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    • 2. 发明授权
    • Ferroelectric memory device with merged-top plate structure and method for fabricating the same
    • 具有合并顶板结构的铁电存储器件及其制造方法
    • US06913967B2
    • 2005-07-05
    • US10623098
    • 2003-07-18
    • Eun-Seok ChoiSeung-Jin Yeom
    • Eun-Seok ChoiSeung-Jin Yeom
    • H01L21/8242H01L21/02H01L21/8246H01L27/115
    • H01L27/11502H01L27/11507H01L28/55H01L28/57H01L28/60H01L28/65H01L28/75
    • The inventive ferroelectric memory device includes: a semiconductor substrate providing elements of a transistor; a first inter-layer insulating layer formed on the semiconductor substrate; a storage node contact connected to elements of the transistor by passing through the first inter-layer insulating layer; a barrier layer contacting simultaneously to the storage node contact and the first inter-layer insulating layer; a lower electrode having a space for isolating the first inter-layer insulating layer and being formed on the barrier layer; a glue layer being formed on the first inter-layer insulating layer and encompassing lateral sides of the lower electrode as filling the space; a second inter-layer insulating layer exposing a surface of the lower electrode and encompassing the glue layer; a ferroelectric layer formed on the glue layer including the second inter-layer insulating layer; and an upper electrode formed on the ferroelectric layer.
    • 本发明的铁电存储器件包括:提供晶体管元件的半导体衬底; 形成在所述半导体基板上的第一层间绝缘层; 通过穿过所述第一层间绝缘层而连接到所述晶体管的元件的存储节点接触; 与所述存储节点接触部和所述第一层间绝缘层同时接触的阻挡层; 具有用于隔离所述第一层间绝缘层并形成在所述阻挡层上的空间的下电极; 胶层在第一层间绝缘层上形成,并且在下部电极的横向侧面填充空间; 第二层间绝缘层,暴露下电极的表面并包围胶层; 形成在包括第二层间绝缘层的胶层上的铁电层; 以及形成在强电介质层上的上电极。
    • 3. 发明授权
    • Ferroelectric random access memory device and method for fabricating the same
    • 铁电随机存取存储器件及其制造方法
    • US06891211B2
    • 2005-05-10
    • US10612914
    • 2003-07-07
    • Seung-Jin YeomEun-Seok Choi
    • Seung-Jin YeomEun-Seok Choi
    • H01L27/105H01L21/8246H01L27/115H01L31/062
    • H01L27/11502H01L27/11507
    • The present invention is related to a ferroelectric memory device and a method for fabricating the same. The ferroelectric memory device includes: a substrate providing a transistor; a first insulation material with a plane surface formed on the substrate; a storage node contact passing through the first insulation material to contact to an active region of the substrate; a lower electrode being connected to the storage node contact and including a solid solution layer disposed at least as an upper most layer, the solid solution layer being doped with a metal element, which is induced to be in a solid solution state; a second insulation material having a plane surface that exposes a surface of the lower electrode, encompassing the lower electrode and being formed on the first insulation material; a ferroelectric layer covering the second insulation material including the lower electrode; an upper electrode formed on the ferroelectric layer.
    • 本发明涉及铁电存储器件及其制造方法。 铁电存储器件包括:提供晶体管的衬底; 在所述基板上形成有平面的第一绝缘材料; 存储节点接触件穿过所述第一绝缘材料以接触所述衬底的有源区; 下部电极连接到存储节点接触并且包括至少设置为最上层的固溶体层,所述固溶体层掺杂有被诱导为固溶状态的金属元素; 第二绝缘材料,其具有暴露下部电极的表面的平面,包围下部电极并形成在第一绝缘材料上; 覆盖包括下电极的第二绝缘材料的铁电层; 形成在强电介质层上的上电极。
    • 5. 发明授权
    • Reading method of non-volatile memory device
    • 非易失性存储器件的读取方法
    • US08675404B2
    • 2014-03-18
    • US13475204
    • 2012-05-18
    • Hyun-Seung YooSung-Joo HongSeiichi AritomeSeok-Kiu LeeSung-Kye ParkGyu-Seog ChoEun-Seok ChoiHan-Soo Joo
    • Hyun-Seung YooSung-Joo HongSeiichi AritomeSeok-Kiu LeeSung-Kye ParkGyu-Seog ChoEun-Seok ChoiHan-Soo Joo
    • G11C16/00
    • G11C16/0483G11C16/26G11C16/3418
    • A reading method of a non-volatile memory device that includes a plurality memory cells that each include one floating gate and two control gates disposed adjacent to the floating gate on two alternate sides of the floating gate, respectively, and two adjacent memory cells share one control gate, the reading method comprising applying a read voltage to control gates of a selected memory cell, applying a second pass voltage to alternate control gates of the memory cells different from the control gates of the selected memory cells starting from the control gates next to the selected memory cell, and applying a first pass voltage that is lower than the second pass voltage to alternate the control gates of the memory cells different from the control gates of the selected memory cells starting from the control gates secondly next to the selected memory cell.
    • 一种非易失性存储器件的读取方法,包括分别包括一个浮动栅极和两个控制栅极的多个存储器单元,两个控制栅极分别与浮置栅极的两个交替侧相邻设置,并且两个相邻的存储单元共享一个 所述读取方法包括将读取电压施加到所选择的存储器单元的控制栅极,将第二通过电压施加到与所选择的存储器单元的控制栅极不同的存储单元的控制栅极的替代控制栅极,所述存储器单元从控制栅极开始, 所选择的存储单元,以及施加低于第二通过电压的第一通过电压,以从控制栅极开始的第二选择的存储单元开始,将不同于所选存储单元的控制栅极的存储单元的控制栅极交替 。
    • 10. 发明授权
    • Method for fabricating semiconductor memory device
    • 半导体存储器件的制造方法
    • US06524868B2
    • 2003-02-25
    • US09892537
    • 2001-06-28
    • Eun-Seok ChoiSeung-Jin Yeom
    • Eun-Seok ChoiSeung-Jin Yeom
    • H01L2100
    • H01L28/75H01L28/55H01L28/60
    • A semiconductor memory device is provided which prevents a lifting phenomenon by improving an adhesive strength between an upper electrode and an interlayer insulating layer. The semiconductor memory device includes a capacitor formed on a semiconductor substrate, wherein the capacitor includes a lower electrode, a dielectric layer and an upper electrode; an adhesion layer formed on the upper electrode; an interlayer insulating layer covering the capacitor, wherein a portion of the interlayer insulating layer is in contact with the adhesion layer; and a contact hole, formed within the interlayer insulating layer, whose bottom exposes the upper electrode and whose sidewalls expose the interlayer insulating layer and the adhesion layer.
    • 提供一种半导体存储器件,其通过提高上部电极和层间绝缘层之间的粘合强度来防止提升现象。 半导体存储器件包括形成在半导体衬底上的电容器,其中电容器包括下电极,电介质层和上电极; 形成在上电极上的粘附层; 覆盖电容器的层间绝缘层,其中层间绝缘层的一部分与粘合层接触; 以及形成在所述层间绝缘层内的接触孔,所述接触孔的底部暴露所述上部电极,并且其侧壁暴露所述层间绝缘层和所述粘合层。