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1. 发明申请

US20060000090A1 Die attach methods and apparatus for micro-fluid ejection device 有权
标题翻译：微流体喷射装置的贴片方法和装置
公开(公告)号：US20060000090A1
公开(公告)日：2006-01-05
申请号：US10880899
申请日：2004-06-30
申请人： Mary Smoot , Paul Spivey , Melissa Waldeck , Craig Bertelsen , Sean Weaver
发明人： Mary Smoot , Paul Spivey , Melissa Waldeck , Craig Bertelsen , Sean Weaver
IPC分类号： B21D53/76
CPC分类号： B41J2/17559 , B41J2/17513 , B41J2/1752 , B41J2/17526 , B41J2/17553 , C07D235/18 , C07D401/12 , C07D403/12 , Y10S29/001 , Y10T29/4913 , Y10T29/49155 , Y10T29/49401 , Y10T29/49798 , Y10T156/1062
摘要： A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mm−1 on the micro-fluid ejection device structures or on the cartridge body. At least one of the micro-fluid ejection device structures and attached circuit is adhesively bonded to the cartridge body for flow of fluid from the containment localities to the device side thereof.
摘要翻译：提供了一种用于制造用于将多个流体保持在分离的容纳区域中的多流体盒的方法。盒体包含与容纳部位流体连通的流体供给路径。在半导体晶片上的多个限定的喷墨头基板的每一个的装置侧附着喷嘴板。每个喷射头基板具有流体供应侧和两个或更多个流体流动路径，用于将流体从供给侧提供到其装置侧。喷射头基板中的流体流动路径具有大于约1.0流动路径/毫米的流路密度。切割晶片以提供多个微流体喷射装置结构。电路装置连接到每个基板的装置侧。在微流体喷射装置结构上或筒体上的粘合线密度为至少约1.2mm -1的粘合线密度的粘合剂。微流体喷射装置结构和附接电路中的至少一个被粘合到盒主体上，用于将流体从容纳区域流动到其装置侧。

2. 发明申请

US20050073552A1 METHOD OF APPLYING AN ENCAPSULANT MATERIAL TO AN INK JET PRINTHEAD 有权
标题翻译：将喷射材料应用于喷墨打印头的方法
公开(公告)号：US20050073552A1
公开(公告)日：2005-04-07
申请号：US10679070
申请日：2003-10-02
申请人： Mary Smoot , Jeanne Singh , Paul Spivey
发明人： Mary Smoot , Jeanne Singh , Paul Spivey
IPC分类号： B41J2/16 , B41J2/175 , B41J2/14
CPC分类号： B41J2/14072 , B41J2/1603 , B41J2/1623 , B41J2/1753 , B41J2/1754
摘要： A stencil printed encapsulant material is provided for use in protecting electrical components in thermal ink jet printhead cartridges. A method of applying an encapsulant material to an ink jet print cartridge by stencil printing is also provided. The method includes providing a stencil having at least one aperture, providing an ink jet cartridge and stencil printing an encapsulant material onto a portion of the ink jet print cartridge thereby forming a layer of encapsulant material to protect electrical components or other printhead components.
摘要翻译：提供了一种模板印刷的密封剂材料，用于保护热喷墨打印头墨盒中的电气部件。还提供了通过模板印刷将密封材料施加到喷墨打印盒的方法。该方法包括提供具有至少一个孔的模板，提供喷墨墨盒和将密封材料模版印刷到喷墨打印墨盒的一部分上，从而形成密封材料层以保护电气部件或其它打印头部件。

3. 发明申请

US20060068111A1 Progressive stencil printing 有权
标题翻译：逐行模版印刷
公开(公告)号：US20060068111A1
公开(公告)日：2006-03-30
申请号：US10956938
申请日：2004-09-30
申请人： Jonathan Laurer , Jeanne Singh , Paul Spivey , Mary Smoot
发明人： Jonathan Laurer , Jeanne Singh , Paul Spivey , Mary Smoot
IPC分类号： B05D5/00
CPC分类号： B41J2/1601 , B41J2/1623 , B41M1/12 , B41M3/006 , Y10T29/49401 , Y10T156/1798
摘要： A progressive stencil printing system and method for applying encapsulant onto an inkjet printhead body is described. The system relates to a continuous stencil printing apparatus that can print encapsulant on different types of inkjet printhead bodies and clean the stencil during production.
摘要翻译：描述了将密封剂施加到喷墨打印头主体上的渐进式模板印刷系统和方法。该系统涉及一种可在不同类型的喷墨打印头主体上印刷密封剂并在生产期间清洁模板的连续模版印刷设备。

4. 发明申请

US20070229594A1 Flexible Adhesive Materials for Micro-Fluid Ejection Heads and Methods Relating Thereto 有权
标题翻译：用于微流体喷射头的柔性粘合材料及其相关方法
公开(公告)号：US20070229594A1
公开(公告)日：2007-10-04
申请号：US11556246
申请日：2006-11-03
申请人： David Graham , Brian Hart , Gary Holt , John Krawczyk , Sean Weaver , Mary Smoot
发明人： David Graham , Brian Hart , Gary Holt , John Krawczyk , Sean Weaver , Mary Smoot
IPC分类号： B41J2/16
CPC分类号： B41J2/1623 , B41J2/14024 , B41J2/14072 , B41J2/1601
摘要： Micro-fluid ejection head structures, methods of making micro-fluid ejection head structures having improved operability, and methods for improving the durability of micro-fluid ejection head structures are provided. One such micro-fluid ejection head structure includes a micro-fluid ejection head having a substrate and nozzle plate assembly adhesively attached adjacent to a substrate support using a substrate adhesive. The nozzle plate is adhesively attached adjacent to the substrate with a nozzle plate adhesive. A thermally, UV or other cure mechanism encapsulant material is attached adjacent to the ejection head and substrate support. Each of the substrate adhesive, and the encapsulant material, after curing, have a Young's modulus of less than about 2000 MPa, a shear modulus at 25° C. of less than about 15 MPa, and a glass transition temperature of less than about 90° C.
摘要翻译：提供微流体喷射头结构，制造具有改进的可操作性的微流体喷射头结构的方法，以及用于提高微流体喷射头结构的耐久性的方法。一种这样的微流体喷射头结构包括具有基板的微流体喷射头和使用基底粘合剂与基底支撑件附近粘附地附接的喷嘴板组件。喷嘴板用喷嘴板粘合剂粘附在基板附近。热，UV或其它固化机构的密封剂材料邻近喷射头和基底支撑附着。每个基底粘合剂和密封剂材料在固化后具有小于约2000MPa的杨氏模量，25℃下的剪切模量小于约15MPa，玻璃化转变温度低于约90MPa C。

5. 发明申请

US20070206067A1 Internal vent channel in ejection head assemblies and methods relating thereto 有权
标题翻译：喷射头组件中的内部排气通道和与其相关的方法
公开(公告)号：US20070206067A1
公开(公告)日：2007-09-06
申请号：US11365193
申请日：2006-03-01
申请人： Jonathan Blackburn , Edgar Diaz , Thomas Romine , Jeanne Singh , Mary Smoot , Jason Stokesbary
发明人： Jonathan Blackburn , Edgar Diaz , Thomas Romine , Jeanne Singh , Mary Smoot , Jason Stokesbary
IPC分类号： B41J2/175
CPC分类号： B41J2/1753
摘要： Fluid ejection head assemblies, fluid ejection devices, and methods for improving fluid sealing of fluid ejection head assemblies. One such fluid ejection head assembly includes a substrate cavity and a substantially planar surface surrounding the substrate cavity. The substantially planar surface contains at least one external vent, at least one internal vent channel, and a plurality of vents in fluid flow communication with the substrate cavity and providing fluid flow communication between the internal vent channel and the external vent. The plurality of vents, the at least one external vent and the at least one internal vent channel are disposed in fluid flow communication with an environment external to the substrate cavity for flow of a gas associated with an adhesive at least partially disposed in the substrate cavity, to the environment during the curing of the adhesive.
摘要翻译：流体喷射头组件，流体喷射装置和用于改善流体喷射头组件的流体密封的方法。一个这样的流体喷射头组件包括衬底空腔和围绕衬底空腔的基本平坦的表面。基本平坦的表面包含至少一个外部通气口，至少一个内部通气通道和与衬底空腔流体连通的多个通气口，并且在内部通气通道和外部通风口之间提供流体流动连通。多个通气口，至少一个外部通气口和至少一个内部通气通道设置成与衬底空腔外部的环境流体流动连通，用于与至少部分地设置在衬底空腔中的粘合剂相关联的气体流动，在粘合剂固化期间的环境。

6. 发明申请

US20060213060A1 Die attach methods and apparatus for micro-fluid ejection device 有权
公开(公告)号：US20060213060A1
公开(公告)日：2006-09-28
申请号：US11386174
申请日：2006-03-22
申请人： Mary Smoot , Paul Spivey , Melissa Waldeck , Craig Bertelsen , Sean Weaver
发明人： Mary Smoot , Paul Spivey , Melissa Waldeck , Craig Bertelsen , Sean Weaver
IPC分类号： B21D53/76 , H05K3/10
CPC分类号： B41J2/17559 , B41J2/17513 , B41J2/1752 , B41J2/17526 , B41J2/17553 , C07D235/18 , C07D401/12 , C07D403/12 , Y10S29/001 , Y10T29/4913 , Y10T29/49155 , Y10T29/49401 , Y10T29/49798 , Y10T156/1062
摘要： A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mm−1 on the micro-fluid ejection device structures or on the cartridge body. At least one of the micro-fluid ejection device structures and attached circuit is adhesively bonded to the cartridge body for flow of fluid from the containment localities to the device side thereof.

7. 发明申请

US20060001713A1 Inkjet print cartridge having an adhesive with improved dimensional control 有权
标题翻译：具有改进的尺寸控制的粘合剂的喷墨打印盒
公开(公告)号：US20060001713A1
公开(公告)日：2006-01-05
申请号：US11169905
申请日：2005-06-29
申请人： Kin Kwan , James Mrvos , Jeanne Saldanha Singh , Mary Smoot
发明人： Kin Kwan , James Mrvos , Jeanne Saldanha Singh , Mary Smoot
IPC分类号： B41J2/175
CPC分类号： B41J2/17559
摘要： A method for manufacturing an inkjet print cartridge and an inkjet cartridge produced thereby are disclosed. An inkjet print cartridge in accordance with one aspect includes a component of the inkjet print cartridge and an applied adhesive on at least a portion of the component, wherein the applied adhesive is formed from an adhesive having a rheology viscosity ratio ηi/ηmin of from 1.0 to less than 2.1. The method in accordance with one aspect includes applying an adhesive onto at least a portion of a component of an inkjet print cartridge at an application temperature, Tα, and heating the adhesive from an initial temperature, Ti, to a cure temperature for the adhesive, Tc. The adhesive has a rheology cure profile characterized by at least one of the following parameters: a) a rheology viscosity ratio ηi/ηmin of from 1.0 to less than 2.1, b) a temperature of the adhesive is approximately equal to a minimum viscosity temperature for the adhesive, Tηmin, within less than about 10 minutes from the start of the cure cycle, and c) viscosity of the adhesive increases within less than about 5 minutes from the start of the cure cycle.
摘要翻译：公开了一种用于制造由此制造的喷墨打印墨盒和喷墨墨盒的方法。根据一个方面的喷墨打印墨盒包括喷墨打印墨盒的组件和在组件的至少一部分上的涂布的粘合剂，其中涂布的粘合剂由具有流变粘度比η的粘合剂形成， / SUB> / etamin为1.0至小于2.1。根据一个方面的方法包括在施加温度Tαα下将粘合剂施加到喷墨打印盒的部件的至少一部分上，并从初始温度T 1加热粘合剂，将粘合剂的固化温度提高到粘合剂的固化温度。粘合剂具有以下参数中的至少一个特征的流变学固化分布：a）1.0至小于2.1的流变粘度比ηa / etamin，b）粘合剂的温度为大约等于从固化循环开始不到约10分钟内粘合剂T etamin N的最小粘度温度，以及c）粘合剂的粘度在小于约5分钟内增加治愈周期的开始。

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