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1. 发明申请

US20120075826A1 PRESSURE SUPPORT FOR AN ELECTRONIC CIRCUIT 审中-公开
标题翻译：压力支持电子电路
公开(公告)号：US20120075826A1
公开(公告)日：2012-03-29
申请号：US13262582
申请日：2010-03-30
申请人： Michael Kaspar , Herbert Schwarzbauer , Norbert Seliger
发明人： Michael Kaspar , Herbert Schwarzbauer , Norbert Seliger
IPC分类号： H05K7/02
CPC分类号： H01L24/72 , H01L24/24 , H01L24/25 , H01L24/29 , H01L24/82 , H01L25/072 , H01L2224/24011 , H01L2224/2402 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/291 , H01L2224/29191 , H01L2224/32225 , H01L2224/45147 , H01L2224/73267 , H01L2224/82039 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/13055 , H01L2924/15787 , H01L2924/0715 , H01L2924/3512 , H01L2924/00 , H01L2224/48 , H01L2924/01004
摘要： A circuit design includes an electrical circuit, which has at least one electronic component attached to a substrate and a flat conductor track electrically contacting the component. An elastic element is provided on the electrical circuit and a device applies a force to the elastic element so that the elastic element is pressed onto the electrical circuit. Thus, crack formation in a solder under the component is prevented.
摘要翻译：电路设计包括电路，其具有附接到基板的至少一个电子部件和与部件电接触的扁平导体轨迹。弹性元件设置在电路上，并且设备向弹性元件施加力，使得弹性元件被按压到电路上。因此，防止了部件下的焊料中的裂纹形成。

2. 发明授权

US07427532B2 Method of manufacturing a device having a contacting structure 有权
标题翻译：制造具有接触结构的装置的方法
公开(公告)号：US07427532B2
公开(公告)日：2008-09-23
申请号：US10547119
申请日：2004-01-23
申请人： Norbert Seliger , Karl Weidner , Jörg Zapf
发明人： Norbert Seliger , Karl Weidner , Jörg Zapf
IPC分类号： H01L21/50 , H01L21/48
CPC分类号： H01L23/3735 , H01L24/24 , H01L24/82 , H01L2224/24011 , H01L2224/2402 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/45124 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01058 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/157 , H01L2924/15787 , H01L2924/15798 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2224/48
摘要： According to the invention, a layer made of an electrically insulating material is applied to a substrate and a component that is arranged thereupon in such way that said layer follows the surface contour formed by the substrate and the component.
摘要翻译：根据本发明，将由电绝缘材料制成的层施加到基板和其上配置的部件，使得所述层遵循由基板和部件形成的表面轮廓。

3. 发明授权

US07208347B2 Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours 有权
标题翻译：功率半导体的连接技术包括一层遵循表面轮廓的电绝缘材料
公开(公告)号：US07208347B2
公开(公告)日：2007-04-24
申请号：US10547173
申请日：2004-01-26
申请人： Norbert Seliger , Karl Weidner , Jörg Zapf
发明人： Norbert Seliger , Karl Weidner , Jörg Zapf
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/82 , H01L23/5389 , H01L24/24 , H01L25/072 , H01L2224/2402 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/45015 , H01L2224/45124 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/15787 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01L2224/48 , H01L2924/00 , H01L2924/2076 , H01L2924/01004 , H01L2924/00015
摘要： A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.
摘要翻译：将一层电绝缘材料施加到基板和位于其上的部件，使得所述层遵循表面轮廓。

4. 发明申请

US20060252253A1 Internal connection system for power semiconductors comprising large-area terminals 有权
标题翻译：包括大面积终端的功率半导体内部连接系统
公开(公告)号：US20060252253A1
公开(公告)日：2006-11-09
申请号：US10547119
申请日：2004-01-23
申请人： Norbert Seliger , Karl Weidner , Jörg Zapf
发明人： Norbert Seliger , Karl Weidner , Jörg Zapf
IPC分类号： H01L21/4763
CPC分类号： H01L23/3735 , H01L24/24 , H01L24/82 , H01L2224/24011 , H01L2224/2402 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/45124 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01058 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/157 , H01L2924/15787 , H01L2924/15798 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2224/48
摘要： According to the invention, a layer made of an electrically insulating material is applied to a substrate and a component that is arranged thereupon in such way that said layer follows the surface contour formed by the substrate and the component.
摘要翻译：根据本发明，将由电绝缘材料制成的层施加到基板和其上布置的部件，使得所述层遵循由基板和部件形成的表面轮廓。

5. 发明授权

US08531231B2 Switching device and switching arrangements for switching at high operating voltage 失效
标题翻译：用于在高工作电压下切换的开关装置和开关装置
公开(公告)号：US08531231B2
公开(公告)日：2013-09-10
申请号：US12509933
申请日：2009-07-27
申请人： Thomas Komma , Norbert Seliger
发明人： Thomas Komma , Norbert Seliger
IPC分类号： H03K17/04
CPC分类号： H03K17/785 , H03K17/10 , H03K17/102 , H03K17/795
摘要： A switching device for switching a high operating voltage is described. The switching device-includes a first switching arrangement with a first self-conducting switching element), which has a control connector and a first and second main connector for forming a switching section. The switching device may include a second switching arrangement having a first and a second connector for forming a switching section, which is wired serially in respect to the switching section of the first switching arrangement. The second switching arrangement includes an optically triggerable switching element for switching the switching section of the second switching arrangement so it becomes conductive. The second connector of the second switching arrangement is connected with the control connector of the first self-conducting switching element.
摘要翻译：描述用于切换高工作电压的开关装置。开关装置 - 包括具有第一自导电开关元件的第一开关装置），其具有控制连接器和用于形成开关部分的第一和第二主连接器。开关装置可以包括第二开关装置，其具有第一和第二连接器，用于形成相对于第一开关装置的开关部分串联连接的开关部分。第二开关装置包括用于切换第二开关装置的开关部分使其变为导通的光学可触发开关元件。第二开关装置的第二连接器与第一自导电开关元件的控制连接器连接。

6. 发明申请

US20100026371A1 SWITCHING DEVICE AND SWITCHING ARRANGEMENTS FOR SWITCHING AT HIGH OPERATING VOLTAGE 失效
标题翻译：高电压开关切换装置和切换装置
公开(公告)号：US20100026371A1
公开(公告)日：2010-02-04
申请号：US12509933
申请日：2009-07-27
申请人： Thomas Komma , Norbert Seliger
发明人： Thomas Komma , Norbert Seliger
IPC分类号： H03K17/687
CPC分类号： H03K17/785 , H03K17/10 , H03K17/102 , H03K17/795
摘要： A switching device for switching a high operating voltage is described. The switching device-includes a first switching arrangement with a first self-conducting switching element), which has a control connector and a first and second main connector for forming a switching section. The switching device may include a second switching arrangement having a first and a second connector for forming a switching section, which is wired serially in respect to the switching section of the first switching arrangement. The second switching arrangement includes an optically triggerable switching element for switching the switching section of the second switching arrangement so it becomes conductive. The second connector of the second switching arrangement is connected with the control connector of the first self-conducting switching element.
摘要翻译：描述用于切换高工作电压的开关装置。开关装置 - 包括具有第一自导电开关元件的第一开关装置），其具有控制连接器和用于形成开关部分的第一和第二主连接器。开关装置可以包括具有第一和第二连接器的第二开关装置，用于形成相对于第一开关装置的开关部分串联连接的开关部分。第二开关装置包括用于切换第二开关装置的开关部分使其变为导通的光学可触发开关元件。第二开关装置的第二连接器与第一自导电开关元件的控制连接器连接。

7. 发明授权

US06668667B2 Arrangement for subjecting a bonding wire to a mechanical load 失效
标题翻译：对接合线进行机械载荷的布置
公开(公告)号：US06668667B2
公开(公告)日：2003-12-30
申请号：US10240246
申请日：2002-09-30
申请人： Norbert Seliger
发明人： Norbert Seliger
IPC分类号： G01L504
CPC分类号： B23K20/10 , H01L2224/859
摘要： An arrangement in which a first contact surface (2) for bonding one end (51) of the bonding wire (5) and a piezoelectric actuator (3) are fixed on a support body (1) and a second contact surface (4) for bonding another end (52) of the bonding wire (5) is fixed to the actuator by an unsupported support body (34). The second contact surface moves back and forth in relation to the support body by means of an actuator, at a frequency of between 0.1 Hz and a few KHz and in one or more directions (31, 31′, 31″). The arrangement is suitable for use in testing the endurance of bonding wire connections.
摘要翻译：一种用于将接合线（5）的一端（51）和压电致动器（3）接合的第一接触表面（2）固定在支撑体（1）和第二接触表面（4）上的布置接合线（5）的另一端（52）通过未支撑的支撑体（34）固定到致动器。第二接触表面通过致动器相对于支撑体来回移动，频率为0.1Hz至几KHz，并且在一个或多个方向（31,31'，31“）上。该布置适用于测试接合线连接的耐久性。

8. 发明授权

US07855451B2 Device having a contacting structure 有权
标题翻译：具有接触结构的装置
公开(公告)号：US07855451B2
公开(公告)日：2010-12-21
申请号：US11728900
申请日：2007-03-27
申请人： Norbert Seliger , Karl Weidner , Jörg Zapf
发明人： Norbert Seliger , Karl Weidner , Jörg Zapf
IPC分类号： H01L23/48 , H01L23/52 , H01L23/12 , H01L23/14
CPC分类号： H01L24/82 , H01L23/5389 , H01L24/24 , H01L25/072 , H01L2224/2402 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/45015 , H01L2224/45124 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/15787 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01L2224/48 , H01L2924/00 , H01L2924/2076 , H01L2924/01004 , H01L2924/00015
摘要： A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.
摘要翻译：将一层电绝缘材料施加到基板和位于其上的部件，使得所述层遵循表面轮廓。

9. 发明申请

US20050032347A1 Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces 有权
标题翻译：用于接触基底和由具有电接触表面的基底组成的装置的电接触表面的方法
公开(公告)号：US20050032347A1
公开(公告)日：2005-02-10
申请号：US10491137
申请日：2001-09-25
申请人： Kerstin Hase , Laurence Amigues , Herbert Schwarzbauer , Norbert Seliger , Karl Weidner , Jorg Zapf , Matthias Rebhan
发明人： Kerstin Hase , Laurence Amigues , Herbert Schwarzbauer , Norbert Seliger , Karl Weidner , Jorg Zapf , Matthias Rebhan
IPC分类号： H01L23/051 , H01L23/373 , H01L23/482 , H01L25/07 , H01L25/18 , H05K1/03 , H05K3/10 , H05K3/32 , H05K3/46 , H01L21/44 , H01L21/4763
CPC分类号： H05K3/4605 , H01L23/051 , H01L23/3735 , H01L23/482 , H01L24/24 , H01L24/82 , H01L25/072 , H01L2224/2402 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/45124 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01058 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H05K1/0306 , H05K3/108 , H05K3/32 , H05K3/4632 , H05K2201/0129 , H05K2201/0154 , H05K2203/068 , H05K2203/085 , H05K2203/1469 , H01L2924/00 , H01L2224/48
摘要： A film, based on polyimide or epoxy, is laminated onto a surface of a substrate under a vacuum, so that the film closely covers the surface and adheres thereto. Contact surfaces to be formed on the surface are uncovered by opening windows in the film. A contact is established in a plane manner between each uncovered contact surface and a layer of metal. This establishes a large-surface contact providing high current density for power semiconductor chips.
摘要翻译：将基于聚酰亚胺或环氧树脂的薄膜在真空下层压到基材的表面上，使得薄膜紧密地覆盖表面并附着在其上。在表面上形成的接触表面通过打开薄膜中的窗口而被覆盖。在每个未覆盖的接触表面和一层金属之间以平面方式建立接触。这就形成了大面积接触，为功率半导体芯片提供高电流密度。

10. 发明授权

US08441114B2 Electronic circuit composed of sub-circuits and method for producing 有权
标题翻译：电子电路由子电路及其制造方法组成
公开(公告)号：US08441114B2
公开(公告)日：2013-05-14
申请号：US12733929
申请日：2008-09-03
申请人： Martin Birner , Rainer Kreutzer , Hubert Schierling , Norbert Seliger
发明人： Martin Birner , Rainer Kreutzer , Hubert Schierling , Norbert Seliger
IPC分类号： H01L23/22
CPC分类号： H05K1/142 , H01L25/072 , H01L25/16 , H01L2924/0002 , H01L2924/30107 , H05K1/0306 , H05K3/0061 , H05K3/32 , H05K2201/09963 , Y10T29/49117 , H01L2924/00
摘要： To improve manufacture of an electronic circuit, the electronic circuit is composed of modules of sub-circuits arranged on a common substrate, such as a cooling body, and that are electrically interconnected by a planar electrical contact element.
摘要翻译：为了改善电子电路的制造，电子电路由布置在诸如冷却体的公共基板上的子电路的模块组成，并且通过平面电接触元件电互连。

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