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    • 2. 发明授权
    • Method of forming non-volatile memory having floating trap type device
    • 形成具有浮动陷阱型装置的非易失性存储器的方法
    • US06677200B2
    • 2004-01-13
    • US10194182
    • 2002-07-12
    • Chang-Hyun LeeJung-Dal ChoiSung-Hoi Hur
    • Chang-Hyun LeeJung-Dal ChoiSung-Hoi Hur
    • H01L213366
    • H01L29/792H01L21/28282H01L29/66833Y10S438/954
    • A method of forming a non-volatile memory having a floating trap-type device is disclosed in the present invention. In the method, a relatively thick thermal oxide layer is formed at a semiconductor substrate and patterned to leave a thick thermal oxide pattern at a high-voltage region (a high-voltage region defining step). An oxide-nitride-oxide (ONO) layer is formed over substantially the entire surface (the substantial surface) of the semiconductor substrate and patterned to leave an ONO pattern at a cell memory region (a cell memory region defining step). After the high-voltage region defining step and the cell memory region defining step, a thermal oxidizing process is performed with respect to the semiconductor substrate where a low-voltage region is exposed, thereby forming a relatively thin gate insulation layer for a low-voltage type device (a low-voltage region defining region).
    • 在本发明中公开了形成具有浮动陷阱型装置的非易失性存储器的方法。 在该方法中,在半导体衬底上形成相对较厚的热氧化物层,并将其图案化以在高电压区域(高电压区域限定步骤)处留下厚的热氧化物图案。 在半导体衬底的基本上整个表面(基本表面)上形成氧化物 - 氧化物(ONO)层,并将其图案化以在单元存储区(单元存储区定义步骤)处留下ONO图案。 在高电压区域定义步骤和电池存储区域限定步骤之后,对于暴露低电压区域的半导体衬底进行热氧化处理,从而形成用于低电压的较薄的栅极绝缘层 (低电压区域限定区域)。
    • 4. 发明授权
    • Method of fabricating cell of nonvolatile memory device with floating gate
    • 具有浮动栅极的非易失性存储器件单元制造方法
    • US07122426B2
    • 2006-10-17
    • US10788002
    • 2004-02-25
    • Chang-Hyun LeeKyu-Charn ParkJeong-Hyuk ChoiSung-Hoi Hur
    • Chang-Hyun LeeKyu-Charn ParkJeong-Hyuk ChoiSung-Hoi Hur
    • H01L21/8247
    • H01L27/11521H01L27/115H01L27/11519Y10S257/905
    • This disclosure provides cells of nonvolatile memory devices with floating gates and methods for fabricating the same. The cell of the nonvolatile memory device includes device isolation layers in parallel with each other on a predetermined region of a semiconductor substrate that define a plurality of active regions. Each device isolation layer has sidewalls that project over the semiconductor substrate. A plurality of word lines crosses over the device isolation layers. A tunnel oxide layer, a floating gate, a gate interlayer dielectric layer, and a control gate electrode are sequentially stacked between each active region and each word line. The floating gate and the control gate electrode have sidewalls that are self-aligned to the adjacent device isolation layers. The method for forming the self-aligned floating gate and the control gate electrode includes forming trenches in a semiconductor substrate to define a plurality of active regions and concurrently forming an oxide layer pattern, a floating gate pattern, a dielectric layer pattern and a control gate pattern that are sequentially stacked. A conductive layer is then formed on the device isolation layers and the control gate pattern. Thereafter, the conductive layer, the control gate pattern, the dielectric layer pattern, the floating gate pattern, and the oxide layer pattern are successively patterned.
    • 本公开提供具有浮动栅极的非易失性存储器件单元以及用于制造其的方法。 非易失性存储器件的单元包括在限定多个有源区域的半导体衬底的预定区域上彼此并联的器件隔离层。 每个器件隔离层具有突出在半导体衬底上的侧壁。 多个字线跨越器件隔离层。 隧道氧化物层,浮置栅极,栅极层间电介质层和控制栅极电极顺序堆叠在每个有源区域和每条字线之间。 浮栅和控制栅极具有与相邻器件隔离层自对准的侧壁。 形成自对准浮栅和控制栅极的方法包括在半导体衬底中形成沟槽以限定多个有源区并同时形成氧化物层图案,浮栅图案,电介质层图案和控制栅极 顺序堆叠的图案。 然后在器件隔离层和控制栅极图案上形成导电层。 此后,连续地形成导电层,控制栅极图案,电介质层图案,浮栅图案和氧化物层图案。
    • 5. 发明授权
    • Cells of nonvolatile memory device with high inter-layer dielectric constant
    • 具有高层间介电常数的非易失性存储器件的单元
    • US06903406B2
    • 2005-06-07
    • US10346957
    • 2003-01-17
    • Chang-Hyun LeeKyu-Charn ParkJeong-Hyuk ChoiSung-Hoi Hur
    • Chang-Hyun LeeKyu-Charn ParkJeong-Hyuk ChoiSung-Hoi Hur
    • H01L21/8247H01L27/115H01L29/788
    • H01L27/11521H01L27/115H01L27/11519Y10S257/905
    • This disclosure provides cells of nonvolatile memory devices with floating gates and methods for fabricating the same. The cell of the nonvolatile memory device includes device isolation layers in parallel with each other on a predetermined region of a semiconductor substrate that define a plurality of active regions. Each device isolation layer has sidewalls that project over the semiconductor substrate. A plurality of word lines crosses over the device isolation layers. A tunnel oxide layer, a floating gate, a gate interlayer dielectric layer, and a control gate electrode are sequentially stacked between each active region and each word line. The floating gate and the control gate electrode have sidewalls that are self-aligned to the adjacent device isolation layers. The method for forming the self-aligned floating gate and the control gate electrode includes forming trenches in a semiconductor substrate to define a plurality of active regions and concurrently forming an oxide layer pattern, a floating gate pattern, a dielectric layer pattern and a control gate pattern that are sequentially stacked. A conductive layer is then formed on the device isolation layers and the control gate pattern. Thereafter, the conductive layer, the control gate pattern, the dielectric layer pattern, the floating gate pattern, and the oxide layer pattern are successively patterned.
    • 本公开提供具有浮动栅极的非易失性存储器件单元以及用于制造其的方法。 非易失性存储器件的单元包括在限定多个有源区域的半导体衬底的预定区域上彼此并联的器件隔离层。 每个器件隔离层具有突出在半导体衬底上的侧壁。 多个字线跨越器件隔离层。 隧道氧化物层,浮置栅极,栅极层间电介质层和控制栅极电极顺序堆叠在每个有源区域和每条字线之间。 浮栅和控制栅极具有与相邻器件隔离层自对准的侧壁。 形成自对准浮栅和控制栅极的方法包括在半导体衬底中形成沟槽以限定多个有源区并同时形成氧化物层图案,浮栅图案,电介质层图案和控制栅极 顺序堆叠的图案。 然后在器件隔离层和控制栅极图案上形成导电层。 此后,连续地形成导电层,控制栅极图案,电介质层图案,浮栅图案和氧化物层图案。
    • 6. 发明授权
    • Method of fabricating cell of nonvolatile memory device with floating gate
    • 具有浮动栅极的非易失性存储器件单元制造方法
    • US07449763B2
    • 2008-11-11
    • US11530827
    • 2006-09-11
    • Chang-Hyun LeeKyu-Charn ParkJeong-Hyuk ChoiSung-Hoi Hur
    • Chang-Hyun LeeKyu-Charn ParkJeong-Hyuk ChoiSung-Hoi Hur
    • H01L29/00H01L29/76H01L29/94H01L31/062H01L31/113H01L31/119
    • H01L27/11521H01L27/115H01L27/11519Y10S257/905
    • This disclosure provides cells of nonvolatile memory devices with floating gates and methods for fabricating the same. The cell of the nonvolatile memory device includes device isolation layers in parallel with each other on a predetermined region of a semiconductor substrate that define a plurality of active regions. Each device isolation layer has sidewalls that project over the semiconductor substrate. A plurality of word lines crosses over the device isolation layers. A tunnel oxide layer, a floating gate, a gate interlayer dielectric layer, and a control gate electrode are sequentially stacked between each active region and each word line. The floating gate and the control gate electrode have sidewalls that are self-aligned to the adjacent device isolation layers. The method for forming the self-aligned floating gate and the control gate electrode includes forming trenches in a semiconductor substrate to define a plurality of active regions and concurrently forming an oxide layer pattern, a floating gate pattern, a dielectric layer pattern and a control gate pattern that are sequentially stacked. A conductive layer is then formed on the device isolation layers and the control gate pattern. Thereafter, the conductive layer, the control gate pattern, the dielectric layer pattern, the floating gate pattern, and the oxide layer pattern are successively patterned.
    • 本公开提供具有浮动栅极的非易失性存储器件单元以及用于制造其的方法。 非易失性存储器件的单元包括在限定多个有源区域的半导体衬底的预定区域上彼此并联的器件隔离层。 每个器件隔离层具有突出在半导体衬底上的侧壁。 多个字线跨越器件隔离层。 隧道氧化物层,浮置栅极,栅极层间电介质层和控制栅极电极顺序堆叠在每个有源区域和每条字线之间。 浮栅和控制栅极具有与相邻器件隔离层自对准的侧壁。 形成自对准浮栅和控制栅极的方法包括在半导体衬底中形成沟槽以限定多个有源区并同时形成氧化物层图案,浮栅图案,电介质层图案和控制栅极 顺序堆叠的图案。 然后在器件隔离层和控制栅极图案上形成导电层。 此后,连续地形成导电层,控制栅极图案,电介质层图案,浮栅图案和氧化物层图案。
    • 7. 发明授权
    • Nonvolatile memory devices
    • 非易失性存储器件
    • US08629489B2
    • 2014-01-14
    • US13357350
    • 2012-01-24
    • Chang-Hyun LeeJung-Dal Choi
    • Chang-Hyun LeeJung-Dal Choi
    • H01L29/76
    • H01L27/1052G11C16/0483H01L27/11521H01L27/11524
    • A nonvolatile memory device includes a string selection transistor, a plurality of memory cell transistors, and a ground selection transistor electrically connected in series to the string selection transistor and to the pluralities of memory cell transistors. First impurity layers are formed at boundaries of the channels and the source/drain regions of the memory cell transistors. The first impurity layers are doped with opposite conductivity type impurities relative to the source/drain regions of the memory cell transistors. Second impurity layers are formed at boundaries between a channel and a drain region of the string selection transistor and between a channel and a source region of the ground selection transistor. The second impurity layers are doped with the same conductivity type impurities as the first impurity layers and have a higher impurity concentration than the first impurity layers.
    • 非易失性存储器件包括串选择晶体管,多个存储单元晶体管和与串选择晶体管和多个存储单元晶体管串联电连接的接地选择晶体管。 在存储单元晶体管的沟道和源极/漏极区的边界处形成第一杂质层。 相对于存储单元晶体管的源/漏区,第一杂质层掺杂有相反导电类型的杂质。 第二杂质层形成在串选择晶体管的沟道和漏极区之间的边界处,并且在地选择晶体管的沟道和源极区之间形成。 第二杂质层掺杂有与第一杂质层相同的导电类型杂质,并且具有比第一杂质层更高的杂质浓度。
    • 9. 发明授权
    • Nonvolatile memory devices and methods of operating same to inhibit parasitic charge accumulation therein
    • 非易失性存储器件及其操作方法,以抑制其中的寄生电荷积聚
    • US07864582B2
    • 2011-01-04
    • US12191434
    • 2008-08-14
    • Chang-Hyun LeeJung-Dal ChoiYoung-Ho LimKang-Deog Suh
    • Chang-Hyun LeeJung-Dal ChoiYoung-Ho LimKang-Deog Suh
    • G11C16/06
    • G11C16/0483G11C16/16
    • Methods of operating a charge trap nonvolatile memory device include operations to erase a first string of nonvolatile memory cells by selectively erasing a first plurality of nonvolatile memory cells in the first string and then selectively erasing a second plurality of nonvolatile memory cells in the first string, which may be interleaved with the first plurality of nonvolatile memory cells. This operation to selectively erase the first plurality of nonvolatile memory cells may include erasing the first plurality of nonvolatile memory cells while simultaneously biasing the second plurality of nonvolatile memory cells in a blocking condition that inhibits erasure of the second plurality of nonvolatile memory cells. The operation to selectively erase the second plurality of nonvolatile memory cells may include erasing the second plurality of nonvolatile memory cells while simultaneously biasing the first plurality of nonvolatile memory cells in a blocking condition that inhibits erasure of the first plurality of nonvolatile memory cells.
    • 操作电荷阱非易失性存储装置的方法包括通过选择性地擦除第一串中的第一多个非易失性存储单元,然后选择性地擦除第一串中的第二多个非易失性存储单元来擦除第一串非易失性存储单元的操作, 其可以与第一多个非易失性存储器单元交错。 选择性地擦除第一多个非易失性存储单元的操作可以包括擦除第一多个非易失性存储单元,同时在禁止擦除第二多个非易失性存储单元的阻塞条件下同时偏置第二多个非易失性存储单元。 选择性地擦除第二多个非易失性存储单元的操作可以包括擦除第二多个非易失性存储单元,同时在禁止擦除第一多个非易失性存储单元的阻塞条件下同时偏置第一多个非易失性存储单元。
    • 10. 发明申请
    • Memory device and method of fabricating the same
    • 存储器件及其制造方法
    • US20100327371A1
    • 2010-12-30
    • US12805962
    • 2010-08-26
    • Chang-Hyun LeeJung-dal Choi
    • Chang-Hyun LeeJung-dal Choi
    • H01L27/088H01L21/8239
    • H01L27/115G11C16/0483H01L27/11521H01L27/11524H01L27/11568
    • A nonvolatile memory including a plurality of memory transistors in series, wherein source/drain and channel regions therebetween are of a first type and a select transistor, at each end of the plurality of memory transistors in series, wherein channels regions of each of the select transistors is of the first type. The first type may be n-type or p-type. The nonvolatile memory may further include a first dummy select transistor at one end of the plurality of memory transistors in series between one of the select transistors and the plurality of memory transistors in series and a second dummy select transistor at the other end of the plurality of memory transistors in series between the other select transistor and the plurality of memory transistors in series.
    • 一种非易失性存储器,包括串联的多个存储晶体管,其中在其间的源极/漏极和沟道区域是第一类型和选择晶体管,在多个存储晶体管的每个端部串联,其中每个选择的沟道区域 晶体管是第一类型。 第一种类型可以是n型或p型。 非易失性存储器还可以包括串联在选择晶体管之一和串联的多个存储晶体管之间的多个存储晶体管的一端的第一虚拟选择晶体管,以及多个存储晶体管的另一端的第二虚拟选择晶体管 串联在另一个选择晶体管和多个存储晶体管之间的存储晶体管。