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1. 发明授权

US08487257B2 Device with a sandwich structure for detecting thermal radiation, and method for the production thereof 有权
标题翻译：具有用于检测热辐射的夹层结构的装置及其制造方法
公开(公告)号：US08487257B2
公开(公告)日：2013-07-16
申请号：US12601613
申请日：2008-05-28
申请人： Carsten Giebeler , Matthias Schreiter , Jörg Zapf
发明人： Carsten Giebeler , Matthias Schreiter , Jörg Zapf
IPC分类号： G01J5/00
CPC分类号： H01L27/16 , G01J5/04 , G01J5/045 , G01J5/10 , G01J5/34 , H01L27/14618 , H01L2924/0002 , H01L2924/00
摘要： In a device for the detection of thermal radiation and a method for production of such a device, a stack is formed with a detector support having a detector element for converting the thermal radiation into an electric signal, a circuit support with a read-out circuit for reading out the electrical signal and a cover to shield the detector element. The detector support and the cover are so arranged that a first stack cavity is formed between the detector element and the cover and a second stack cavity is formed between detector support and the circuit support. The first stack cavity and/or the second stack cavity is evacuated and hermetically sealed. In the manufacturing operation, functionalized silicon-substrates are stacked upon one another, firmly bonded together and subsequently sub-divided. Preferably, the detector elements are pyro-electric detector elements. The device finds application in motion detectors, presence reporters and thermal-image cameras.
摘要翻译：在用于检测热辐射的装置和用于生产这种装置的方法中，叠层形成有具有用于将热辐射转换成电信号的检测器元件的检测器支架，具有读出电路的电路支架用于读出电信号和盖以屏蔽检测器元件。检测器支架和盖被布置成使得在检测器元件和盖之间形成第一堆叠空腔，并且在检测器支架和电路支架之间形成第二堆叠腔。将第一堆叠空腔和/或第二堆叠空腔抽真空并密封。在制造操作中，将功能化的硅衬底彼此堆叠，牢固地结合在一起并随后进行细分。优选地，检测器元件是热电探测器元件。该设备在运动检测器，存在记录器和热像摄像机中找到应用。

2. 发明申请

US20100264311A1 DEVICE WITH A SANDWICH STRUCTURE FOR DETECTING THERMAL RADIATION, AND METHOD FOR THE PRODUCTION THEREOF 有权
标题翻译：具有用于检测热辐射的三面体结构的装置及其生产方法
公开(公告)号：US20100264311A1
公开(公告)日：2010-10-21
申请号：US12601613
申请日：2008-05-28
申请人： Carsten Giebeler , Matthias Schreiter , Jörg Zapf
发明人： Carsten Giebeler , Matthias Schreiter , Jörg Zapf
IPC分类号： G01J5/10 , H01L21/02
CPC分类号： H01L27/16 , G01J5/04 , G01J5/045 , G01J5/10 , G01J5/34 , H01L27/14618 , H01L2924/0002 , H01L2924/00
摘要： In a device for the detection of thermal radiation which and a method for production of such a device, a stack is formed with at least one detector support having at least one detector element for the conversion of the thermal radiation into an electric signal, at least one circuit support with at least one read-out circuit for reading out the electrical signal and at least one cover to shield the detector element, wherein the detector support and the cover are so arranged with respect to one another that a first stack cavity bounded by the detector support and the cover is provided between the detector element of the detector support and the cover and that the circuit support and the detector support are so arranged with respect to one another that at least one second stack cavity bounded by the circuit support and the detector support is provided between detector support and the circuit support and that the first hollow stack support and/or the second stack cavity is evacuated or can be evacuated. Preferably, the detector support, circuit support and cover are made of silicon. The manufacturing operation takes place at wafer-level. Functionalized silicon-substrates are stacked upon one another, firmly bonded together and subsequently sub-divided. Preferably, the detector elements are pyro-electric detector elements. The device finds application in motion detector, presence reporters and thermal-image cameras.
摘要翻译：在用于检测热辐射的装置及其制造方法中，堆叠形成有至少一个具有至少一个用于将热辐射转换成电信号的检测器元件的检测器支架，至少一个电路支撑件，具有用于读出电信号的至少一个读出电路和用于屏蔽检测器元件的至少一个盖子，其中检测器支撑件和盖子相对于彼此布置成使得第一堆叠腔体被检测器支撑件和盖被设置在检测器支撑件的检测器元件和盖之间，并且电路支撑件和检测器支撑件相对于彼此布置成使得由电路支撑件限定的至少一个第二堆叠空腔和检测器支撑件设置在检测器支撑件和电路支撑件之间，并且第一中空堆叠支撑件和/或第二堆叠腔体被抽空或可以被疏散优选地，检测器支撑件，电路支撑件和盖子由硅制成。制造操作在晶圆级进行。功能化的硅衬底彼此堆叠，牢固地结合在一起并随后被细分。优选地，检测器元件是热电探测器元件。该装置在运动检测器，存在记录器和热像摄像机中找到应用。

3. 发明申请

US20120249148A1 MAGNETIC RESONANCE LOCAL COIL 有权
标题翻译：磁共振本地线圈
公开(公告)号：US20120249148A1
公开(公告)日：2012-10-04
申请号：US13436576
申请日：2012-03-30
申请人： Daniel Evers , Klaus Huber , Florian Poprawa , Christina Schindler , Markus Vester , Jörg Zapf
发明人： Daniel Evers , Klaus Huber , Florian Poprawa , Christina Schindler , Markus Vester , Jörg Zapf
IPC分类号： G01R33/34 , H01F41/04
CPC分类号： G01R33/422 , G01R33/3415 , G01R33/3621 , G01R33/3692
摘要： The present embodiments relate to a magnetic resonance local coil with a receive antenna for receiving magnetic resonance signals. The magnetic resonance local coil also includes a transmission unit for transmitting magnetic resonance signal data generated on the basis of the magnetic resonance signals via a data transmit antenna of the magnetic resonance local coil to a signal data receiving unit of a magnetic resonance tomography systems. The transmission unit is provided, at least in sections, with screening with a first metal coating and a first dielectric coating.
摘要翻译：本实施例涉及具有用于接收磁共振信号的接收天线的磁共振局部线圈。磁共振局部线圈还包括传输单元，用于将通过磁共振局部线圈的数据发射天线的磁共振信号产生的磁共振信号数据发送到磁共振断层摄影系统的信号数据接收单元。传动单元至少在分段上设置有第一金属涂层和第一介电涂层的筛选。

4. 发明授权

US07851978B2 Piezo actuator comprising a multilayer encapsulation, and method for the production thereof 有权
标题翻译：包括多层封装的压电致动器及其制造方法
公开(公告)号：US07851978B2
公开(公告)日：2010-12-14
申请号：US12298096
申请日：2007-04-24
申请人： Heiner Bayer , Hellmut Freudenberg , Axel Ganster , Christoph Hamann , Oliver Hennig , Jens Dahl Jensen , Günter Lugert , Randolf Mock , Carsten Schuh , Jörg Zapf
发明人： Heiner Bayer , Hellmut Freudenberg , Axel Ganster , Christoph Hamann , Oliver Hennig , Jens Dahl Jensen , Günter Lugert , Randolf Mock , Carsten Schuh , Jörg Zapf
IPC分类号： H01L41/083
CPC分类号： H01L41/23 , H01L41/0533 , H01L41/083 , Y10T29/42
摘要： In a method for producing a multilayer encapsulation (1) of a piezo actuator (5) such that the piezo actuator (5) is protected towards the outside without having to use an additional enveloping housing-type structure, in order to produce the multilayer encapsulation (1), an electrically insulating elastic layer (10) is first applied to the surface of the piezo actuator (5), whereupon a metallic layer is applied to the electrically insulating elastic layer (10) so as to planarly cover the same.
摘要翻译：在制造压电致动器（5）的多层封装（1）的方法中，使得压电致动器（5）被保护以朝向外部而不必使用附加的包封外壳型结构，以便产生多层封装（1）中，首先将电绝缘弹性层（10）施加到压电致动器（5）的表面，由此将金属层施加到电绝缘弹性层（10）上以平面地覆盖该电绝缘弹性层。

5. 发明申请

US20090320255A1 PIEZOCERAMIC MULTILAYER ACTUATOR AND METHOD FOR THE PRODUCTION THEREOF 有权
标题翻译： PIEZOCERAMIC MULTILAYER执行器及其生产方法
公开(公告)号：US20090320255A1
公开(公告)日：2009-12-31
申请号：US12524549
申请日：2008-01-15
申请人： Axel Ganster , Susanne Kornely , Andreas Lenk , Andreas Mantovan , Carsten Schuh , Jörg Zapf
发明人： Axel Ganster , Susanne Kornely , Andreas Lenk , Andreas Mantovan , Carsten Schuh , Jörg Zapf
IPC分类号： H01L41/24 , H01L41/083
CPC分类号： H01L41/273 , H01L41/293 , Y10T29/42 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49163
摘要： According to various production methods for producing a piezoceramic multilayer actuator, in the course of the production method, multilayer locks (10) are electrochemically or mechanically processed in such a way that a recess structure is obtained. The lateral surfaces (22; 24) of the electrodes (20) inside these recesses are electrically insulated using the slip casting method in order to be able to contact the remaining electrodes by imprinting an outer metallization.
摘要翻译：根据制造压电陶瓷多层致动器的各种制造方法，在制造方法的过程中，以获得凹部结构的方式对多层锁（10）进行电化学或机械加工。这些凹部内的电极（20）的侧面（22; 24）使用滑移浇铸法电绝缘，以便能够通过印刷外部金属化而接触剩余的电极。

6. 发明授权

US09134390B2 Magnetic resonance local coil 有权
标题翻译：磁共振局部线圈
公开(公告)号：US09134390B2
公开(公告)日：2015-09-15
申请号：US13436576
申请日：2012-03-30
申请人： Daniel Evers , Klaus Huber , Florian Poprawa , Christina Schindler , Markus Vester , Jörg Zapf
发明人： Daniel Evers , Klaus Huber , Florian Poprawa , Christina Schindler , Markus Vester , Jörg Zapf
IPC分类号： G01V3/00 , G01R33/422 , G01R33/3415 , G01R33/36
CPC分类号： G01R33/422 , G01R33/3415 , G01R33/3621 , G01R33/3692
摘要： The present embodiments relate to a magnetic resonance local coil with a receive antenna for receiving magnetic resonance signals. The magnetic resonance local coil also includes a transmission unit for transmitting magnetic resonance signal data generated on the basis of the magnetic resonance signals via a data transmit antenna of the magnetic resonance local coil to a signal data receiving unit of a magnetic resonance tomography systems. The transmission unit is provided, at least in sections, with screening with a first metal coating and a first dielectric coating.
摘要翻译：本实施例涉及具有用于接收磁共振信号的接收天线的磁共振局部线圈。磁共振局部线圈还包括传输单元，用于将通过磁共振局部线圈的数据发射天线的磁共振信号产生的磁共振信号数据发送到磁共振断层摄影系统的信号数据接收单元。传动单元至少在分段上设置有第一金属涂层和第一介电涂层的筛选。

7. 发明授权

US08261439B2 Method for contacting electronic components by means of a substrate plate 失效
标题翻译：通过基板接触电子部件的方法
公开(公告)号：US08261439B2
公开(公告)日：2012-09-11
申请号：US12733507
申请日：2008-08-04
申请人： Axel Kaltenbacher , Michael Kaspar , Gernot Schimetta , Karl Weidner , Robert Weinke , Jörg Zapf
发明人： Axel Kaltenbacher , Michael Kaspar , Gernot Schimetta , Karl Weidner , Robert Weinke , Jörg Zapf
IPC分类号： H01R43/00
CPC分类号： H01L24/33 , H01L23/3735 , H01L23/49562 , H01L23/5389 , H01L24/18 , H01L24/36 , H01L24/40 , H01L24/73 , H01L24/82 , H01L24/83 , H01L25/072 , H01L2224/18 , H01L2224/82039 , H01L2224/83801 , H01L2224/84801 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/15747 , H01L2924/15787 , H01L2924/30107 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49169 , H01L2924/00 , H01L2924/00014
摘要： One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part.
摘要翻译：一个未安置的电子部件，例如半导体功率部件，具有设置在顶侧和/或底侧上的用于紧固和/或电接触的至少一个连接表面。部件的一侧在连接表面的区域中的相对的连接表面处附接到和/或电接触直接铜结合陶瓷基板。在基板上在连接表面的区域外侧面向组件的一侧上形成电绝缘载体膜，并延伸超过底侧。导电导体部分附接到和/或电接触顶侧上的连接表面。形成延伸超过顶侧区域的预先形成的三维结构，从而在载体膜和导体部分的三维结构之间形成电绝缘物质。

8. 发明授权

US07855451B2 Device having a contacting structure 有权
标题翻译：具有接触结构的装置
公开(公告)号：US07855451B2
公开(公告)日：2010-12-21
申请号：US11728900
申请日：2007-03-27
申请人： Norbert Seliger , Karl Weidner , Jörg Zapf
发明人： Norbert Seliger , Karl Weidner , Jörg Zapf
IPC分类号： H01L23/48 , H01L23/52 , H01L23/12 , H01L23/14
CPC分类号： H01L24/82 , H01L23/5389 , H01L24/24 , H01L25/072 , H01L2224/2402 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/45015 , H01L2224/45124 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/15787 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01L2224/48 , H01L2924/00 , H01L2924/2076 , H01L2924/01004 , H01L2924/00015
摘要： A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.
摘要翻译：将一层电绝缘材料施加到基板和位于其上的部件，使得所述层遵循表面轮廓。

9. 发明申请

US20100208438A1 Method for the Production and Contacting of Electronic Components by Means of a Substrate Plate, Particularly a DCB Ceramic Substrate Plate 失效
标题翻译：电子部件通过基板，特别是DCB陶瓷基板的生产和接触的方法
公开(公告)号：US20100208438A1
公开(公告)日：2010-08-19
申请号：US12733507
申请日：2008-08-04
申请人： Axel Kaltenbacher , Michael Kaspar , Gernot Schimetta , Karl Weidner , Robert Weinke , Jörg Zapf
发明人： Axel Kaltenbacher , Michael Kaspar , Gernot Schimetta , Karl Weidner , Robert Weinke , Jörg Zapf
IPC分类号： H05K7/02 , H05K13/00
CPC分类号： H01L24/33 , H01L23/3735 , H01L23/49562 , H01L23/5389 , H01L24/18 , H01L24/36 , H01L24/40 , H01L24/73 , H01L24/82 , H01L24/83 , H01L25/072 , H01L2224/18 , H01L2224/82039 , H01L2224/83801 , H01L2224/84801 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/15747 , H01L2924/15787 , H01L2924/30107 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49169 , H01L2924/00 , H01L2924/00014
摘要： One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part.
摘要翻译：一个未安置的电子部件，例如半导体功率部件，具有设置在顶侧和/或底侧上的用于紧固和/或电接触的至少一个连接表面。部件的一侧在连接表面的区域中的相对的连接表面处附接到和/或电接触直接铜结合陶瓷基板。在基板上在连接表面的区域外侧面向组件的一侧上形成电绝缘载体膜，并延伸超过底侧。导电导体部分附接到和/或电接触顶侧上的连接表面。形成延伸超过顶侧区域的预先形成的三维结构，从而在载体膜和导体部分的三维结构之间形成电绝缘物质。

10. 发明授权

US07483275B2 Electronic unit, circuit design for the same, and production method 失效
标题翻译：电子单元，电路设计相同，生产方法
公开(公告)号：US07483275B2
公开(公告)日：2009-01-27
申请号：US10492923
申请日：2002-09-06
申请人： Wolfgang Clemens , Walter Fix , Jörg Zapf
发明人： Wolfgang Clemens , Walter Fix , Jörg Zapf
IPC分类号： H05K7/02 , H05K7/06 , H05K7/08 , H05K7/10
CPC分类号： H01L27/28 , H01L25/16 , H01L51/0508 , H01L2223/6677 , H01L2924/0002 , H01L2924/00
摘要： A method for the production of an encapsulated and at least partly organic electronic device wherein the device comprises a combination of three groups of different electronic units or components which may be separate discrete structures arranged to be produced independently from one another electrically conductively interconnected, the groups including inorganic units, passive units and active units or active components such as antennae, diodes (rectifier diodes and/or light-emitting diodes), some of which units may be organic, e.g., organic transistors, and so on, and forming a resulting optimized circuit. The components of the three groups of units forming the resulting circuit are combined on a one piece flexible substrate film which can also serve as an encapsulation layer for the device.
摘要翻译：一种用于生产封装的和至少部分有机的电子器件的方法，其中所述器件包括三组不同的电子单元或组件的组合，所述三组不同的电子单元或组件可以是分离的离散结构，其被布置成彼此独立地被电连接，组包括无机单元，无源单元和有源单元或诸如天线，二极管（整流二极管和/或发光二极管）的有源组件，其中一些单元可以是有机的，例如有机晶体管等，并且形成所得的优化电路。形成所得电路的三组单元的组件组合在一体的柔性基底膜上，该薄膜也可以用作该装置的封装层。

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