装器件，半导体封装结构及其制造方法，其主要包括在形成有TSV（透硅通孔）的晶片上设置多个半导体芯片，并将半导体芯片与TSV电连接; 用密封剂封装半导体芯片; 并将硬组分设置在密封剂上。硬组件确保了在焊料凸块工艺期间晶片的平整度，并且在单独化处理期间提供对晶片的支撑，使得晶片可以牢固地位于单个载体上，从而克服现有技术的缺点，即难以安装焊料碰撞，切割晶片难度大。

4. 发明申请

US20110156180A1 PACKAGE STRUCTURE HAVING MICRO-ELECTROMECHANICAL ELEMENT AND FABRICATION METHOD THEREOF 有权
标题翻译：具有微电子元件的包装结构及其制造方法
公开(公告)号：US20110156180A1
公开(公告)日：2011-06-30
申请号：US12769041
申请日：2010-04-28
申请人： Chang-Yueh Chan , Chien-Ping Huang , Chun-Chi Ke , Chun-An Huang , Chih-Ming Huang
发明人： Chang-Yueh Chan , Chien-Ping Huang , Chun-Chi Ke , Chun-An Huang , Chih-Ming Huang
IPC分类号： H01L29/84 , H01L21/02 , H01L23/52
CPC分类号： H01L21/02 , B81B7/007 , B81B2207/07 , H01L23/52 , H01L29/84 , H01L2224/02166 , H01L2224/48091 , H01L2224/48465 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： Proposed is a package structure having a micro-electromechanical (MEMS) element, including a chip having a plurality of electrical connecting pads and a MEMS element formed thereon; a lid disposed on the chip for covering the MEMS element; a stud bump disposed on each of the electrical connecting pads; an encapsulant formed on the chip with part of the stud bumps being exposed from the encapsulant; and a metal conductive layer formed on the encapsulant and connected to the stud bumps. The invention is characterized by completing the packaging process on the wafer directly to enable thinner and cheaper package structures to be fabricated within less time. This invention further provides a method for fabricating the package structure as described above.
摘要翻译：提出具有微机电（MEMS）元件的封装结构，其包括具有多个电连接焊盘和形成在其上的MEMS元件的芯片; 设置在所述芯片上用于覆盖所述MEMS元件的盖; 设置在每个电连接焊盘上的螺柱凸块; 形成在芯片上的密封剂，其中一部分柱状凸块从密封剂暴露出来; 以及金属导电层，形成在密封剂上并连接到凸块上。本发明的特征在于直接完成晶片上的封装工艺，以便在更短的时间内制造更薄和更便宜的封装结构。本发明还提供如上所述的用于制造封装结构的方法。

5. 发明申请

US20110053485A1 SERVER RACK WITH BAFFLE DEVICE 审中-公开
标题翻译：带有设备的服务器机架
公开(公告)号：US20110053485A1
公开(公告)日：2011-03-03
申请号：US12616743
申请日：2009-11-11
申请人： WEI-CHAO HUANG , CHIH-MING HUANG , CHUNG-PING LIU
发明人： WEI-CHAO HUANG , CHIH-MING HUANG , CHUNG-PING LIU
IPC分类号： H05K5/02
CPC分类号： H05K7/20736 , H05K7/20145
摘要： A server rack for receiving a plurality of modules includes two parallel side plates, a clapboard, and a baffle device. The clapboard is disposed between the two side plates substantially perpendicular to the two side plates to form a receiving space. The receiving space defines an air inlet and a module entry opposite to the air inlet. The baffle device is received in the receiving space. The baffle device includes two resisting assemblies installed on the two side plates oppositely. Each resisting assembly includes a baffle. The baffle includes a securing portion and a latching portion opposite to the securing portion. The securing portion of each baffle is rotatably secured on the corresponding side plate. A total length of the two baffles is larger than the width of the receiving space. The two baffles are inclined toward the air inlet. The two latching portions of the two baffles are latched facing the air inlet, to cover the module entry when no module is received in the receiving space.
摘要翻译：用于接收多个模块的服务器机架包括两个平行的侧板，隔板和挡板装置。隔板设置在基本上垂直于两个侧板的两个侧板之间，以形成容纳空间。接收空间限定了空气入口和与空气入口相对的模块入口。挡板装置被容纳在接收空间中。挡板装置包括两个相反地安装在两个侧板上的阻力组件。每个阻力组件包括挡板。挡板包括固定部分和与固定部分相对的闩锁部分。每个挡板的固定部分可旋转地固定在相应的侧板上。两个挡板的总长度大于接收空间的宽度。两个挡板朝向进气口倾斜。两个挡板的两个锁定部分面向空气入口锁定，以在接收空间中没有接收到模块时覆盖模块入口。

6. 发明授权

US07889511B2 Electronic carrier board applicable to surface mount technology 有权
标题翻译：电子载板适用于表面贴装技术
公开(公告)号：US07889511B2
公开(公告)日：2011-02-15
申请号：US12535397
申请日：2009-08-04
申请人： Fang-Lin Tsai , Ho-Yi Tsai , Wen-Tsung Tseng , Chih-Ming Huang
发明人： Fang-Lin Tsai , Ho-Yi Tsai , Wen-Tsung Tseng , Chih-Ming Huang
IPC分类号： H05K7/10
CPC分类号： H01R43/0256 , H01R43/0228 , H05K3/3442 , H05K3/3452 , H05K2201/0989 , H05K2201/099 , H05K2201/10636 , Y02P70/611 , Y02P70/613
摘要： An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings are aligned in the same direction and expose at least a first sidewall and a second sidewall of each of the two bond pads. The first sidewall is perpendicular to an alignment direction of the bond pads and the second sidewall is parallel to the alignment direction of the bond pads. A distance between the first sidewall of at least one of the bond pads and a corresponding side of a corresponding one of the openings is at least about 50 μm greater than a distance between the second sidewall of the at least one bond pad and a corresponding side of the corresponding opening.
摘要翻译：提供一种电子载体板，包括载体，形成在载体上的至少两个成对的接合焊盘和覆盖载体的保护层。保护层形成有与两个接合焊盘相对应的开口。开口沿相同方向排列，并暴露两个接合焊盘中的每一个的至少第一侧壁和第二侧壁。第一侧壁垂直于接合焊盘的对准方向，第二侧壁平行于接合焊盘的对准方向。至少一个接合焊盘的第一侧壁和对应的一个开口的对应侧之间的距离比至少一个接合焊盘的第二侧壁和相应的侧面之间的距离大至少约50μm 的相应开口。

7. 发明授权

US07679178B2 Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof 有权
标题翻译：可堆叠半导体器件的半导体封装及其制造方法
公开(公告)号：US07679178B2
公开(公告)日：2010-03-16
申请号：US11974441
申请日：2007-10-12
申请人： Han-Ping Pu , Chien-Ping Huang , Chih-Ming Huang , Yu-Po Wang , Cheng-Hsu Hsiao
发明人： Han-Ping Pu , Chien-Ping Huang , Chih-Ming Huang , Yu-Po Wang , Cheng-Hsu Hsiao
IPC分类号： H01L23/02
CPC分类号： H01L21/568 , H01L23/3128 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/01079 , H01L2924/15192 , H01L2924/15311 , H01L2924/16151 , H01L2924/16195 , H01L2924/18161 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor package on which a semiconductor device can be stacked and fabrication method thereof are provided. The fabrication method includes the steps of mounting and electrically connecting at least one semiconductor chip on the substrate, mounting an electrical connecting structure consisting of an upper layer circuit board and a lower layer circuit board on the substrate and electrically connecting the electrical connecting structure to the substrate, where the semiconductor chip is received in a receiving space formed in the electrical connecting structure; forming an encapsulant on the substrate encapsulating the semiconductor chip and the electrical connecting structure, and after the encapsulant is formed, exposing top surface of the upper layer circuit board with a plurality of solder pads from the encapsulant to allow at least one semiconductor device to electrically connect the upper layer circuit board so as to form a stack structure.
摘要翻译：提供半导体器件可堆叠的半导体封装件及其制造方法。该制造方法包括以下步骤：在基板上安装和电连接至少一个半导体芯片，将由上层电路板和下层电路板组成的电连接结构安装在基板上，并将电连接结构电连接到衬底，其中所述半导体芯片被容纳在形成在所述电连接结构中的接收空间中; 在封装半导体芯片和电连接结构的基板上形成密封剂，并且在形成密封剂之后，用来自密封剂的多个焊盘将上层电路板的顶表面曝光，以允许至少一个半导体器件电连接上层电路板，形成堆叠结构。

8. 发明申请

US20090284850A1 DEVICE AND METHOD FOR LOCKING LENS 审中-公开
标题翻译：用于锁定镜头的装置和方法
公开(公告)号：US20090284850A1
公开(公告)日：2009-11-19
申请号：US12353726
申请日：2009-01-14
申请人： Chih-Ming Huang , Chih-Lun Chen
发明人： Chih-Ming Huang , Chih-Lun Chen
IPC分类号： G02B7/02
CPC分类号： G02B7/08
摘要： A device and a method for locking lens in a lens holder are provided, wherein the lens is configured in a voice-coil motor (VCM) of a camera module of a cell phone and the VCM has a lens holder for a lens being fixed inside. The device includes a circumgyration stop instrument having a bottom surface for urging against the top surface of the lens holder for preventing a lateral stress and a lateral movement from occurring on the lens holder while the circumgyration stopping unit is coupled with the lens holder.
摘要翻译：提供一种用于将透镜锁定在透镜保持器中的装置和方法，其中透镜配置在手机的相机模块的音圈电机（VCM）中，并且VCM具有用于透镜的透镜保持器固定在内部。该装置包括一个环绕止动器具，其具有用于在镜片保持器与旋转镜架保持器联接的同时用于抵靠透镜保持器顶表面的底表面，用于防止横向应力和侧向运动发生在透镜保持器上。

9. 发明授权

US07573722B2 Electronic carrier board applicable to surface mounted technology (SMT) 有权
标题翻译：电子载板适用于表面贴装技术（SMT）
公开(公告)号：US07573722B2
公开(公告)日：2009-08-11
申请号：US11654273
申请日：2007-01-16
申请人： Fang-Lin Tsai , Ho-Yi Tsai , Wen-Tsung Tseng , Chih-Ming Huang
发明人： Fang-Lin Tsai , Ho-Yi Tsai , Wen-Tsung Tseng , Chih-Ming Huang
IPC分类号： H05K7/10
CPC分类号： H01R43/0256 , H01R43/0228 , H05K3/3442 , H05K3/3452 , H05K2201/0989 , H05K2201/099 , H05K2201/10636 , Y02P70/611 , Y02P70/613
摘要： An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings are aligned in the same direction and expose at least a first sidewall and a fourth sidewall of each of the two bond pads. The first sidewall and the fourth sidewall are both perpendicular to an alignment direction of the bond pads. A distance between the first sidewall of at least one of the bond pads and a corresponding side of a corresponding one of the openings is at least about 50 μm greater than a distance between the fourth sidewall of the at least one bond pad and a corresponding side of the corresponding opening.
摘要翻译：提供一种电子载体板，包括载体，形成在载体上的至少两个成对的接合焊盘和覆盖载体的保护层。保护层形成有与两个接合焊盘相对应的开口。开口沿相同的方向排列，并暴露两个接合焊盘中的每一个的至少第一侧壁和第四侧壁。第一侧壁和第四侧壁都垂直于接合焊盘的对准方向。至少一个接合焊盘的第一侧壁与对应的一个开口的对应侧之间的距离比至少一个接合焊盘的第四侧壁与相应的侧面之间的距离大至少约50微米的相应开口。

10. 发明申请

US20090039488A1 Semiconductor package and method for fabricating the same 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US20090039488A1
公开(公告)日：2009-02-12
申请号：US12228379
申请日：2008-08-11
申请人： Chang-Yueh Chan , Chih-Ming Huang , Chun-Yuan Li , Chih-Hsin Lai
发明人： Chang-Yueh Chan , Chih-Ming Huang , Chun-Yuan Li , Chih-Hsin Lai
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L24/89 , H01L21/561 , H01L23/49531 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/05554 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/4911 , H01L2224/73265 , H01L2224/85 , H01L2924/00014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/351 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A semiconductor package and a method for fabricating the same are provided. A leadframe including a die pad and a plurality of peripheral leads is provided. A carrier, having a plurality of connecting pads formed thereon, is attached to the die pad, wherein a planar size of the carrier is greater than that of the die pad, allowing the connecting pads on the carrier to be exposed from the die pad. At least a semiconductor chip is attached to a side of an assembly including the die pad and the carrier, and is electrically connected to the connecting pads of the carrier and the leads via bonding wires. A package encapsulant encapsulates the semiconductor chip, the bonding wires, a part of the carrier and a part of the leadframe, allowing a bottom surface of the carrier and a part of the leads to be exposed from the package encapsulant.
摘要翻译：提供半导体封装及其制造方法。提供了包括管芯焊盘和多个外围引线的引线框架。具有形成在其上的多个连接焊盘的载体被附接到管芯焊盘，其中载体的平面尺寸大于管芯焊盘的平面尺寸，允许载体上的连接焊盘从裸片焊盘露出。至少一个半导体芯片附着到包括芯片焊盘和载体的组件的一侧，并通过接合线电连接到载体和引线的连接焊盘。封装密封剂封装半导体芯片，接合线，载体的一部分和引线框架的一部分，允许载体的底表面和引线的一部分从封装密封剂暴露。

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