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    • 1. 发明授权
    • Method of manufacturing a flash memory device
    • 制造闪存装置的方法
    • US06472273B2
    • 2002-10-29
    • US09875734
    • 2001-06-06
    • Byung Hee ChoNoh Yeal Kwak
    • Byung Hee ChoNoh Yeal Kwak
    • H01L21336
    • H01L27/11521H01L21/28273H01L29/66825
    • A method of manufacturing a flash memory device includes the steps of sequentially forming a tunnel oxide film and a first polysilicon layer on a semiconductor substrate in which a device separation film is formed and then patterning the tunnel oxide film and the first polysilicon layer to form a floating gate; forming a mask so that a portion in which a source region will be formed can be exposed and then removing the device separation film at the exposed portion; forming a dielectric film including a lower oxide film, a nitride film, and an upper oxide film on the entire structure; performing an annealing process; then forming a second polysilicon layer on the dielectric film; sequentially removing the polysilicon layer, the upper oxide film, and the nitride film in a portion in which a source region and a drain region will be formed, and injecting impurity ions into the semiconductor substrate at a portion in which the lower oxide film remains to form a source region and a drain region; after removing the remaining lower oxide film, sequentially forming a third polysilicon layer and a tungsten silicide layer on the entire structure and then patterning the third polysilicon layer and the tungsten silicide layer to form a control gate; and performing an annealing process for activating the impurity ions injected into the source region and the drain region.
    • 制造闪速存储器件的方法包括以下步骤:在其上形成器件分离膜的半导体衬底上依次形成隧道氧化物膜和第一多晶硅层,然后对隧道氧化物膜和第一多晶硅层进行构图, 浮门 形成掩模,使得其中将形成源极区的部分可以暴露,然后在暴露部分移除器件分离膜; 在整个结构上形成包括低氧化物膜,氮化物膜和上氧化膜的电介质膜; 进行退火处理; 然后在介电膜上形成第二多晶硅层; 在其中将形成源极区和漏极区的部分中顺序地去除多晶硅层,上氧化物膜和氮化物膜,并且在低氧化膜保留的部分将杂质离子注入到半导体衬底中 形成源极区域和漏极区域; 在除去剩余的低氧化物膜之后,在整个结构上依次形成第三多晶硅层和硅化钨层,然后构图第三多晶硅层和硅化钨层以形成控制栅极; 并且执行用于激活注入到源极区域和漏极区域中的杂质离子的退火处理。