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1. 发明申请

US20070076053A1 Nozzle members, compositions and methods for micro-fluid ejection heads 有权
标题翻译：用于微流体喷射头的喷嘴构件，组合物和方法
公开(公告)号：US20070076053A1
公开(公告)日：2007-04-05
申请号：US11239799
申请日：2005-09-30
申请人： Brian Hart , Gary Holt , Melissa Waldeck , Sean Weaver , Gary Williams
发明人： Brian Hart , Gary Holt , Melissa Waldeck , Sean Weaver , Gary Williams
IPC分类号： B41J2/14 , B41J2/16 , G01D15/00 , G11B5/127
CPC分类号： B41J2/1603 , B41J2/162 , B41J2/1631 , B41J2/1645
摘要： Improved photoimaged nozzle members for a micro-fluid ejection head, micro-fluid ejection heads containing such nozzle members, and methods for making any of the same. One such nozzle member is provided by a photoresist nozzle layer applied adjacent a thick film layer on a substrate having fluid ejector actuators. The photoresist nozzle layer has a plurality of nozzles therein. The nozzles are formed in the nozzle layer from an exit surface of the nozzle layer to an entrance surface of the nozzle layer. The nozzles have a reentrant hole profile with a wall angle greater than about 40 up to about 30° measured from an axis orthogonal to a plane defined by the exit surface of the nozzle layer.
摘要翻译：用于微流体喷射头的改进的光成像喷嘴构件，包含这种喷嘴构件的微流体喷射头及其制造方法。一个这样的喷嘴构件由邻近具有流体喷射器致动器的基板上的厚膜层施加的光致抗蚀剂喷涂层提供。光致抗蚀剂喷涂层在其中具有多个喷嘴。喷嘴从喷嘴层的出射面到喷嘴层的入射面形成在喷嘴层中。喷嘴具有从垂直于由喷嘴层的出射表面限定的平面的轴测量的壁角大于约40至约30°的折入孔轮廓。

2. 发明申请

US20070236542A1 Adhesive Compositions, Micro-Fluid Ejection Devices, and Methods for Attaching Micro-Fluid Ejection Heads 审中-公开
标题翻译：粘合剂组合物，微流体喷射装置和附着微流体喷射头的方法
公开(公告)号：US20070236542A1
公开(公告)日：2007-10-11
申请号：US11382876
申请日：2006-05-11
申请人： David Graham , Gary Holt , Jonathan Laurer , Johnny Massie , Melissa Waldeck , Sean Weaver , Rich Wells
发明人： David Graham , Gary Holt , Jonathan Laurer , Johnny Massie , Melissa Waldeck , Sean Weaver , Rich Wells
IPC分类号： B41J2/045
CPC分类号： B41J2/1623 , B41J2/14024 , B41J2/1408 , B41J2/1601
摘要： Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).
摘要翻译：粘合剂组合物，微流体喷射装置和用于将微流体喷射头附接到装置的方法。提供一种这样的粘合剂组合物用于将微流体喷射头附接到装置，例如在粘合剂固化时减少切屑弯曲和/或降低切屑脆性。这样的示例性组合物可以包括具有约50.0至约95.0重量％的至少一种选自环氧树脂，硅氧烷树脂，聚氨酯树脂和官能化烯烃树脂的交联树脂; 约0.1至约25.0重量％的至少一种热固化剂; 和约0.0-约30.0重量％的填料，并且在固化时表现出相对低的剪切模量（例如在25℃下小于约10.0MPa）。

3. 发明申请

US20070070122A1 Methods for making micro-fluid ejection head structures 有权
标题翻译：制造微流体喷射头结构的方法
公开(公告)号：US20070070122A1
公开(公告)日：2007-03-29
申请号：US11234421
申请日：2005-09-23
申请人： Craig Bertelsen , Brian Hart , Melissa Waldeck , Sean Weaver
发明人： Craig Bertelsen , Brian Hart , Melissa Waldeck , Sean Weaver
IPC分类号： B41J2/135
CPC分类号： B41J2/1433 , B41J2/1603 , B41J2/162 , B41J2/1623 , B41J2/1628 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1635 , B41J2/1639 , B41J2/1645 , Y10S430/146
摘要： Methods of making micro-fluid ejection head structures. One of the methods includes providing a substrate having a plurality fluid ejection actuators on a device surface thereof. The device surface of the substrate also has a thick film layer comprising at least one of fluid flow channels and fluid ejection chambers therein. A removable anti-reflective material is applied to at least one or more exposed portions of the device surface of the substrate. A nozzle layer is applied adjacent to the thick film layer. The nozzle layer is imaged to provide a plurality of nozzles in the nozzle layer, and the non-reflective material is removed from the exposed portions of the device surface of the substrate.
摘要翻译：制造微流体喷射头结构的方法。一种方法包括在其装置表面上提供具有多个流体喷射致动器的基板。衬底的器件表面还具有包括流体流动通道和流体喷射室中的至少一个的厚膜层。可移除的抗反射材料被施加到衬底的器件表面的至少一个或多个暴露部分。在厚膜层附近施加喷嘴层。喷嘴层被成像以在喷嘴层中提供多个喷嘴，并且从基板的装置表面的暴露部分去除非反射材料。

4. 发明申请

US20060000090A1 Die attach methods and apparatus for micro-fluid ejection device 有权
标题翻译：微流体喷射装置的贴片方法和装置
公开(公告)号：US20060000090A1
公开(公告)日：2006-01-05
申请号：US10880899
申请日：2004-06-30
申请人： Mary Smoot , Paul Spivey , Melissa Waldeck , Craig Bertelsen , Sean Weaver
发明人： Mary Smoot , Paul Spivey , Melissa Waldeck , Craig Bertelsen , Sean Weaver
IPC分类号： B21D53/76
CPC分类号： B41J2/17559 , B41J2/17513 , B41J2/1752 , B41J2/17526 , B41J2/17553 , C07D235/18 , C07D401/12 , C07D403/12 , Y10S29/001 , Y10T29/4913 , Y10T29/49155 , Y10T29/49401 , Y10T29/49798 , Y10T156/1062
摘要： A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mm−1 on the micro-fluid ejection device structures or on the cartridge body. At least one of the micro-fluid ejection device structures and attached circuit is adhesively bonded to the cartridge body for flow of fluid from the containment localities to the device side thereof.
摘要翻译：提供了一种用于制造用于将多个流体保持在分离的容纳区域中的多流体盒的方法。盒体包含与容纳部位流体连通的流体供给路径。在半导体晶片上的多个限定的喷墨头基板的每一个的装置侧附着喷嘴板。每个喷射头基板具有流体供应侧和两个或更多个流体流动路径，用于将流体从供给侧提供到其装置侧。喷射头基板中的流体流动路径具有大于约1.0流动路径/毫米的流路密度。切割晶片以提供多个微流体喷射装置结构。电路装置连接到每个基板的装置侧。在微流体喷射装置结构上或筒体上的粘合线密度为至少约1.2mm -1的粘合线密度的粘合剂。微流体喷射装置结构和附接电路中的至少一个被粘合到盒主体上，用于将流体从容纳区域流动到其装置侧。

5. 发明申请

US20060213060A1 Die attach methods and apparatus for micro-fluid ejection device 有权
公开(公告)号：US20060213060A1
公开(公告)日：2006-09-28
申请号：US11386174
申请日：2006-03-22
申请人： Mary Smoot , Paul Spivey , Melissa Waldeck , Craig Bertelsen , Sean Weaver
发明人： Mary Smoot , Paul Spivey , Melissa Waldeck , Craig Bertelsen , Sean Weaver
IPC分类号： B21D53/76 , H05K3/10
CPC分类号： B41J2/17559 , B41J2/17513 , B41J2/1752 , B41J2/17526 , B41J2/17553 , C07D235/18 , C07D401/12 , C07D403/12 , Y10S29/001 , Y10T29/4913 , Y10T29/49155 , Y10T29/49401 , Y10T29/49798 , Y10T156/1062
摘要： A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mm−1 on the micro-fluid ejection device structures or on the cartridge body. At least one of the micro-fluid ejection device structures and attached circuit is adhesively bonded to the cartridge body for flow of fluid from the containment localities to the device side thereof.

6. 发明申请

US20060001703A1 Die attach methods and apparatus for micro-fluid ejection device 有权
标题翻译：微流体喷射装置的贴片方法和装置
公开(公告)号：US20060001703A1
公开(公告)日：2006-01-05
申请号：US10880898
申请日：2004-06-30
申请人： Craig Bertelsen , James Mrvos , Paul Spivey , Melissa Waldeck , Sean Weaver
发明人： Craig Bertelsen , James Mrvos , Paul Spivey , Melissa Waldeck , Sean Weaver
IPC分类号： B41J2/05
CPC分类号： B41J2/17559
摘要： A micro-fluid ejection device structure, a multi-fluid cartridge containing the ejection device structure, and methods for making the ejection device structure and cartridge. The ejection device includes an ejection head substrate having a fluid supply side and a device side and containing two or more fluid flow paths therein for supplying fluid from the fluid supply side to the device side thereof. A multi-channel manifold is attached to the fluid supply side of the ejection head substrate for providing fluid from two or more fluid reservoirs to the fluid flow paths in the ejection head substrate. The multi-channel manifold has fluid flow channels therein in fluid flow communications with the fluid flow paths in the ejection head substrate and the manifold consists essentially of a patterned photoresist material.
摘要翻译：微流体喷射装置结构，包含喷射装置结构的多流体盒，以及用于制造喷射装置结构和盒的方法。喷射装置包括具有流体供给侧和装置侧的喷射头基板，并且在其中包含用于将流体从流体供应侧供应到其装置侧的两个或更多个流体流动路径。多通道歧管连接到喷射头基板的流体供应侧，用于将流体从两个或更多个流体储存器提供到喷射头基板中的流体流动路径。多通道歧管在其中具有与喷射头基底中的流体流动通路的流体流动通道，并且歧管基本上由图案化的光致抗蚀剂材料组成。

7. 发明申请

US20060001704A1 Multi-fluid ejection device 有权
标题翻译：多流体喷射装置
公开(公告)号：US20060001704A1
公开(公告)日：2006-01-05
申请号：US10881961
申请日：2004-06-30
申请人： Frank Anderson , Jeffery Buchanan , Curtis Droege , David Greer , Kin Kwan , Gregory Long , Ganesh Phatak , Paul Spivey , Carl Sullivan , Kent Ubellacker , Melissa Waldeck
发明人： Frank Anderson , Jeffery Buchanan , Curtis Droege , David Greer , Kin Kwan , Gregory Long , Ganesh Phatak , Paul Spivey , Carl Sullivan , Kent Ubellacker , Melissa Waldeck
IPC分类号： B41J2/05
CPC分类号： B41J2/17513
摘要： A multi-fluid body and an ejection head substrate connected in fluid flow communication with the multi-fluid body for ejecting multiple fluids therefrom. The multi-fluid body includes at least two segregated fluid chambers. Independent fluid supply paths lead from each of the fluid chambers providing fluid to multiple fluid flow paths in the ejection head substrate. The ejection head substrate is attached adjacent an ejection head area of the body. The fluid flow paths in the ejection head substrate have a flow path density of greater than about one flow paths per millimeter.
摘要翻译：多流体和喷射头基板，其与多流体主体流体连通地连通，用于从其中喷射多个流体。多流体包括至少两个分离的流体室。独立的流体供应路径从每个流体室引导，以提供流体到喷射头基板中的多个流体流动路径。喷射头基板被附接在身体的喷射头部区域附近。喷射头基板中的流体流动路径具有大于每毫米约一个流动路径的流路密度。

8. 发明申请

US20050200660A1 Ink jet printer with extended nozzle plate and method 失效
标题翻译：喷墨打印机具有延长的喷嘴板和方法
公开(公告)号：US20050200660A1
公开(公告)日：2005-09-15
申请号：US10800989
申请日：2004-03-15
申请人： Jonathon Laurer , Paul Spivey , Melissa Waldeck , John Warren
发明人： Jonathon Laurer , Paul Spivey , Melissa Waldeck , John Warren
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： B41J2/1433 , B41J2/162 , B41J2/1623 , B41J2/1634 , B41J2002/14387 , B41J2002/14491
摘要： The invention provides a micro-fluid ejection head for a micro-fluid ejection device and a method for making a micro-fluid ejection head. The micro-fluid ejection head includes a semiconductor substrate containing fluid ejection devices electrically connected to contact pads on a surface thereof. A TAB circuit including lead beams is electrically connected to the contact pads on the semiconductor substrate surface. A nozzle plate structure is provided and installed relative to the TAB circuit so as to substantially cover the lead beams and contact pads in order to protect the lead beams and contact pads from exposure to fluid ejected by the micro-fluid ejection device. The micro-fluid ejection head is effective to reduce contact between electrical components and the fluid without the use of a separate encapsulant material.
摘要翻译：本发明提供了一种用于微流体喷射装置的微流体喷射头和用于制造微流体喷射头的方法。微流体喷射头包括含有与其表面上的接触焊盘电连接的流体喷射装置的半导体衬底。包括引导光束的TAB电路电连接到半导体衬底表面上的接触焊盘。提供并相对于TAB电路安装喷嘴板结构，以便基本上覆盖引导梁和接触垫，以便保护引导梁和接触垫不被暴露于由微流体喷射装置喷射的流体。微流体喷射头有效地减少电气部件和流体之间的接触，而不使用单独的密封剂材料。

9. 发明申请

US20060221119A1 Orifice plate protection device 失效
公开(公告)号：US20060221119A1
公开(公告)日：2006-10-05
申请号：US11095955
申请日：2005-03-31
申请人： Craig Bertelsen , Richard Moore , Dell Rosa , Jeffery Sangalli , Jerry Stokesbary , Melissa Waldeck
发明人： Craig Bertelsen , Richard Moore , Dell Rosa , Jeffery Sangalli , Jerry Stokesbary , Melissa Waldeck
IPC分类号： B41J2/165
CPC分类号： B41J2/17536
摘要： An orifice plate sealing tape for an orifice plate of a micro-fluid ejection device and methods for sealing an orifice plate with the sealing tape. The sealing tape includes a flexible polymeric backing film and a radiation cured adhesive applied to a surface of the orifice plate. The adhesive is cured in a pattern sufficient to seal adjacent to nozzle holes in the orifice plate and to enhance removal of the backing film and adhesive from the orifice plate prior to use of the micro-fluid ejection device. Upon removal of the sealing tape, a minimum of residue is left on the nozzle plate surface adjacent to and/or in the nozzle holes.

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