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1. 发明申请

US20120153326A1 LIGHT EMITTING DIODE PACKAGE 失效
标题翻译：发光二极管封装
公开(公告)号：US20120153326A1
公开(公告)日：2012-06-21
申请号：US13209451
申请日：2011-08-15
申请人： KAI-LUN WANG , SHIH-YUAN HSU , HOU-TE LIN
发明人： KAI-LUN WANG , SHIH-YUAN HSU , HOU-TE LIN
IPC分类号： H01L33/50 , H01L33/64 , H01L33/60 , H01L33/62
CPC分类号： H01L33/644 , H01L33/60 , H01L33/642 , H01L2224/48091 , H01L2924/00014
摘要： An exemplary light emitting diode (LED) package includes a substrate, an electrical member formed on the substrate, an LED chip mounted on the substrate and electrically connected to the electrical member, and a heat-dissipating member formed on the electrical member. The heat-dissipating member helps the LED chip to dissipate heat generated thereby when the LED chip is in operation.
摘要翻译：示例性发光二极管（LED）封装包括基板，形成在基板上的电气部件，安装在基板上并电连接到电气部件的LED芯片，以及形成在电气部件上的散热部件。当LED芯片运行时，散热构件帮助LED芯片散发由此产生的热量。

2. 发明申请

US20120132942A1 LIGHT EMITTING DIODE PACKAGE 有权
标题翻译：发光二极管封装
公开(公告)号：US20120132942A1
公开(公告)日：2012-05-31
申请号：US13186483
申请日：2011-07-20
申请人： KAI-LUN WANG , HOU-TE LIN
发明人： KAI-LUN WANG , HOU-TE LIN
IPC分类号： H01L33/50
CPC分类号： H01L33/486 , H01L33/50 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An exemplary LED package includes first and second electrodes, an LED chip and two electrically conductive wires. The first electrode has a top surface and an opposite bottom surface. A recess is defined in the top surface of the first electrode. The second electrode has a top surface and an opposite bottom surface. A recess is defined in the top surface of the second electrode. The LED chip has a bottom surface attached to the top surface of the first electrode, and a top surface on which a first pad and a second pad are formed. One of the electrically conductive wires has an end connecting to the first pad and an opposite end joining with a bottom of the recess of the first electrode. The other has an end connecting to the second pad and an opposite end joining with a bottom of the recess of the second electrode.
摘要翻译：示例性的LED封装包括第一和第二电极，LED芯片和两个导电线。第一电极具有顶表面和相对的底表面。在第一电极的顶表面中限定凹部。第二电极具有顶表面和相对的底表面。在第二电极的顶表面中限定凹部。 LED芯片具有附接到第一电极的顶表面的底表面和形成有第一焊盘和第二焊盘的顶表面。一个导电线具有连接到第一焊盘的端部和与第一电极的凹部的底部连接的相对端。另一端具有连接到第二焊盘的端部和与第二电极的凹部的底部连接的相对端。

3. 发明申请

US20120098003A1 LIGHT EMITTING DIODE PACKAGE 有权
标题翻译：发光二极管封装
公开(公告)号：US20120098003A1
公开(公告)日：2012-04-26
申请号：US13149790
申请日：2011-05-31
申请人： KAI-LUN WANG , SHIH-YUAN HSU
发明人： KAI-LUN WANG , SHIH-YUAN HSU
IPC分类号： H01L33/60
CPC分类号： H01L33/62 , H01L24/45 , H01L24/48 , H01L33/486 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48599 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： An exemplary light emitting diode (LED) package includes a substrate, an LED chip mounted on the substrate, and a wire. The LED chip includes a semiconductor structure and an electrode disposed on the semiconductor structure. The wire electrically connects the electrode of the LED chip to an electrical portion of the substrate. The wire has a first joint and a second joint connected to the substrate. The wire forms a first curved portion between the electrode and the first joint and a second curved portion between the first joint and the second joint.
摘要翻译：示例性的发光二极管（LED）封装包括基板，安装在基板上的LED芯片和导线。 LED芯片包括半导体结构和设置在半导体结构上的电极。导线将LED芯片的电极电连接到基板的电气部分。线具有连接到基板的第一接头和第二接头。线在电极和第一接头之间形成第一弯曲部分，在第一接头和第二接头之间形成第二弯曲部分。

4. 发明申请

US20120235193A1 LED PACKAGE 有权
标题翻译： LED封装
公开(公告)号：US20120235193A1
公开(公告)日：2012-09-20
申请号：US13288042
申请日：2011-11-03
申请人： PI-CHIANG HU , SHIH-YUAN HSU , KAI-LUN WANG
发明人： PI-CHIANG HU , SHIH-YUAN HSU , KAI-LUN WANG
IPC分类号： H01L33/60
CPC分类号： H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2933/0033 , H01L2924/00014
摘要： An LED package comprises a substrate, a reflector, a light-absorbing layer, an encapsulation layer and an LED chip. The light-absorbing layer is located around the reflector and is able to absorb any light which penetrates through the reflector. Therefore, any vignetting or halation of light from the LED package is prevented. Moreover, the LED package can be constructed on a very small scale with no reduction in its color rendering properties.
摘要翻译： LED封装包括基板，反射器，光吸收层，封装层和LED芯片。光吸收层位于反射器周围，并且能够吸收穿透反射器的任何光。因此，防止来自LED封装件的光的任何渐晕或晕倒。此外，LED封装可以以非常小的尺寸构造，而不会降低其显色性能。

5. 发明申请

US20120104438A1 LIGHT EMITTING DIODE PACKAGE STRUCTURE 审中-公开
标题翻译：发光二极管封装结构
公开(公告)号：US20120104438A1
公开(公告)日：2012-05-03
申请号：US13172738
申请日：2011-06-29
申请人： KAI-LUN WANG , SHIH-YUAN HSU
发明人： KAI-LUN WANG , SHIH-YUAN HSU
IPC分类号： H01L33/60
CPC分类号： H01L33/62 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L33/486 , H01L2224/04042 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49107 , H01L2224/73265 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： An LED package structure includes a substrate, a first electrical portion and a second electrical portion formed on the substrate, and an LED chip mounted on a first surface of the first electrical portion. The first and second electrical portions are electrically insulated from each other. The LED chip includes a first electrode connected with the first electrical portion and a second electrode connected with the second electrical portion through a connecting wire. The LED chip has a top surface for supporting the second electrode. The connecting wire has a highest point. A distance between the highest point and the top surface is less than a half of a distance between the first surface of the first electrical portion and the top surface of the LED chip.
摘要翻译： LED封装结构包括基板，形成在基板上的第一电气部分和第二电气部分，以及安装在第一电气部分的第一表面上的LED芯片。第一和第二电气部分彼此电绝缘。 LED芯片包括与第一电气部分连接的第一电极和通过连接线与第二电气部分连接的第二电极。 LED芯片具有用于支撑第二电极的顶表面。连接线具有最高点。最高点和顶面之间的距离小于第一电气部分的第一表面和LED芯片的顶表面之间的距离的一半。

6. 发明申请

US20120217046A1 CONDUCTIVE SUBSTRATE FOR FORMATION OF LED PACKAGE STRUCTURES THEREON 失效
标题翻译：用于形成LED封装结构的导电基板
公开(公告)号：US20120217046A1
公开(公告)日：2012-08-30
申请号：US13366371
申请日：2012-02-06
申请人： PI-CHIANG HU , KAI-LUN WANG
发明人： PI-CHIANG HU , KAI-LUN WANG
IPC分类号： H05K1/03
CPC分类号： H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2924/00
摘要： A plurality of conductive areas is formed on a conductive substrate which includes a frame. Each of the conductive areas includes a lead frame and two electrodes. The frame includes a first side and an opposite second side. The lead frame includes first and second lead frame beams. The first and second lead frame beams extend from the first side toward the second side to connect with the two electrodes. The first and second electrodes extend respectively from the first and second lead frame beams. Each conductive area also includes a supporting portion interconnecting the electrodes and the frame to reinforce the connection between the frame and the conductive area so that the conductive area can sustain a pressure when an insulation shell is injection molded on the conductive area.
摘要翻译：在包括框架的导电基板上形成多个导电区域。每个导电区域包括引线框架和两个电极。框架包括第一侧和相对的第二侧。引线框架包括第一和第二引线框架梁。第一和第二引线框架梁从第一侧向第二侧延伸以与两个电极连接。第一和第二电极分别从第一和第二引线框架梁延伸。每个导电区域还包括互连电极和框架的支撑部分，以加强框架和导电区域之间的连接，使得当绝缘壳体被注塑在导电区域上时，导电区域可承受压力。

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