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1. 发明申请

US20080296716A1 Sensor semiconductor device and manufacturing method thereof 审中-公开
标题翻译：传感器半导体器件及其制造方法
公开(公告)号：US20080296716A1
公开(公告)日：2008-12-04
申请号：US12151570
申请日：2008-05-07
申请人： Chang-Yueh Chan , Chien-Ping Huang , Chih-Ming Huang , Cheng-Hsu Hsiao , Chun-Chi Ke
发明人： Chang-Yueh Chan , Chien-Ping Huang , Chih-Ming Huang , Cheng-Hsu Hsiao , Chun-Chi Ke
IPC分类号： H01L21/50 , H01L23/00
CPC分类号： H01L21/56 , H01L23/3114 , H01L27/14618 , H01L27/14683 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A sensor semiconductor device and a manufacturing method thereof are disclosed. The method includes: providing a light-permeable carrier board with a plurality of metallic circuits; electrically connecting the metallic circuits to a plurality of sensor chips through conductive bumps formed on the bond pads of the sensor chips, wherein the sensor chips have been previously subjected to thinning and chip probing; filling a first dielectric layer between the sensor chips to cover the metallic circuits and peripheries of the sensor chips; forming a second dielectric layer on the sensor chips and the first dielectric layer; forming grooves between the sensor chips for exposing the metallic circuits such that a plurality of conductive traces electrically connected to the metallic circuits can be formed on the second dielectric layer; and singulating the sensor chips to form a plurality of sensor semiconductor devices. The present invention overcomes the drawbacks of breakage of trace connection due to a sharp angle formed at joints, poor electrical connection and chip damage due to an alignment error in cutting from the back of the wafer, as well as an increased cost due to multiple sputtering processes for forming traces.
摘要翻译：公开了一种传感器半导体器件及其制造方法。该方法包括：提供具有多个金属电路的透光性载板; 通过形成在传感器芯片的接合焊盘上的导电凸块将金属电路电连接到多个传感器芯片，其中传感器芯片已经预先经受了薄化和芯片探测; 在传感器芯片之间填充第一电介质层以覆盖金属电路和传感器芯片的周边; 在所述传感器芯片和所述第一介电层上形成第二电介质层; 在所述传感器芯片之间形成用于暴露所述金属电路的槽，使得可以在所述第二介电层上形成电连接到所述金属电路的多个导电迹线; 并且分离传感器芯片以形成多个传感器半导体器件。本发明克服了由于在接头处形成的尖角导致的迹线连接断裂的缺点，由于从晶片背面的切割中的对准误差导致的不良电连接和芯片损坏以及由于多次溅射而导致的成本增加形成痕迹的过程。

2. 发明授权

US08198689B2 Package structure having micro-electromechanical element and fabrication method thereof 有权
标题翻译：具有微机电元件的封装结构及其制造方法
公开(公告)号：US08198689B2
公开(公告)日：2012-06-12
申请号：US12769041
申请日：2010-04-28
申请人： Chang-Yueh Chan , Chien-Ping Huang , Chun-Chi Ke , Chun-An Huang , Chih-Ming Huang
发明人： Chang-Yueh Chan , Chien-Ping Huang , Chun-Chi Ke , Chun-An Huang , Chih-Ming Huang
IPC分类号： H01L23/485
CPC分类号： H01L21/02 , B81B7/007 , B81B2207/07 , H01L23/52 , H01L29/84 , H01L2224/02166 , H01L2224/48091 , H01L2224/48465 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： Proposed is a package structure having a micro-electromechanical (MEMS) element, including a chip having a plurality of electrical connecting pads and a MEMS element formed thereon; a lid disposed on the chip for covering the MEMS element; a stud bump disposed on each of the electrical connecting pads; an encapsulant formed on the chip with part of the stud bumps being exposed from the encapsulant; and a metal conductive layer formed on the encapsulant and connected to the stud bumps. The invention is characterized by completing the packaging process on the wafer directly to enable thinner and cheaper package structures to be fabricated within less time. This invention further provides a method for fabricating the package structure as described above.
摘要翻译：提出具有微机电（MEMS）元件的封装结构，其包括具有多个电连接焊盘和形成在其上的MEMS元件的芯片; 设置在所述芯片上用于覆盖所述MEMS元件的盖; 设置在每个电连接焊盘上的螺柱凸块; 形成在芯片上的密封剂，其中一部分柱状凸块从密封剂暴露出来; 以及金属导电层，形成在密封剂上并连接到凸块上。本发明的特征在于直接完成晶片上的封装工艺，以便在更短的时间内制造更薄和更便宜的封装结构。本发明还提供如上所述的用于制造封装结构的方法。

3. 发明申请

US20120241937A1 PACKAGE STRUCTURE HAVING MICRO-ELECTROMECHANICAL ELEMENT 有权
标题翻译：具有微电子元件的包装结构
公开(公告)号：US20120241937A1
公开(公告)日：2012-09-27
申请号：US13492220
申请日：2012-06-08
申请人： Chang-Yueh Chan , Chien-Ping Huang , Chun-Chi Ke , Chun-An Huang , Chih-Ming Huang
发明人： Chang-Yueh Chan , Chien-Ping Huang , Chun-Chi Ke , Chun-An Huang , Chih-Ming Huang
IPC分类号： H01L23/498
CPC分类号： H01L21/02 , B81B7/007 , B81B2207/07 , H01L23/52 , H01L29/84 , H01L2224/02166 , H01L2224/48091 , H01L2224/48465 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： Proposed is a package structure having a micro-electromechanical (MEMS) element, including a chip having a plurality of electrical connecting pads and a MEMS element formed thereon; a lid disposed on the chip for covering the MEMS element; a stud bump disposed on each of the electrical connecting pads; an encapsulant formed on the chip with part of the stud bumps being exposed from the encapsulant; and a metal conductive layer formed on the encapsulant and connected to the stud bumps. The invention is characterized by completing the packaging process on the wafer directly to enable thinner and cheaper package structures to be fabricated within less time. This invention further provides a method for fabricating the package structure as described above.
摘要翻译：提出具有微机电（MEMS）元件的封装结构，其包括具有多个电连接焊盘和形成在其上的MEMS元件的芯片; 设置在所述芯片上用于覆盖所述MEMS元件的盖; 设置在每个电连接焊盘上的螺柱凸块; 形成在芯片上的密封剂，其中一部分柱状凸块从密封剂暴露出来; 以及金属导电层，形成在密封剂上并连接到凸块上。本发明的特征在于直接完成晶片上的封装工艺，以便在更短的时间内制造更薄和更便宜的封装结构。本发明还提供如上所述的用于制造封装结构的方法。

4. 发明授权

US08564115B2 Package structure having micro-electromechanical element 有权
标题翻译：具有微机电元件的封装结构
公开(公告)号：US08564115B2
公开(公告)日：2013-10-22
申请号：US13492220
申请日：2012-06-08
申请人： Chang-Yueh Chan , Chien-Ping Huang , Chun-Chi Ke , Chun-An Huang , Chih-Ming Huang
发明人： Chang-Yueh Chan , Chien-Ping Huang , Chun-Chi Ke , Chun-An Huang , Chih-Ming Huang
IPC分类号： H01L23/04
CPC分类号： H01L21/02 , B81B7/007 , B81B2207/07 , H01L23/52 , H01L29/84 , H01L2224/02166 , H01L2224/48091 , H01L2224/48465 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： Proposed is a package structure having a micro-electromechanical (MEMS) element, including a chip having a plurality of electrical connecting pads and a MEMS element formed thereon; a lid disposed on the chip for covering the MEMS element; a stud bump disposed on each of the electrical connecting pads; an encapsulant formed on the chip with part of the stud bumps being exposed from the encapsulant; and a metal conductive layer formed on the encapsulant and connected to the stud bumps. The invention is characterized by completing the packaging process on the wafer directly to enable thinner and cheaper package structures to be fabricated within less time. This invention further provides a method for fabricating the package structure as described above.
摘要翻译：提出具有微机电（MEMS）元件的封装结构，其包括具有多个电连接焊盘和形成在其上的MEMS元件的芯片; 设置在所述芯片上用于覆盖所述MEMS元件的盖; 设置在每个电连接焊盘上的螺柱凸块; 形成在芯片上的密封剂，其中一部分柱状凸块从密封剂暴露出来; 以及金属导电层，形成在密封剂上并连接到凸块上。本发明的特征在于直接完成晶片上的封装工艺，以便在更短的时间内制造更薄和更便宜的封装结构。本发明还提供如上所述的用于制造封装结构的方法。

5. 发明申请

US20110156180A1 PACKAGE STRUCTURE HAVING MICRO-ELECTROMECHANICAL ELEMENT AND FABRICATION METHOD THEREOF 有权
标题翻译：具有微电子元件的包装结构及其制造方法
公开(公告)号：US20110156180A1
公开(公告)日：2011-06-30
申请号：US12769041
申请日：2010-04-28
申请人： Chang-Yueh Chan , Chien-Ping Huang , Chun-Chi Ke , Chun-An Huang , Chih-Ming Huang
发明人： Chang-Yueh Chan , Chien-Ping Huang , Chun-Chi Ke , Chun-An Huang , Chih-Ming Huang
IPC分类号： H01L29/84 , H01L21/02 , H01L23/52
CPC分类号： H01L21/02 , B81B7/007 , B81B2207/07 , H01L23/52 , H01L29/84 , H01L2224/02166 , H01L2224/48091 , H01L2224/48465 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： Proposed is a package structure having a micro-electromechanical (MEMS) element, including a chip having a plurality of electrical connecting pads and a MEMS element formed thereon; a lid disposed on the chip for covering the MEMS element; a stud bump disposed on each of the electrical connecting pads; an encapsulant formed on the chip with part of the stud bumps being exposed from the encapsulant; and a metal conductive layer formed on the encapsulant and connected to the stud bumps. The invention is characterized by completing the packaging process on the wafer directly to enable thinner and cheaper package structures to be fabricated within less time. This invention further provides a method for fabricating the package structure as described above.
摘要翻译：提出具有微机电（MEMS）元件的封装结构，其包括具有多个电连接焊盘和形成在其上的MEMS元件的芯片; 设置在所述芯片上用于覆盖所述MEMS元件的盖; 设置在每个电连接焊盘上的螺柱凸块; 形成在芯片上的密封剂，其中一部分柱状凸块从密封剂暴露出来; 以及金属导电层，形成在密封剂上并连接到凸块上。本发明的特征在于直接完成晶片上的封装工艺，以便在更短的时间内制造更薄和更便宜的封装结构。本发明还提供如上所述的用于制造封装结构的方法。

6. 发明申请

US20090057799A1 Sensor semiconductor device and method for fabricating the same 审中-公开
标题翻译：传感器半导体器件及其制造方法
公开(公告)号：US20090057799A1
公开(公告)日：2009-03-05
申请号：US12229651
申请日：2008-08-26
申请人： Chang-Yueh Chan , Chih-Ming Huang , Chien-Ping Huang , Chin-Huang Chang , Cheng-Hsu Hsiao
发明人： Chang-Yueh Chan , Chih-Ming Huang , Chien-Ping Huang , Chin-Huang Chang , Cheng-Hsu Hsiao
IPC分类号： H01L31/00 , H01L21/00
CPC分类号： H01L31/0203 , H01L31/02164 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： A sensor semiconductor device and a method for fabricating the same are provided. At least one sensor chip is mounted and electrically connected to a lead frame. A first and a second encapsulation molding processes are sequentially performed to form a transparent encapsulant for encapsulating the sensor chip and a part of the lead frame and to form a light-impervious encapsulant for encapsulating the transparent encapsulant. The transparent encapsulant has a light-pervious portion formed at a position corresponding to and above a sensor zone of the sensor chip. The light-pervious portion is exposed from the light-impervious encapsulant. Light may penetrate the light-pervious portion, without using an additional cover board, thereby reducing manufacturing steps and costs. The above arrangement avoids prior-art problems of poor reliability caused by a porous encapsulant and poor signal reception caused by interference of ambient light entering into a conventional chip only encapsulated by a transparent encapsulant.
摘要翻译：提供一种传感器半导体器件及其制造方法。至少一个传感器芯片被安装并电连接到引线框架。依次执行第一和第二封装成型工艺以形成用于封装传感器芯片和引线框架的一部分的透明密封剂，并形成用于封装透明密封剂的不透光密封剂。透明密封剂具有形成在对应于传感器芯片的传感器区域上方的位置处的透光部分。透光部分从不透光的密封剂暴露出来。光可以穿透透光部分，而不使用附加的盖板，从而减少制造步骤和成本。上述布置避免了由多孔密封剂引起的可靠性差的现有技术问题，以及由仅通过透明密封剂封装的传统芯片的环境光的干扰引起的差信号接收。

7. 发明申请

US20090261476A1 Semiconductor device and manufacturing method thereof 审中-公开
标题翻译：半导体装置及其制造方法
公开(公告)号：US20090261476A1
公开(公告)日：2009-10-22
申请号：US12148319
申请日：2008-04-18
申请人： Chien-Ping Huang , Chin-Huang Chang , Chih-Ming Huang , Cheng-Hsu Hsiao , Chun-Chi Ke
发明人： Chien-Ping Huang , Chin-Huang Chang , Chih-Ming Huang , Cheng-Hsu Hsiao , Chun-Chi Ke
IPC分类号： H01L23/482 , H01L21/60
CPC分类号： H01L24/19 , H01L21/6835 , H01L23/3114 , H01L24/24 , H01L24/82 , H01L25/105 , H01L2221/68345 , H01L2224/24226 , H01L2224/82001 , H01L2225/1035 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311
摘要： A semiconductor device and a manufacturing method thereof are disclosed. The method includes the steps of providing a carrier board having conductive circuits disposed thereon and a plurality of chips with active surfaces having solder pads disposed thereon, wherein conductive bumps are disposed on the solder pads; mounting chips on the carrier board; filling the spacing between the chips with a dielectric layer and forming openings in the dielectric layer at periphery of each chip to expose the conductive circuits; forming a metal layer in the openings of the dielectric layer and at periphery of the active surface of the chips for electrically connecting the conductive bumps and the conductive circuits; and cutting along the dielectric layer between the chips and removing the carrier board to separate each chip and exposing the conductive circuits from the non-active surface.
摘要翻译：公开了一种半导体器件及其制造方法。该方法包括以下步骤：提供具有布置在其上的导电电路的载体板和具有设置在其上的焊料焊盘的有源表面的多个芯片，其中导电凸块设置在焊盘上; 将芯片安装在载板上; 用电介质层填充芯片之间的间隔，并在每个芯片周边的电介质层中形成开口以露出导电电路; 在所述电介质层的开口部和所述芯片的有源面的外围形成金属层，用于电连接所述导电凸块和所述导电电路; 并沿着芯片之间的电介质层切割并去除载体板以分离每个芯片并使导电电路与非活性表面相接触。

8. 发明申请

US20080303111A1 Sensor package and method for fabricating the same 审中-公开
标题翻译：传感器封装及其制造方法
公开(公告)号：US20080303111A1
公开(公告)日：2008-12-11
申请号：US12156901
申请日：2008-06-05
申请人： Chang-Yueh Chan , Chien-Ping Huang , Tse-Wen Chang , Chih-Ming Huang , Cheng-Hsu Hsiao
发明人： Chang-Yueh Chan , Chien-Ping Huang , Tse-Wen Chang , Chih-Ming Huang , Cheng-Hsu Hsiao
IPC分类号： H01L31/0203 , H01L31/18
CPC分类号： H01L31/0203 , H01L23/24 , H01L31/18 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： The invention discloses a sensor package and a method for fabricating the same. The sensor package includes: a substrate with an opening; a sensor chip disposed in the opening and electrically connected to the substrate; an encapsulant filling spacing between the sensor chip and the opening so as to secure the sensor chip to the substrate; and a transparent cover attached to the substrate via an adhesive layer, wherein the adhesive layer covers the sensor chip and bonding wires and is formed with an opening for exposing sensor region of the sensor chip. Securing the sensor chip in the opening of the substrate reduces the height of the sensor package, and meanwhile the process cost is reduced by eliminating the need of formation of conductive bumps on the sensor chip or the transparent cover and eliminating the need of specially designed substrate.
摘要翻译：本发明公开了一种传感器封装及其制造方法。传感器封装包括：具有开口的基板; 传感器芯片，其布置在所述开口中并电连接到所述基板; 传感器芯片和开口之间的密封剂填充间隔，以将传感器芯片固定到基板上; 以及通过粘合剂层附着到基板的透明盖，其中粘合剂层覆盖传感器芯片和接合线，并且形成有用于暴露传感器芯片的传感器区域的开口。将传感器芯片固定在基板的开口中，降低传感器封装的高度，同时通过消除在传感器芯片或透明盖上形成导电凸块的需要降低工艺成本，并且不需要特别设计的基板。

9. 发明申请

US20080197438A1 Sensor semiconductor device and manufacturing method thereof 审中-公开
标题翻译：传感器半导体器件及其制造方法
公开(公告)号：US20080197438A1
公开(公告)日：2008-08-21
申请号：US12070003
申请日：2008-02-14
申请人： Chang-Yueh Chan , Chien-Ping Huang , Tse-Wen Chang , Chih-Ming Huang , Cheng-Hsu Hsiao
发明人： Chang-Yueh Chan , Chien-Ping Huang , Tse-Wen Chang , Chih-Ming Huang , Cheng-Hsu Hsiao
IPC分类号： H01L31/0203 , H01L31/18
CPC分类号： H01L31/0203 , H01L21/78 , H01L27/14618 , H01L27/14687 , H01L2224/94
摘要： This invention discloses a sensor semiconductor device and a manufacturing method thereof, including: providing a wafer having a plurality of sensor chips, forming a plurality of grooves between bond pads on active surfaces of the adjacent sensor chips; forming conductive traces in the grooves for electrically connecting the bond pads; mounting a transparent medium on the wafer for covering sensing areas of the sensor chips; thinning the sensor chips from the non-active surfaces down to the grooves, thereby exposing the conductive traces; cutting the wafer to separate the sensor chips; mounting the sensor chips on a substrate module having a plurality of substrates, electrically connecting the conductive traces to the substrates; providing an insulation material on the substrate module and between the sensor chips so as to encapsulate the sensor chips but expose the transparent medium; and cutting the substrate module to separate a plurality of resultant sensor semiconductor devices.
摘要翻译：本发明公开了一种传感器半导体器件及其制造方法，包括：提供具有多个传感器芯片的晶片，在相邻传感器芯片的有源表面上的接合焊盘之间形成多个沟槽; 在沟槽中形成导电迹线以电连接接合焊盘; 在所述晶片上安装透明介质以覆盖所述传感器芯片的感测区域; 将传感器芯片从非活性表面减薄到凹槽，从而暴露导电迹线; 切割晶片以分离传感器芯片; 将传感器芯片安装在具有多个基板的基板模块上，将导电迹线电连接到基板; 在衬底模块上和传感器芯片之间提供绝缘材料，以封装传感器芯片，但暴露透明介质; 以及切割所述基板模块以分离多个所得传感器半导体器件。

10. 发明申请

US20080079105A1 Sensor-type package and fabrication method thereof 审中-公开
标题翻译：传感器型封装及其制造方法
公开(公告)号：US20080079105A1
公开(公告)日：2008-04-03
申请号：US11904648
申请日：2007-09-27
申请人： Tse-Wen Chang , Chang-Yueh Chan , Chien-Ping Huang , Chih-Ming Huang , Cheng-Hsu Hsiao
发明人： Tse-Wen Chang , Chang-Yueh Chan , Chien-Ping Huang , Chih-Ming Huang , Cheng-Hsu Hsiao
IPC分类号： H01L31/0203 , H01L21/02
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14683 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/15311 , H01L2924/16195 , H01L2224/85 , H01L2924/00014
摘要： A sensor-type package and a fabrication method thereof are provided. A sensor-type chip is mounted on a substrate and is electrically connected to the substrate via bonding wires. A light-pervious body is attached to the sensor-type chip, and has one surface covered with a covering layer and another surface formed with an adhesive layer. An encapsulant encapsulates the light-pervious body. As an adhesive force between the covering layer and the encapsulant is greater than that between the covering layer and the light-pervious body, the covering layer and a portion of the encapsulant located on the covering layer can be concurrently removed, such that the light-pervious body is exposed and light can pass through the light-pervious body to be captured by the sensor-type chip. The above arrangement eliminates the need of using a dam structure as in the prior art and provides a compact sensor-type package with improved fabrication reliability.
摘要翻译：提供了传感器型封装及其制造方法。传感器型芯片安装在基板上，并通过接合线与基板电连接。透光体附着在传感器型芯片上，其一个表面被覆盖层和形成有粘合剂层的另一表面覆盖。密封剂封装透光体。由于覆盖层和密封剂之间的粘合力大于覆盖层和透光体之间的粘合力，所以可以同时去除位于覆盖层上的覆盖层和密封剂的一部分，透光体被曝光，光可以通过透光体，由传感器型芯片捕获。上述布置消除了如现有技术中使用坝结构的需要，并且提供了具有改进的制造可靠性的紧凑型传感器型封装。

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