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    • 2. 发明申请
    • Semiconductor Devices and Methods of Manufacturing the Same
    • 半导体器件及其制造方法
    • US20140264548A1
    • 2014-09-18
    • US14176332
    • 2014-02-10
    • Chang-Hyun LeeHyun-Jung KimDong-Hoon JangAlbert Fayrushin
    • Chang-Hyun LeeHyun-Jung KimDong-Hoon JangAlbert Fayrushin
    • H01L27/115
    • H01L27/11582H01L21/76224H01L27/11551H01L27/11565H01L29/7889
    • A memory device may include a plurality of semiconductor patterns on a substrate including a plurality of first impurity regions doped at a first impurity concentration, a plurality of second impurity regions at portions of the substrate contacting the plurality of semiconductor patterns and doped at a second impurity concentration, a plurality of channel patterns on the plurality of semiconductor patterns, a plurality of gate structures, a plurality of third impurity regions at portions of the substrate adjacent to end portions of the plurality of gate structures, and a plurality of fourth impurity regions at portions of the substrate between the second and third impurity regions and between adjacent second impurity regions. The plurality of fourth impurity regions may be doped at a third impurity concentration which may be lower than the first and second impurity concentrations.
    • 存储器件可以包括在衬底上的多个半导体图案,其包括以第一杂质浓度掺杂的多个第一杂质区域,在与多个半导体图案接触并且以第二杂质掺杂的衬底的部分处的多个第二杂质区域 浓度,多个半导体图案上的多个沟道图案,多个栅极结构,在与多个栅极结构的端部相邻的基板的部分处的多个第三杂质区域,以及多个第四杂质区域 在第二和第三杂质区之间和相邻的第二杂质区之间的衬底的部分。 可以在可以低于第一和第二杂质浓度的第三杂质浓度下掺杂多个第四杂质区域。
    • 3. 发明授权
    • Nonvolatile memory devices
    • 非易失性存储器件
    • US08629489B2
    • 2014-01-14
    • US13357350
    • 2012-01-24
    • Chang-Hyun LeeJung-Dal Choi
    • Chang-Hyun LeeJung-Dal Choi
    • H01L29/76
    • H01L27/1052G11C16/0483H01L27/11521H01L27/11524
    • A nonvolatile memory device includes a string selection transistor, a plurality of memory cell transistors, and a ground selection transistor electrically connected in series to the string selection transistor and to the pluralities of memory cell transistors. First impurity layers are formed at boundaries of the channels and the source/drain regions of the memory cell transistors. The first impurity layers are doped with opposite conductivity type impurities relative to the source/drain regions of the memory cell transistors. Second impurity layers are formed at boundaries between a channel and a drain region of the string selection transistor and between a channel and a source region of the ground selection transistor. The second impurity layers are doped with the same conductivity type impurities as the first impurity layers and have a higher impurity concentration than the first impurity layers.
    • 非易失性存储器件包括串选择晶体管,多个存储单元晶体管和与串选择晶体管和多个存储单元晶体管串联电连接的接地选择晶体管。 在存储单元晶体管的沟道和源极/漏极区的边界处形成第一杂质层。 相对于存储单元晶体管的源/漏区,第一杂质层掺杂有相反导电类型的杂质。 第二杂质层形成在串选择晶体管的沟道和漏极区之间的边界处,并且在地选择晶体管的沟道和源极区之间形成。 第二杂质层掺杂有与第一杂质层相同的导电类型杂质,并且具有比第一杂质层更高的杂质浓度。
    • 9. 发明授权
    • Nonvolatile memory devices and methods of operating same to inhibit parasitic charge accumulation therein
    • 非易失性存储器件及其操作方法,以抑制其中的寄生电荷积聚
    • US07864582B2
    • 2011-01-04
    • US12191434
    • 2008-08-14
    • Chang-Hyun LeeJung-Dal ChoiYoung-Ho LimKang-Deog Suh
    • Chang-Hyun LeeJung-Dal ChoiYoung-Ho LimKang-Deog Suh
    • G11C16/06
    • G11C16/0483G11C16/16
    • Methods of operating a charge trap nonvolatile memory device include operations to erase a first string of nonvolatile memory cells by selectively erasing a first plurality of nonvolatile memory cells in the first string and then selectively erasing a second plurality of nonvolatile memory cells in the first string, which may be interleaved with the first plurality of nonvolatile memory cells. This operation to selectively erase the first plurality of nonvolatile memory cells may include erasing the first plurality of nonvolatile memory cells while simultaneously biasing the second plurality of nonvolatile memory cells in a blocking condition that inhibits erasure of the second plurality of nonvolatile memory cells. The operation to selectively erase the second plurality of nonvolatile memory cells may include erasing the second plurality of nonvolatile memory cells while simultaneously biasing the first plurality of nonvolatile memory cells in a blocking condition that inhibits erasure of the first plurality of nonvolatile memory cells.
    • 操作电荷阱非易失性存储装置的方法包括通过选择性地擦除第一串中的第一多个非易失性存储单元,然后选择性地擦除第一串中的第二多个非易失性存储单元来擦除第一串非易失性存储单元的操作, 其可以与第一多个非易失性存储器单元交错。 选择性地擦除第一多个非易失性存储单元的操作可以包括擦除第一多个非易失性存储单元,同时在禁止擦除第二多个非易失性存储单元的阻塞条件下同时偏置第二多个非易失性存储单元。 选择性地擦除第二多个非易失性存储单元的操作可以包括擦除第二多个非易失性存储单元,同时在禁止擦除第一多个非易失性存储单元的阻塞条件下同时偏置第一多个非易失性存储单元。
    • 10. 发明申请
    • Memory device and method of fabricating the same
    • 存储器件及其制造方法
    • US20100327371A1
    • 2010-12-30
    • US12805962
    • 2010-08-26
    • Chang-Hyun LeeJung-dal Choi
    • Chang-Hyun LeeJung-dal Choi
    • H01L27/088H01L21/8239
    • H01L27/115G11C16/0483H01L27/11521H01L27/11524H01L27/11568
    • A nonvolatile memory including a plurality of memory transistors in series, wherein source/drain and channel regions therebetween are of a first type and a select transistor, at each end of the plurality of memory transistors in series, wherein channels regions of each of the select transistors is of the first type. The first type may be n-type or p-type. The nonvolatile memory may further include a first dummy select transistor at one end of the plurality of memory transistors in series between one of the select transistors and the plurality of memory transistors in series and a second dummy select transistor at the other end of the plurality of memory transistors in series between the other select transistor and the plurality of memory transistors in series.
    • 一种非易失性存储器,包括串联的多个存储晶体管,其中在其间的源极/漏极和沟道区域是第一类型和选择晶体管,在多个存储晶体管的每个端部串联,其中每个选择的沟道区域 晶体管是第一类型。 第一种类型可以是n型或p型。 非易失性存储器还可以包括串联在选择晶体管之一和串联的多个存储晶体管之间的多个存储晶体管的一端的第一虚拟选择晶体管,以及多个存储晶体管的另一端的第二虚拟选择晶体管 串联在另一个选择晶体管和多个存储晶体管之间的存储晶体管。