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1. 发明申请

US20110267312A1 SENSING UNIT, SENSING ARRANGEMENT AND SENSING METHOD FOR TOUCH PANEL APPLICATION 有权
标题翻译：感应单元，感应布置和感应面板应用感应方法
公开(公告)号：US20110267312A1
公开(公告)日：2011-11-03
申请号：US13095134
申请日：2011-04-27
申请人： CHIA-HSING LIN , YI-HSIN TAO , WEN-JUN HSU , I-SHU LEE , SHIH-YUAN HSU
发明人： CHIA-HSING LIN , YI-HSIN TAO , WEN-JUN HSU , I-SHU LEE , SHIH-YUAN HSU
IPC分类号： G06F3/045
CPC分类号： G06F3/044 , G06F2203/04107
摘要： Two sensing units are configured as an exciter and a sensor connected to two trace lines, respectively, for mutual capacitance sensing from the capacitance units including these two trace lines. The two sensing units connect the two trace lines together to balance them to a same voltage level first, and then disconnect them from each other. Thereafter, the exciter connects the first trace line to an excitation node to induce a charge change on the second trace line, and the sensor senses the charge change to detect the variation of the mutual capacitance between the two trace lines.
摘要翻译：两个感测单元被配置为分别连接到两条迹线的激励器和传感器，用于从包括这两条迹线的电容单元进行互电容感测。两个感测单元将两条迹线连接在一起，以将它们平衡到相同的电压电平，然后将它们彼此断开。此后，激励器将第一迹线连接到激励节点以在第二迹线上引起电荷变化，并且传感器感测电荷变化以检测两条迹线之间的互电容的变化。

2. 发明申请

US20140183587A1 LIGHT EMITTING DIODE PACKAGE 有权
标题翻译：发光二极管封装
公开(公告)号：US20140183587A1
公开(公告)日：2014-07-03
申请号：US14201982
申请日：2014-03-10
申请人： PI-CHIANG HU , SHIH-YUAN HSU
发明人： PI-CHIANG HU , SHIH-YUAN HSU
IPC分类号： H01L33/50
CPC分类号： H01L33/507 , H01L33/505 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： An LED package includes a substrate, an LED chip arranged on the substrate, and a light transmission layer arranged on a light output path of the LED chip. The substrate includes a first electrode and a second electrode separated and electrically insulated from the first electrode. The LED chip is electrically connected to the first electrode and the second electrode of the substrate. The light transmission layer comprises two parallel transparent plates and a fluorescent layer sandwiched between the two transparent plates. The LED package further includes an encapsulation layer sealing the LED chip therein. The light transmission layer is directly located on a top surface of each LED chip, and the encapsulation layer seals the light transmission layer therein.
摘要翻译： LED封装包括基板，布置在基板上的LED芯片和布置在LED芯片的光输出路径上的光透射层。衬底包括与第一电极分离并电绝缘的第一电极和第二电极。 LED芯片电连接到基板的第一电极和第二电极。透光层包括两个平行的透明板和夹在两个透明板之间的荧光层。 LED封装还包括将LED芯片密封在其中的封装层。光透射层直接位于每个LED芯片的顶表面上，并且封装层将透光层密封在其中。

3. 发明申请

US20120235193A1 LED PACKAGE 有权
标题翻译： LED封装
公开(公告)号：US20120235193A1
公开(公告)日：2012-09-20
申请号：US13288042
申请日：2011-11-03
申请人： PI-CHIANG HU , SHIH-YUAN HSU , KAI-LUN WANG
发明人： PI-CHIANG HU , SHIH-YUAN HSU , KAI-LUN WANG
IPC分类号： H01L33/60
CPC分类号： H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2933/0033 , H01L2924/00014
摘要： An LED package comprises a substrate, a reflector, a light-absorbing layer, an encapsulation layer and an LED chip. The light-absorbing layer is located around the reflector and is able to absorb any light which penetrates through the reflector. Therefore, any vignetting or halation of light from the LED package is prevented. Moreover, the LED package can be constructed on a very small scale with no reduction in its color rendering properties.
摘要翻译： LED封装包括基板，反射器，光吸收层，封装层和LED芯片。光吸收层位于反射器周围，并且能够吸收穿透反射器的任何光。因此，防止来自LED封装件的光的任何渐晕或晕倒。此外，LED封装可以以非常小的尺寸构造，而不会降低其显色性能。

4. 发明申请

US20120161179A1 LIGHT EMITTING DIODE PACKAGE 审中-公开
标题翻译：发光二极管封装
公开(公告)号：US20120161179A1
公开(公告)日：2012-06-28
申请号：US13221861
申请日：2011-08-30
申请人： JUNG-HSI FANG , SHIH-YUAN HSU
发明人： JUNG-HSI FANG , SHIH-YUAN HSU
IPC分类号： H01L33/48 , H01L33/52
CPC分类号： H01L33/504 , H01L33/507 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An LED package includes a base, an LED die arranged on the base, an encapsulation sealing the LED die, and a light wavelength converting layer arranged on a light path of the LED die. The light wavelength converting layer includes a plurality of first areas comprising red fluorescent powder, a plurality of second areas comprising green fluorescent powder and a plurality of third areas comprising blue fluorescent powder. The first, second and third areas are aligned along a first direction and a second direction perpendicular to the first direction. Each two neighboring areas on the first direction have different colors. Each two neighboring areas on the second direction also have different colors.
摘要翻译： LED封装包括基座，设置在基座上的LED管芯，密封LED管芯的封装以及布置在LED管芯的光路上的光波长转换层。光波长转换层包括多个包含红色荧光粉末的第一区域，多个包含绿色荧光粉末的第二区域和包括蓝色荧光粉末的多个第三区域。第一，第二和第三区域沿着垂直于第一方向的第一方向和第二方向排列。第一方向上的每两个相邻区域具有不同的颜色。第二方向上的每两个相邻区域也具有不同的颜色。

5. 发明申请

US20130161671A1 LIGHT EMITTING DIODE WITH SIDEWISE LIGHT OUTPUT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：具有边界光输出结构的发光二极管及其制造方法
公开(公告)号：US20130161671A1
公开(公告)日：2013-06-27
申请号：US13559615
申请日：2012-07-27
申请人： SHIH-YUAN HSU , HOU-TE LIN
发明人： SHIH-YUAN HSU , HOU-TE LIN
IPC分类号： H01L33/58 , H01L33/52
CPC分类号： H01L33/58 , H01L33/486 , H01L33/54 , H01L2224/48091 , H01L2924/01322 , H01L2933/0058 , H01L2933/0091 , H01L2924/00014 , H01L2924/00
摘要： A light emitting diode (LED) includes a substrate, an electrode structure positioned on the substrate, an LED component electrically connected to the electrode structure, and a lens structure positioned on the substrate and covering the LED component. The lens structure includes a rugged structure adjacent to the substrate; the roughness of the rugged structure decreases gradually along a direction from a center of the lens structure center toward a peripheral edge thereof. The present disclosure also provides a method for manufacturing the LED light source.
摘要翻译：发光二极管（LED）包括基板，位于基板上的电极结构，与电极结构电连接的LED部件，以及位于基板上并覆盖LED部件的透镜结构。透镜结构包括与基板相邻的凹凸结构; 凹凸结构的粗糙度沿着从透镜结构中心的中心朝向其周边的方向逐渐减小。本公开还提供了一种制造LED光源的方法。

6. 发明申请

US20130026520A1 LIGHT-EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US20130026520A1
公开(公告)日：2013-01-31
申请号：US13476038
申请日：2012-05-21
申请人： PI-CHIANG HU , SHIH-YUAN HSU
发明人： PI-CHIANG HU , SHIH-YUAN HSU
IPC分类号： H01L33/44 , H01L33/48
CPC分类号： H01L33/507 , H01L33/505 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： An LED package includes a substrate, an LED chip arranged on the substrate, and a light transmission layer arranged on a light output path of the LED chip. The substrate includes a first electrode and a second electrode separated and electrically insulated from the first electrode. The LED chip is electrically connected to the first electrode and the second electrode of the substrate. The light transmission layer comprises two parallel transparent plates and a fluorescent layer sandwiched between the two transparent plates. The LED package further includes a transparent encapsulation layer sealing the LED chip therein, and in one embodiment, the light transmission layer is located on the encapsulation layer and in another embodiment, the encapsulation layer also seals the light transmission layer therein. A method for manufacturing the LED package is also provided.
摘要翻译： LED封装包括基板，布置在基板上的LED芯片和布置在LED芯片的光输出路径上的光透射层。衬底包括与第一电极分离并电绝缘的第一电极和第二电极。 LED芯片电连接到基板的第一电极和第二电极。透光层包括两个平行的透明板和夹在两个透明板之间的荧光层。 LED封装还包括将LED芯片密封在其中的透明封装层，并且在一个实施例中，光透射层位于封装层上，并且在另一个实施例中，封装层也将光透射层密封在其中。还提供了用于制造LED封装的方法。

7. 发明申请

US20120098003A1 LIGHT EMITTING DIODE PACKAGE 有权
标题翻译：发光二极管封装
公开(公告)号：US20120098003A1
公开(公告)日：2012-04-26
申请号：US13149790
申请日：2011-05-31
申请人： KAI-LUN WANG , SHIH-YUAN HSU
发明人： KAI-LUN WANG , SHIH-YUAN HSU
IPC分类号： H01L33/60
CPC分类号： H01L33/62 , H01L24/45 , H01L24/48 , H01L33/486 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48599 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： An exemplary light emitting diode (LED) package includes a substrate, an LED chip mounted on the substrate, and a wire. The LED chip includes a semiconductor structure and an electrode disposed on the semiconductor structure. The wire electrically connects the electrode of the LED chip to an electrical portion of the substrate. The wire has a first joint and a second joint connected to the substrate. The wire forms a first curved portion between the electrode and the first joint and a second curved portion between the first joint and the second joint.
摘要翻译：示例性的发光二极管（LED）封装包括基板，安装在基板上的LED芯片和导线。 LED芯片包括半导体结构和设置在半导体结构上的电极。导线将LED芯片的电极电连接到基板的电气部分。线具有连接到基板的第一接头和第二接头。线在电极和第一接头之间形成第一弯曲部分，在第一接头和第二接头之间形成第二弯曲部分。

8. 发明申请

US20120153326A1 LIGHT EMITTING DIODE PACKAGE 失效
标题翻译：发光二极管封装
公开(公告)号：US20120153326A1
公开(公告)日：2012-06-21
申请号：US13209451
申请日：2011-08-15
申请人： KAI-LUN WANG , SHIH-YUAN HSU , HOU-TE LIN
发明人： KAI-LUN WANG , SHIH-YUAN HSU , HOU-TE LIN
IPC分类号： H01L33/50 , H01L33/64 , H01L33/60 , H01L33/62
CPC分类号： H01L33/644 , H01L33/60 , H01L33/642 , H01L2224/48091 , H01L2924/00014
摘要： An exemplary light emitting diode (LED) package includes a substrate, an electrical member formed on the substrate, an LED chip mounted on the substrate and electrically connected to the electrical member, and a heat-dissipating member formed on the electrical member. The heat-dissipating member helps the LED chip to dissipate heat generated thereby when the LED chip is in operation.
摘要翻译：示例性发光二极管（LED）封装包括基板，形成在基板上的电气部件，安装在基板上并电连接到电气部件的LED芯片，以及形成在电气部件上的散热部件。当LED芯片运行时，散热构件帮助LED芯片散发由此产生的热量。

9. 发明申请

US20120126265A1 LED PACKAGE 审中-公开
标题翻译： LED封装
公开(公告)号：US20120126265A1
公开(公告)日：2012-05-24
申请号：US13227611
申请日：2011-09-08
申请人： SHIH-YUAN HSU , JUNG-HSI FANG
发明人： SHIH-YUAN HSU , JUNG-HSI FANG
IPC分类号： H01L33/50
CPC分类号： H01L33/504 , H01L33/505 , H01L2224/48091 , H01L2924/00014
摘要： An exemplary LED package includes a substrate, an electric layer formed on the substrate, an LED chip mounted on the substrate and electrically connected with the electric layer, a first fluorescent layer and a second fluorescent layer. The first fluorescent encloses the LED chip and includes first phosphorous compounds. The second fluorescent covers the first fluorescent layer and includes second phosphorous compounds different from the first phosphorous compounds. The second fluorescent layer is detachably mounted at an outside of the first fluorescent layer.
摘要翻译：示例性LED封装包括基板，形成在基板上的电层，安装在基板上并与电层电连接的LED芯片，第一荧光层和第二荧光层。第一荧光灯包围LED芯片并且包括第一种磷化合物。第二荧光体覆盖第一荧光层，并且包括与第一磷化合物不同的第二磷化合物。第二荧光层可拆卸地安装在第一荧光层的外侧。

10. 发明申请

US20120104438A1 LIGHT EMITTING DIODE PACKAGE STRUCTURE 审中-公开
标题翻译：发光二极管封装结构
公开(公告)号：US20120104438A1
公开(公告)日：2012-05-03
申请号：US13172738
申请日：2011-06-29
申请人： KAI-LUN WANG , SHIH-YUAN HSU
发明人： KAI-LUN WANG , SHIH-YUAN HSU
IPC分类号： H01L33/60
CPC分类号： H01L33/62 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L33/486 , H01L2224/04042 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49107 , H01L2224/73265 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： An LED package structure includes a substrate, a first electrical portion and a second electrical portion formed on the substrate, and an LED chip mounted on a first surface of the first electrical portion. The first and second electrical portions are electrically insulated from each other. The LED chip includes a first electrode connected with the first electrical portion and a second electrode connected with the second electrical portion through a connecting wire. The LED chip has a top surface for supporting the second electrode. The connecting wire has a highest point. A distance between the highest point and the top surface is less than a half of a distance between the first surface of the first electrical portion and the top surface of the LED chip.
摘要翻译： LED封装结构包括基板，形成在基板上的第一电气部分和第二电气部分，以及安装在第一电气部分的第一表面上的LED芯片。第一和第二电气部分彼此电绝缘。 LED芯片包括与第一电气部分连接的第一电极和通过连接线与第二电气部分连接的第二电极。 LED芯片具有用于支撑第二电极的顶表面。连接线具有最高点。最高点和顶面之间的距离小于第一电气部分的第一表面和LED芯片的顶表面之间的距离的一半。

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