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1. 发明授权

US06987033B2 Method for making electronic devices including silicon and LTCC and devices produced thereby 有权
公开(公告)号：US06987033B2
公开(公告)日：2006-01-17
申请号：US10921511
申请日：2004-08-19
申请人： Randy T. Pike , Charles M. Newton , Carol Gamlen , Raymond C. Rumpf , Betty O'Dowd
发明人： Randy T. Pike , Charles M. Newton , Carol Gamlen , Raymond C. Rumpf , Betty O'Dowd
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/4882 , H01L21/4857 , H01L23/3735 , H01L23/427 , H01L23/473 , H01L24/31 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/83894 , H01L2924/00014 , H01L2924/00015 , H01L2924/01006 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01057 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/15151 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/00 , H01L2224/45099 , H01L2224/85399 , H01L2224/05599 , H01L2224/45015 , H01L2924/207
摘要： A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.

2. 发明授权

US06738600B1 Ceramic microelectromechanical structure 有权
标题翻译：陶瓷微机电结构
公开(公告)号：US06738600B1
公开(公告)日：2004-05-18
申请号：US09632701
申请日：2000-08-04
申请人： Charles M. Newton , Raymond C. Rumpf , Carol Gamlen
发明人： Charles M. Newton , Raymond C. Rumpf , Carol Gamlen
IPC分类号： H04B338
CPC分类号： B81C1/0015 , B81B2201/0271 , B81C2201/0109 , H01H59/0009 , H01P1/127 , H05K1/092 , H05K3/02 , Y10T29/49117 , Y10T428/24926 , Y10T428/2495
摘要： A microelectromechanical structure and method is disclosed. A ceramic substrate preferably is formed from low temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can be a sacrificial layer or a subsequent sacrificial layer added. A photodefined conductor is printed over the low loss dielectric planarizing layer and formed with the sacrificial layer into a structural circuit component. In one aspect of the invention, a switch is formed with a biasing actuator and deflectable member formed over the biasing actuator and moveable into open and closed circuit positions.
摘要翻译：公开了一种微机电结构和方法。陶瓷基板优选由低温共烧陶瓷片形成。在陶瓷基板的一个表面上形成低损耗可光限定介电平面化层。该层可以是牺牲层或随后的牺牲层。在低损耗介电平面化层上印刷光致定导体，并将牺牲层形成为结构电路部件。在本发明的一个方面，开关形成有偏置致动器和可偏转构件，该偏置致动器和偏转构件形成在偏置致动器上方并且可移动到打开和闭合的位置。

3. 发明授权

US07035591B2 Ceramic microelectromechanical structure 有权
标题翻译：陶瓷微机电结构
公开(公告)号：US07035591B2
公开(公告)日：2006-04-25
申请号：US10827004
申请日：2004-04-19
申请人： Charles M. Newton , Raymond C. Rumpf , Carol Gamlen
发明人： Charles M. Newton , Raymond C. Rumpf , Carol Gamlen
IPC分类号： H04B3/38
CPC分类号： B81C1/0015 , B81B2201/0271 , B81C2201/0109 , H01H59/0009 , H01P1/127 , H05K1/092 , H05K3/02 , Y10T29/49117 , Y10T428/24926 , Y10T428/2495
摘要： A microelectromechanical structure and method is disclosed. A ceramic substrate preferably is formed from low temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can e a sacrificial layer or a subsequent sacrificial layer added. A photodefined conductor is printed over the low loss dielectric planarizing layer and formed with the sacrificial layer into a structural circuit component. In one aspect of the invention, a switch is formed with a biasing actuator and deflectable member formed over the biasing actuator and moveable into open and closed circuit positions.
摘要翻译：公开了一种微机电结构和方法。陶瓷基板优选由低温共烧陶瓷片形成。在陶瓷基板的一个表面上形成低损耗可光限定介电平面化层。该层可以添加牺牲层或随后的牺牲层。在低损耗介电平面化层上印刷光致定导体，并将牺牲层形成为结构电路部件。在本发明的一个方面，开关形成有偏置致动器和可偏转构件，该偏置致动器和偏转构件形成在偏置致动器上方并且可移动到打开和闭合的位置。

4. 发明授权

US06809424B2 Method for making electronic devices including silicon and LTCC and devices produced thereby 有权
标题翻译：用于制造包括硅和LTCC的电子器件的方法以及由此产生的器件
公开(公告)号：US06809424B2
公开(公告)日：2004-10-26
申请号：US09741754
申请日：2000-12-19
申请人： Randy T. Pike , Charles M. Newton , Carol Gamlen , Raymond C. Rumpf , Betty O'Dowd
发明人： Randy T. Pike , Charles M. Newton , Carol Gamlen , Raymond C. Rumpf , Betty O'Dowd
IPC分类号： H01L2348
CPC分类号： H01L21/4882 , H01L21/4857 , H01L23/3735 , H01L23/427 , H01L23/473 , H01L24/31 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/83894 , H01L2924/00014 , H01L2924/00015 , H01L2924/01006 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01057 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/15151 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/00 , H01L2224/45099 , H01L2224/85399 , H01L2224/05599 , H01L2224/45015 , H01L2924/207
摘要： A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.
摘要翻译：一种制造电子设备的方法包括定位第一和第二构件，使得其相对表面彼此接触，第一构件包括硅，第二构件包括低温共烧陶瓷（LTCC）材料。该方法还包括将第一和第二构件的相对表面阳极结合在一起，以在其间形成气密密封。阳极接合在不使用粘合剂的情况下在构件之间提供牢固且牢固的结合。该方法还可以包括在第一和第二构件中的至少一个中形成至少一个冷却结构。至少一个冷却结构可以包括第一构件中的至少一个第一微流体冷却结构，以及与第一微流体冷却结构对准的第二构件中的至少一个第二微流体冷却结构。

5. 发明授权

US06542244B1 Variable sensitivity acoustic transducer 失效
标题翻译：可变灵敏度声换能器
公开(公告)号：US06542244B1
公开(公告)日：2003-04-01
申请号：US09456739
申请日：1999-12-07
申请人： Raymond C. Rumpf , Charles M. Newton
发明人： Raymond C. Rumpf , Charles M. Newton
IPC分类号： G01B902
CPC分类号： H04R23/008
摘要： The gauge length of an acoustic signal detector is dynamically variable by adjusting the location of an induced light reflection interface within a section of optical waveguide to which an acoustic stimulus is coupled. In an interferometer based architecture, a light beam is applied to each of an ‘acoustic signal detection’ optical waveguide and a ‘reference’ optical waveguide. The ‘acoustic signal detection’ waveguide is coupled to an acoustic energy transmission element. The acoustic input modifies the index of refraction of the optical waveguide and modulates the light passing through the waveguide. Since the index of refraction of the optical waveguide section is modified by the acoustic stimulus, the signal beam has a phase delay dependent upon the acoustic signal and the distance between one end of the signal waveguide section and an induced reflection interface. The ‘reference’ optical waveguide section also contains a reflection interface, the induced location of which is ganged with that of the signal optical waveguide section. The ‘signal’ path and ‘reference’ path beams reflected by their reflection interfaces are combined and applied to a photo-detector. The index of refraction of the material of the signal optical waveguide section is modified by the acoustic stimulus is the ‘signal path’. This ‘signal’ path light beam is combined out of phase with ‘reference’ light beam at the photo-detector.
摘要翻译：声学信号检测器的标距可以通过调节声学刺激耦合到的光波导的一部分内的感应光反射界面的位置来动态地变化。在基于干涉仪的架构中，将光束施加到“声信号检测”光波导和“参考”光波导中的每一个。 “声信号检测”波导耦合到声能传输元件，声输入修改光波导的折射率并调制通过波导的光，由于光波导部分的折射率被修改为声波刺激，信号光束具有取决于声信号的相位延迟和信号波导部分的一端与感应反射界面之间的距离，“参考”光波导部分还包含反射界面，诱导位置其与信号光波导部分的结合。由其反射界面反射的“信号”路径和“参考”路径光束被组合并应用到光检测器。信号光波导部分的材料的折射率通过声学刺激来改变为“信号路径”，该“信号”路径光束在光检测器处与“参考”光束异相组合。

6. 发明授权

US06628851B1 MEMS reconfigurable optical grating 有权
标题翻译： MEMS可重构光栅
公开(公告)号：US06628851B1
公开(公告)日：2003-09-30
申请号：US09739013
申请日：2000-12-20
申请人： Raymond C. Rumpf , Charles M. Newton
发明人： Raymond C. Rumpf , Charles M. Newton
IPC分类号： G02F1295
CPC分类号： G02B26/0808 , G02B5/1828 , G02B6/29313 , G02B6/29383 , G02B6/3566 , G02B6/357 , G02B6/358
摘要： A tunable grating apparatus includes a plurality of grating structures contained within an optical transmission path. A microelectromechanical (MEMS) actuator is operatively connected to each grating structure for changing the separation between the grating structures and tuning the grating to a desired wavelength selectivity. The grating structures preferably form a Bragg grating.
摘要翻译：可调光栅装置包括包含在光传输路径内的多个光栅结构。微机电（MEMS）致动器可操作地连接到每个光栅结构，用于改变光栅结构之间的间隔并将光栅调谐到期望的波长选择性。光栅结构优选地形成布拉格光栅。

7. 发明授权

US06437981B1 Thermally enhanced microcircuit package and method of forming same 有权
公开(公告)号：US06437981B1
公开(公告)日：2002-08-20
申请号：US09727140
申请日：2000-11-30
申请人： Charles M. Newton , Carol A. Gamlen , Raymond C. Rumpf, Jr.
发明人： Charles M. Newton , Carol A. Gamlen , Raymond C. Rumpf, Jr.
IPC分类号： H05K720
CPC分类号： F28D15/043 , B81C1/00119 , F28D2015/0225 , H01L23/427 , H01L2224/48091 , H01L2224/48227 , H01L2924/01015 , H01L2924/09701 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A thermally enhanced microcircuit package includes a microcircuit package having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid. The evaporator is operatively associated with the microcircuit device for cooling the device when in use.

8. 发明授权

US08280004B2 System and method for non-destructive decontamination of sensitive electronics using soft x-ray radiation 有权
公开(公告)号：US08280004B2
公开(公告)日：2012-10-02
申请号：US11986228
申请日：2007-11-19
申请人： John R. DeSalvo , Charles M. Newton , William T. Silfvast , Gregory M. Shimkaveg
发明人： John R. DeSalvo , Charles M. Newton , William T. Silfvast , Gregory M. Shimkaveg
IPC分类号： G21K5/08
CPC分类号： A61L2/08 , A61L2/082
摘要： A method is provided for decontaminating biological pathogens residing in an enclosure of an electronic device. The method includes: identifying materials used to encase the enclosure of the electronic device; tailoring x-ray radiation to penetrate the materials encasing the enclosure; and directing x-ray radiation having a diffused radiation angle towards the electronic device.

9. 发明授权

US07591924B2 Apparatus for sealing flex circuits having heat sensitive circuit elements 有权
标题翻译：用于密封具有热敏电路元件的柔性电路的装置
公开(公告)号：US07591924B2
公开(公告)日：2009-09-22
申请号：US11463087
申请日：2006-08-08
申请人： C. W. Sinjin Smith , Charles M. Newton , Paul B. Jaynes
发明人： C. W. Sinjin Smith , Charles M. Newton , Paul B. Jaynes
IPC分类号： B30B15/34
CPC分类号： B32B37/06 , B32B37/04 , B32B37/08 , B32B37/10 , B32B37/1009 , B32B37/185 , B32B2305/55 , B32B2309/02 , B32B2457/08 , H05K1/189 , H05K3/284 , H05K2201/064 , H05K2203/068 , H05K2203/1121 , H05K2203/1311 , H05K2203/304
摘要： A method and apparatus is disclosed for affixing a cover layer formed of liquid crystal polymer to a flex circuit consisting of circuit elements mounted to a liquid crystal polymer substrate in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants and to provide thermal protection of temperature sensitive circuit elements within the flex circuit during the encapsulation process.
摘要翻译：公开了一种用于将由液晶聚合物形成的覆盖层固定到由安装到液晶聚合物基板上的电路元件组成的柔性电路以便将电路元件封装在覆盖层和基板之间以防止其暴露于水分和污染物，并在封装过程中为柔性电路内的温度敏感电路元件提供热保护。

10. 发明授权

US07580506B2 System and method for non-destructive decontamination of sensitive electronics using soft X-ray radiation 失效
标题翻译：使用软X射线辐射对敏感电子设备进行非破坏性去污的系统和方法
公开(公告)号：US07580506B2
公开(公告)日：2009-08-25
申请号：US11699443
申请日：2007-01-29
申请人： John R. DeSalvo , Charles M. Newton , William T. Silfvast , Gregory M. Shimkaveg
发明人： John R. DeSalvo , Charles M. Newton , William T. Silfvast , Gregory M. Shimkaveg
IPC分类号： G21K5/00 , H01J35/14
CPC分类号： A61L2/08 , A61L2/082
摘要： A method is provided for decontaminating biological pathogens residing in an enclosure of an electronic device. The method includes: identifying materials used to encase the enclosure of the electronic device; tailoring x-ray radiation to penetrate the materials encasing the enclosure; and directing x-ray radiation having a diffused radiation angle towards the electronic device.
摘要翻译：提供了一种用于净化驻留在电子设备的外壳中的生物病原体的方法。该方法包括：识别用于封装电子设备外壳的材料; 定制x射线辐射以穿透包围外壳的材料; 并将具有扩散的辐射角的x射线辐射引向电子设备。

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