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    • 2. 发明申请
    • CONDUCTIVE SUBSTRATE FOR FORMATION OF LED PACKAGE STRUCTURES THEREON
    • 用于形成LED封装结构的导电基板
    • US20120217046A1
    • 2012-08-30
    • US13366371
    • 2012-02-06
    • PI-CHIANG HUKAI-LUN WANG
    • PI-CHIANG HUKAI-LUN WANG
    • H05K1/03
    • H01L33/486H01L33/62H01L2924/0002H01L2933/0033H01L2924/00
    • A plurality of conductive areas is formed on a conductive substrate which includes a frame. Each of the conductive areas includes a lead frame and two electrodes. The frame includes a first side and an opposite second side. The lead frame includes first and second lead frame beams. The first and second lead frame beams extend from the first side toward the second side to connect with the two electrodes. The first and second electrodes extend respectively from the first and second lead frame beams. Each conductive area also includes a supporting portion interconnecting the electrodes and the frame to reinforce the connection between the frame and the conductive area so that the conductive area can sustain a pressure when an insulation shell is injection molded on the conductive area.
    • 在包括框架的导电基板上形成多个导电区域。 每个导电区域包括引线框架和两个电极。 框架包括第一侧和相对的第二侧。 引线框架包括第一和第二引线框架梁。 第一和第二引线框架梁从第一侧向第二侧延伸以与两个电极连接。 第一和第二电极分别从第一和第二引线框架梁延伸。 每个导电区域还包括互连电极和框架的支撑部分,以加强框架和导电区域之间的连接,使得当绝缘壳体被注塑在导电区域上时,导电区域可承受压力。
    • 6. 发明申请
    • LIGHT EMITTING DIODE PACKAGE
    • 发光二极管封装
    • US20120132942A1
    • 2012-05-31
    • US13186483
    • 2011-07-20
    • KAI-LUN WANGHOU-TE LIN
    • KAI-LUN WANGHOU-TE LIN
    • H01L33/50
    • H01L33/486H01L33/50H01L33/62H01L2224/48091H01L2224/48247H01L2924/00014
    • An exemplary LED package includes first and second electrodes, an LED chip and two electrically conductive wires. The first electrode has a top surface and an opposite bottom surface. A recess is defined in the top surface of the first electrode. The second electrode has a top surface and an opposite bottom surface. A recess is defined in the top surface of the second electrode. The LED chip has a bottom surface attached to the top surface of the first electrode, and a top surface on which a first pad and a second pad are formed. One of the electrically conductive wires has an end connecting to the first pad and an opposite end joining with a bottom of the recess of the first electrode. The other has an end connecting to the second pad and an opposite end joining with a bottom of the recess of the second electrode.
    • 示例性的LED封装包括第一和第二电极,LED芯片和两个导电线。 第一电极具有顶表面和相对的底表面。 在第一电极的顶表面中限定凹部。 第二电极具有顶表面和相对的底表面。 在第二电极的顶表面中限定凹部。 LED芯片具有附接到第一电极的顶表面的底表面和形成有第一焊盘和第二焊盘的顶表面。 一个导电线具有连接到第一焊盘的端部和与第一电极的凹部的底部连接的相对端。 另一端具有连接到第二焊盘的端部和与第二电极的凹部的底部连接的相对端。