专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20080265404A1 Structure and Methods of Processing for Solder Thermal Interface Materials for Chip Cooling 有权
标题翻译：用于芯片冷却的焊料热界面材料的加工结构和方法
公开(公告)号：US20080265404A1
公开(公告)日：2008-10-30
申请号：US11742161
申请日：2007-04-30
申请人： Bruce Furman , Madhusudan K. Iyengar , Paul A. Lauro , Yves Martin , Roger R. Schmidt , Da-Yuan Shih , Theodore G. Van Kessel , Wei Zou
发明人： Bruce Furman , Madhusudan K. Iyengar , Paul A. Lauro , Yves Martin , Roger R. Schmidt , Da-Yuan Shih , Theodore G. Van Kessel , Wei Zou
IPC分类号： H01L23/34 , H01L21/00
CPC分类号： H01L23/42 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2224/0401
摘要： Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed.
摘要翻译：公开了用于从集成电路和电路芯片散热的组件。组件包括作为用于将热从芯片传递到散热器（HS）的热界面材料（TIM）的低熔点焊料，其中低熔点焊料的熔点低于芯片的最大工作温度。还公开了制造组件的方法。

2. 发明授权

US07898076B2 Structure and methods of processing for solder thermal interface materials for chip cooling 有权
标题翻译：用于芯片冷却的焊料热界面材料的加工结构和方法
公开(公告)号：US07898076B2
公开(公告)日：2011-03-01
申请号：US11742161
申请日：2007-04-30
申请人： Bruce Furman , Madhusudan K. Iyengar , Paul A. Lauro , Yves Martin , Roger R. Schmidt , Da-Yuan Shih , Theodore G. Van Kessel , Wei Zou
发明人： Bruce Furman , Madhusudan K. Iyengar , Paul A. Lauro , Yves Martin , Roger R. Schmidt , Da-Yuan Shih , Theodore G. Van Kessel , Wei Zou
IPC分类号： H01L23/10
CPC分类号： H01L23/42 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2224/0401
摘要： Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed.
摘要翻译：公开了用于从集成电路和电路芯片散热的组件。组件包括作为用于将热从芯片传递到散热器（HS）的热界面材料（TIM）的低熔点焊料，其中低熔点焊料的熔点低于芯片的最大工作温度。还公开了制造组件的方法。

3. 发明授权

US08156998B2 Patterned metal thermal interface 有权
标题翻译：图案金属热接口
公开(公告)号：US08156998B2
公开(公告)日：2012-04-17
申请号：US12710951
申请日：2010-02-23
申请人： Bruce K. Furman , Sushumna Iruvanti , Paul A. Lauro , Yves C. Martin , Da Yuan Shih , Theodore G. Van Kessel , Wei Zou
发明人： Bruce K. Furman , Sushumna Iruvanti , Paul A. Lauro , Yves C. Martin , Da Yuan Shih , Theodore G. Van Kessel , Wei Zou
IPC分类号： F28F7/00
CPC分类号： H01L23/433 , F28F13/00 , F28F2013/005 , H01L2224/73253 , Y10T29/4935 , Y10T29/53113
摘要： The present invention is a patterned metal thermal interface. In one embodiment a system for dissipating heat from a heat-generating device includes a heat sink having a first surface adapted for thermal coupling to a first surface of the heat generating device and a thermal interface having at least one patterned surface, the thermal interface being adapted to thermally couple the first surface of the heat sink to the first surface of the heat generating device. The patterned surface of the thermal interface allows the thermal interface to deform under compression between the heat sink and the heat generating device, leading to better conformity of the thermal interface to the surfaces of the heat sink and the heat generating device.
摘要翻译：本发明是图案化的金属热界面。在一个实施例中，用于从发热装置散热的系统包括具有适于热耦合到发热装置的第一表面的第一表面的散热器和具有至少一个图案化表面的热界面，所述热界面是适于将散热器的第一表面热耦合到发热装置的第一表面。热界面的图案化表面允许热界面在散热器和发热装置之间的压缩下变形，导致热界面与散热器和发热装置的表面更好地一致。

4. 发明授权

US07694719B2 Patterned metal thermal interface 有权
标题翻译：图案金属热接口
公开(公告)号：US07694719B2
公开(公告)日：2010-04-13
申请号：US11619928
申请日：2007-01-04
申请人： Bruce K. Furman , Sushumna Iruvanti , Paul A. Lauro , Yves C. Martin , Da Yuan Shih , Theodore G. Van Kessel , Wei Zou
发明人： Bruce K. Furman , Sushumna Iruvanti , Paul A. Lauro , Yves C. Martin , Da Yuan Shih , Theodore G. Van Kessel , Wei Zou
IPC分类号： F28F7/00
CPC分类号： H01L23/433 , F28F13/00 , F28F2013/005 , H01L2224/73253 , Y10T29/4935 , Y10T29/53113
摘要： The present invention is a patterned metal thermal interface. In one embodiment a system for dissipating heat from a heat-generating device includes a heat sink having a first surface adapted for thermal coupling to a first surface of the heat generating device and a thermal interface having at least one patterned surface, the thermal interface being adapted to thermally couple the first surface of the heat sink to the first surface of the heat generating device. The patterned surface of the thermal interface allows the thermal interface to deform under compression between the heat sink and the heat generating device, leading to better conformity of the thermal interface to the surfaces of the heat sink and the heat generating device.
摘要翻译：本发明是图案化的金属热界面。在一个实施例中，用于从发热装置散热的系统包括具有适于热耦合到发热装置的第一表面的第一表面的散热器和具有至少一个图案化表面的热界面，所述热界面是适于将散热器的第一表面热耦合到发热装置的第一表面。热界面的图案化表面允许热界面在散热器和发热装置之间的压缩下变形，导致热界面与散热器和发热装置的表面更好地一致。

5. 发明申请

US20100147497A1 PATTERNED METAL THERMAL INTERFACE 有权
标题翻译：图形金属热界面
公开(公告)号：US20100147497A1
公开(公告)日：2010-06-17
申请号：US12710951
申请日：2010-02-23
申请人： BRUCE K. FURMAN , Sushumna Iruvanti , Paul A. Lauro , Yves C. Martin , Da Yuan Shih , Theodore G. Van Kessel , Wei Zou
发明人： BRUCE K. FURMAN , Sushumna Iruvanti , Paul A. Lauro , Yves C. Martin , Da Yuan Shih , Theodore G. Van Kessel , Wei Zou
IPC分类号： F28F13/18 , F28F7/00
CPC分类号： H01L23/433 , F28F13/00 , F28F2013/005 , H01L2224/73253 , Y10T29/4935 , Y10T29/53113
摘要： The present invention is a patterned metal thermal interface. In one embodiment a system for dissipating heat from a heat-generating device includes a heat sink having a first surface adapted for thermal coupling to a first surface of the heat generating device and a thermal interface having at least one patterned surface, the thermal interface being adapted to thermally couple the first surface of the heat sink to the first surface of the heat generating device. The patterned surface of the thermal interface allows the thermal interface to deform under compression between the heat sink and the heat generating device, leading to better conformity of the thermal interface to the surfaces of the heat sink and the heat generating device.
摘要翻译：本发明是图案化的金属热界面。在一个实施例中，用于从发热装置散热的系统包括具有适于热耦合到发热装置的第一表面的第一表面的散热器和具有至少一个图案化表面的热界面，所述热界面是适于将散热器的第一表面热耦合到发热装置的第一表面。热界面的图案化表面允许热界面在散热器和发热装置之间的压缩下变形，导致热界面与散热器和发热装置的表面更好地一致。

6. 发明申请

US20080165502A1 PATTERNED METAL THERMAL INTERFACE 有权
标题翻译：图形金属热界面
公开(公告)号：US20080165502A1
公开(公告)日：2008-07-10
申请号：US11619928
申请日：2007-01-04
申请人： Bruce K. Furman , Sushumna Iruvanti , Paul A. Lauro , Yves C. Martin , Da Yuan Shih , Theodore G. Van Kessel , Wei Zou
发明人： Bruce K. Furman , Sushumna Iruvanti , Paul A. Lauro , Yves C. Martin , Da Yuan Shih , Theodore G. Van Kessel , Wei Zou
IPC分类号： H05K7/20 , B23P15/26
CPC分类号： H01L23/433 , F28F13/00 , F28F2013/005 , H01L2224/73253 , Y10T29/4935 , Y10T29/53113
摘要： The present invention is a patterned metal thermal interface. In one embodiment a system for dissipating heat from a heat-generating device includes a heat sink having a first surface adapted for thermal coupling to a first surface of the heat generating device and a thermal interface having at least one patterned surface, the thermal interface being adapted to thermally couple the first surface of the heat sink to the first surface of the heat generating device. The patterned surface of the thermal interface allows the thermal interface to deform under compression between the heat sink and the heat generating device, leading to better conformity of the thermal interface to the surfaces of the heat sink and the heat generating device.
摘要翻译：本发明是图案化的金属热界面。在一个实施例中，用于从发热装置散热的系统包括具有适于热耦合到发热装置的第一表面的第一表面的散热器和具有至少一个图案化表面的热界面，所述热界面是适于将散热器的第一表面热耦合到发热装置的第一表面。热界面的图案化表面允许热界面在散热器和发热装置之间的压缩下变形，导致热界面与散热器和发热装置的表面更好地一致。

7. 发明授权

US08638675B2 Method and device for data relay transmission in wireless relay network 有权
标题翻译：无线中继网中数据中继传输的方法和装置
公开(公告)号：US08638675B2
公开(公告)日：2014-01-28
申请号：US12863256
申请日：2008-01-17
申请人： Dongyao Wang , Wei Zou , Shan Jin
发明人： Dongyao Wang , Wei Zou , Shan Jin
IPC分类号： H04J1/16 , H04B3/36
CPC分类号： H04B7/155 , H04L47/6215
摘要： A method and a device for data relay transmission in a wireless relay communication network are provided, in which, the relay station directly obtains corresponding egress CID related information based on input MAC PDUs, then generates output MAC PDUs including the egress CID related information, and at last, according to the egress CID related information, performs QoS scheduling for the output MAC PDUs, so as to output them in an sequence of QoS. The invention omits the steps of de-cascading, de-segmenting or de-capsulating the MAC PDUs in order to obtain MAC SDUs, and the steps of scheduling by category, cascading, segmenting, and encapsulating the MAC SDUs in order to re-generate the MAC PDUs in the prior art, and the invention simplifies the data processing procedure and achieves the goal of decreasing the relay latency.
摘要翻译：提供了一种在无线中继通信网络中进行数据中继传输的方法和装置，其中中继站基于输入的MAC PDU直接获得对应的出口CID相关信息，然后生成包括出口CID相关信息的输出MAC PDU，以及最后，根据出口CID相关信息，对输出的MAC PDU进行QoS调度，以便以QoS的顺序输出。本发明省略了为了获得MAC SDU而对MAC PDU进行解压，去分段或解封装的步骤，以及按类别进行调度，级联，分段和封装MAC SDU的步骤，以便重新生成现有技术中的MAC PDU，并且本发明简化了数据处理过程并实现了降低中继等待时间的目标。

8. 发明申请

US20130012221A1 EVOLVED NODE B CONTROLLED CENTRALIZED RESOURCE REUSE FOR DEVICE-TO-DEVICE AND CELLULAR USERS 有权
标题翻译：控制中心资源重用用于设备到设备和蜂窝用户的演进节点B
公开(公告)号：US20130012221A1
公开(公告)日：2013-01-10
申请号：US13521349
申请日：2010-01-19
申请人： Wei Zou , Zhenhong Li , Haifeng Wang , Gang Wu , Tao Chen
发明人： Wei Zou , Zhenhong Li , Haifeng Wang , Gang Wu , Tao Chen
IPC分类号： H04W72/10
CPC分类号： H04W72/10 , H04W72/0406 , H04W72/082 , H04W72/087 , H04W76/14
摘要： Device-to-device (D2D) communication is one alternative to communication between devices through a radio access network. One interesting D2D communication method is reuse-mode D2D, where D2D nodes communicate with each other using the same uplink (UL) radio resource that is being used by some other cellular user equipment(s) (UEs). In other words, the UL cellular resources occupied by cellular UEs are reused by D2D nodes in their short-range communications. Centralized control of D2D communication can be performed by appropriate signaling between a D2D-capable UE and an evolved Node B (eNB).
摘要翻译：设备到设备（D2D）通信是通过无线电接入网络在设备之间进行通信的替代方案。一种有趣的D2D通信方法是复用模式D2D，其中D2D节点使用正被一些其他蜂窝用户设备（UE）使用的相同上行链路（UL）无线电资源彼此通信。换句话说，蜂窝UE占用的UL蜂窝资源在其短距离通信中被D2D节点重用。 D2D通信的集中控制可以通过D2D能力的UE和演进节点B（eNB）之间的适当的信令来执行。

9. 发明授权

US08345587B2 Relay station, base station and method for extending a coverage area of a base station in a radio network 失效
标题翻译：中继站，基站和扩展无线网络中基站覆盖区域的方法
公开(公告)号：US08345587B2
公开(公告)日：2013-01-01
申请号：US12298975
申请日：2007-04-17
申请人： Gang Shen , Wei Ni , Wei Zou , Jimin Liu , Shan Jin
发明人： Gang Shen , Wei Ni , Wei Zou , Jimin Liu , Shan Jin
IPC分类号： H04B7/14 , H04B7/15 , H04W4/00
CPC分类号： H04B7/2606 , H04W16/26 , H04W76/20 , H04W84/047
摘要： A method for extending a coverage of a base station in a wireless communication network is disclosed, characterized in that a relay station transfers control information and communication related information between the base station and the mobile station according to an indication of the base station.
摘要翻译：公开了一种在无线通信网络中扩展基站覆盖的方法，其特征在于，中继站根据基站的指示，在基站与移动站之间传送控制信息和通信相关信息。

10. 发明授权

US08021925B2 Thermal paste containment for semiconductor modules 有权
标题翻译：用于半导体模块的散热膏容纳
公开(公告)号：US08021925B2
公开(公告)日：2011-09-20
申请号：US11955598
申请日：2007-12-13
申请人： David L. Edwards , Sushumna Iruvanti , Hilton T. Toy , Wei Zou
发明人： David L. Edwards , Sushumna Iruvanti , Hilton T. Toy , Wei Zou
IPC分类号： H01L23/02
CPC分类号： H01L23/04 , H01L23/10 , H01L23/3675 , H01L23/42 , H01L24/32 , H01L2224/16225 , H01L2224/26175 , H01L2224/27013 , H01L2224/32245 , H01L2224/73253 , H01L2224/83051 , H01L2224/83385 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/16152 , H01L2924/16153 , H01L2924/1616 , Y10S257/924
摘要： A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.
摘要翻译：公开了半导体模块结构和形成半导体模块结构的方法。该结构包括安装在基板上并被盖子覆盖的模具。热化合物设置在模具和盖子之间的热间隙内。围绕模具周边的屏障在盖和基板之间延伸，包含热化合物，并且在半导体模块循环期间响应于基板和盖的膨胀和收缩而弯曲。更具体地，屏障由柔性材料形成或具有与基底和/或盖的柔性连接。屏障有效地包含了模具和盖子之间的热化合物，从而提供可靠和可控的覆盖模具上的热化合物以进行散热。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式